P. Šebo

603 total citations
23 papers, 505 citations indexed

About

P. Šebo is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and General Materials Science. According to data from OpenAlex, P. Šebo has authored 23 papers receiving a total of 505 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Mechanical Engineering, 11 papers in Electrical and Electronic Engineering and 6 papers in General Materials Science. Recurrent topics in P. Šebo's work include Electronic Packaging and Soldering Technologies (11 papers), Aluminum Alloys Composites Properties (8 papers) and Intermetallics and Advanced Alloy Properties (7 papers). P. Šebo is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Aluminum Alloys Composites Properties (8 papers) and Intermetallics and Advanced Alloy Properties (7 papers). P. Šebo collaborates with scholars based in Slovakia, Austria and Ukraine. P. Šebo's co-authors include P. Švec, D. Janičkovič, G. Korb, Roman Koleňák, Yu. Plevachuk, P. Duhaj, Z. Moser, W. Gąsior, J. Pstruś and A. Yakymovych and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Journal of Alloys and Compounds.

In The Last Decade

P. Šebo

23 papers receiving 482 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
P. Šebo Slovakia	14	393	255	150	107	59	23	505
Weimin Long China	12	437 1.1×	487 1.9×	34 0.2×	101 0.9×	42 0.7×	32	635
Biljana Dimčić Serbia	11	228 0.6×	175 0.7×	44 0.3×	91 0.9×	24 0.4×	22	380
Gaohui Wu China	13	418 1.1×	72 0.3×	193 1.3×	202 1.9×	39 0.7×	30	483
Li Nan An United States	6	296 0.8×	136 0.5×	228 1.5×	185 1.7×	39 0.7×	15	506
Xiaoyang Bi China	10	319 0.8×	199 0.8×	36 0.2×	89 0.8×	151 2.6×	18	468
B. Mikułowski Poland	10	258 0.7×	49 0.2×	93 0.6×	206 1.9×	71 1.2×	37	356
Yongtao Jiu China	11	252 0.6×	145 0.6×	34 0.2×	130 1.2×	30 0.5×	31	349
Jin Ba China	14	360 0.9×	56 0.2×	321 2.1×	142 1.3×	62 1.1×	23	462
Chenglai Xin China	11	248 0.6×	47 0.2×	139 0.9×	91 0.9×	32 0.5×	17	317
T. Pieczonka Poland	13	370 0.9×	41 0.2×	96 0.6×	166 1.6×	78 1.3×	40	415

Countries citing papers authored by P. Šebo

Since Specialization

Citations

This map shows the geographic impact of P. Šebo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. Šebo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. Šebo more than expected).

Fields of papers citing papers by P. Šebo

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by P. Šebo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. Šebo. The network helps show where P. Šebo may publish in the future.

Co-authorship network of co-authors of P. Šebo

This figure shows the co-authorship network connecting the top 25 collaborators of P. Šebo. A scholar is included among the top collaborators of P. Šebo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with P. Šebo. P. Šebo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Yakymovych, A., Yu. Plevachuk, P. Švec, et al.. (2017). Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles. Journal of Materials Science Materials in Electronics. 28(15). 10965–10973. 29 indexed citations

Koleňák, Roman, et al.. (2016). Wettability of Selected Lead-Free Solders for Higher Application Temperatures. Key engineering materials. 705. 190–195. 1 indexed citations

Yakymovych, A., Yu. Plevachuk, P. Švec, et al.. (2016). Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles. Journal of Electronic Materials. 45(12). 6143–6149. 40 indexed citations

Šebo, P., P. Švec, D. Janičkovič, et al.. (2013). The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints. Materials Science and Engineering A. 571. 184–192. 21 indexed citations

Koleňák, Roman, et al.. (2011). Wettability and shear strength of active Sn2Ti solder on Al₂O₃ ceramics. Soldering and Surface Mount Technology. 23(4). 224–228. 15 indexed citations

Šebo, P., P. Švec, D. Janičkovič, E. Illeková, & Yu. Plevachuk. (2011). Interface between Sn–Sb–Cu solder and copper substrate. Materials Science and Engineering A. 528(18). 5955–5960. 13 indexed citations

Koleňák, Roman, et al.. (2011). Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics. Materials & Design (1980-2015). 32(7). 3997–4003. 72 indexed citations

Šebo, P., P. Švec, D. Janičkovič, & E. Illeková. (2010). Influence of Sb and Cu in Sn-Sb-Cu alloys on wetting of Cu and Cu-solder-Cu joint strength. Kovove Materialy-Metallic Materials. 48(6). 353–359. 4 indexed citations

Moser, Z., P. Šebo, W. Gąsior, P. Švec, & J. Pstruś. (2008). Effect of indium on wettability of Sn–Ag–Cu solders. Experiment vs. modeling, Part I. Calphad. 33(1). 63–68. 26 indexed citations

10.

Šebo, P., et al.. (2007). Influence of thermal cycling on shear strength of Cu–Sn3.5AgIn–Cu joints with various content of indium. Journal of Alloys and Compounds. 463(1-2). 168–172. 11 indexed citations

11.

Šebo, P., et al.. (2002). Thermal conductivity of unidirectional copper matrix carbon fibre composites. Composites Part A Applied Science and Manufacturing. 33(4). 577–581. 84 indexed citations

12.

Korb, G., et al.. (2002). Thermal expansion and thermal conductivity of continuous carbon fibre reinforced copper matrix composites. 104–108. 3 indexed citations

13.

Šebo, P., et al.. (2002). Thermal expansion of cross-ply and woven carbon fibre–copper matrix composites. Composites Part A Applied Science and Manufacturing. 33(1). 133–136. 20 indexed citations

14.

Janičkovič, D., P. Šebo, P. Duhaj, & P. Švec. (2001). The rapidly quenched Ag-Cu-Ti ribbons for active joining of ceramics. Materials Science and Engineering A. 304-306. 569–573. 38 indexed citations

15.

Šebo, P., et al.. (2001). Galvanic deposition of Co–Mo layers and their influence on tensile strength of carbon fibers. Journal of Materials Science Letters. 20(16). 1477–1478. 1 indexed citations

16.

Duhaj, P., P. Šebo, P. Švec, & D. Janičkovič. (1999). Development and characterisation of Ag–Cu–Ti brazes prepared with planar flow casting. Materials Science and Engineering A. 271(1-2). 181–187. 13 indexed citations

17.

Korb, G., et al.. (1997). Thermal expansion of copper matrix composite with spiral arrangement of carbon fibres. Journal of Materials Science Letters. 16(5). 392–394. 2 indexed citations

18.

Šebo, P., et al.. (1996). Short aluminosilicate fibre reinforced aluminium. Journal of Materials Science. 31(3). 757–764. 7 indexed citations

19.

Šebo, P., et al.. (1993). Thermal stability of copper coating on carbon fibres. Journal of Materials Science Letters. 12(14). 1083–1085. 26 indexed citations

20.

Šebo, P., et al.. (1964). On the configuration of Guinier-Preston zones in Al-Ag and Al-Zn alloys. Czechoslovak Journal of Physics. 14(8). 622–628. 17 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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