C. Key Chung

442 total citations
22 papers, 380 citations indexed

About

C. Key Chung is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, C. Key Chung has authored 22 papers receiving a total of 380 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 6 papers in Materials Chemistry. Recurrent topics in C. Key Chung's work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (13 papers) and Intermetallics and Advanced Alloy Properties (5 papers). C. Key Chung is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (13 papers) and Intermetallics and Advanced Alloy Properties (5 papers). C. Key Chung collaborates with scholars based in Taiwan, United States and Malaysia. C. Key Chung's co-authors include C. R. Kao, Jenq‐Gong Duh, Alexandra Navrotsky, Tsung‐Lin Yang, Maik Lang, Chenlin Yang, Hongwu Xu, Eric C. O’Quinn, Anna Shelyug and Jacob Shamblin and has published in prestigious journals such as Acta Materialia, Corrosion Science and Journal of Alloys and Compounds.

In The Last Decade

C. Key Chung

21 papers receiving 371 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C. Key Chung Taiwan	11	278	177	113	46	45	22	380
V. N. Belomestnykh Russia	5	102 0.4×	76 0.4×	314 2.8×	15 0.3×	31 0.7×	13	389
Yu. I. Buyanov Russia	10	75 0.3×	174 1.0×	84 0.7×	86 1.9×	48 1.1×	41	316
Michael D. Hill United States	7	117 0.4×	23 0.1×	142 1.3×	86 1.9×	34 0.8×	14	286
Sourav Marik India	10	51 0.2×	197 1.1×	140 1.2×	94 2.0×	117 2.6×	39	383
Cyprian Mieszczyński Poland	12	74 0.3×	47 0.3×	256 2.3×	19 0.4×	63 1.4×	32	322
W. Q. Zhang China	7	80 0.3×	51 0.3×	214 1.9×	42 0.9×	63 1.4×	13	281
C. Dolin France	8	48 0.2×	153 0.9×	234 2.1×	28 0.6×	198 4.4×	21	362
Shiban Tiku United States	11	216 0.8×	52 0.3×	275 2.4×	33 0.7×	15 0.3×	29	414
M. Charleux France	9	161 0.6×	246 1.4×	329 2.9×	15 0.3×	15 0.3×	11	469

Countries citing papers authored by C. Key Chung

Since Specialization

Citations

This map shows the geographic impact of C. Key Chung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Key Chung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Key Chung more than expected).

Fields of papers citing papers by C. Key Chung

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Key Chung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Key Chung. The network helps show where C. Key Chung may publish in the future.

Co-authorship network of co-authors of C. Key Chung

This figure shows the co-authorship network connecting the top 25 collaborators of C. Key Chung. A scholar is included among the top collaborators of C. Key Chung based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Key Chung. C. Key Chung is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Chung, C. Key, Eric C. O’Quinn, Jöerg C. Neuefeind, et al.. (2019). Thermodynamic and structural evolution of mechanically milled and swift heavy ion irradiated Er2Ti2O7 pyrochlore. Acta Materialia. 181. 309–317. 20 indexed citations

Chung, C. Key, Xiaofeng Guo, Gaoxue Wang, et al.. (2019). Enthalpies of formation and phase stability relations of USi, U3Si5 and U3Si2. Journal of Nuclear Materials. 523. 101–110. 23 indexed citations

Chung, C. Key, Maik Lang, Hongwu Xu, & Alexandra Navrotsky. (2018). Thermodynamics of radiation induced amorphization and thermal annealing of Dy2Sn2O7 pyrochlore. Acta Materialia. 155. 386–392. 20 indexed citations

Chung, C. Key, Jacob Shamblin, Eric C. O’Quinn, et al.. (2017). Thermodynamic and structural evolution of Dy2Ti2O7 pyrochlore after swift heavy ion irradiation. Acta Materialia. 145. 227–234. 37 indexed citations

Chung, C. Key, et al.. (2014). Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals. Corrosion Science. 83. 419–422. 9 indexed citations

Chung, C. Key, et al.. (2014). Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow. Journal of Electronic Materials. 44(2). 744–750. 5 indexed citations

Chung, C. Key, et al.. (2014). Volume Shrinkage Induced by Interfacial Reaction in Micro-Ni/Sn/Ni Joints. Metallurgical and Materials Transactions A. 45(5). 2343–2346. 25 indexed citations

Yu, Jinran, C. Key Chung, Shi‐Yi Yang, & C. R. Kao. (2013). Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications. 73. 113–120. 1 indexed citations

Chung, C. Key, Jinran Yu, Tsung‐Lin Yang, & C. R. Kao. (2013). Grain refinement of solder materials by minor element addition. 36. 124–127. 3 indexed citations

10.

Chung, C. Key, Yi‐Jane Chen, Tsung‐Lin Yang, & C. R. Kao. (2013). Reactions of Sn-4.0Ag-0.5Cu on Cu and Electroless Ni Substrate in Premelting Soldering Process. Journal of Electronic Materials. 42(6). 1254–1259. 8 indexed citations

11.

Chung, C. Key, et al.. (2012). The critical oxide thickness for Pb-free reflow soldering on Cu substrate. Thin Solid Films. 520(16). 5346–5352. 25 indexed citations

12.

Chung, C. Key, et al.. (2012). Origin and evolution of voids in electroless Ni during soldering reaction. Acta Materialia. 60(11). 4586–4593. 33 indexed citations

13.

Chung, C. Key, et al.. (2012). Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics. Microelectronics Reliability. 53(1). 47–52. 52 indexed citations

14.

Chung, C. Key, et al.. (2012). Roles of phosphorous in Sn4Ag0.5Cu solder reaction with electrolytic Ni–Au. Journal of Alloys and Compounds. 539. 57–62. 9 indexed citations

15.

Yang, Tsung‐Lin, et al.. (2011). The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction. Scripta Materialia. 65(4). 331–334. 32 indexed citations

16.

Chuang, H. Y., et al.. (2010). Oxidation behavior of ENIG and ENEPIG surface finish. 504. 1–4. 8 indexed citations

17.

Chung, C. Key, Jenq‐Gong Duh, & C. R. Kao. (2010). Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction. Scripta Materialia. 63(2). 258–260. 47 indexed citations

18.

Chung, C. Key, et al.. (2003). An assessment of lead free solder (Sn3.7Ag0.8Cu) wettability. 26. 1–5. 7 indexed citations

19.

Chung, C. Key, et al.. (2003). The interactions of lead (Pb) in lead free solder (Sn/Ag/Cu) system. 11. 168–175. 13 indexed citations

20.

Tjong, S. C. & C. Key Chung. (1993). SEM and EDX analyses of the scales formed on Fe—24Cr—5V—Pd and Fe—24Cr—5Mo—Pd alloy systems. X-Ray Spectrometry. 22(3). 172–177. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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