H. Schellevis

1.1k citations

63 papers · 877 indexed · h-index 17

Impact in

Electrical and Electronic Engineering top 10%
- Advancements in Semiconductor Devices and Circuit Design
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Radio Frequency Integrated Circuit Design
- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
Materials Chemistry
- Thermal properties of materials

Papers in

Electrical and Electronic Engineering 50
- 3D IC and TSV technologies 15
- Thin-Film Transistor Technologies 11
- Semiconductor materials and devices 10
- Radio Frequency Integrated Circuit Design 9
- Advancements in Semiconductor Devices and Circuit Design 9
Atomic and Molecular Physics, and Optics 19
- Semiconductor materials and interfaces 8
- Mechanical and Optical Resonators 8

Co-authors: Lis K. Nanver P.M. Sarro N. Nenadović J.W. Slotboom Ryoichi Ishihara Vincenzo d’Alessandro L. La Spina Freek Kapteijn
Journals: IEEE Electron Device Letters (3 papers)IEEE Journal of Solid-State Circuits (2 papers)Sensors and Actuators A Physical (2 papers)IEEE Microwave and Wireless Components Letters (2 papers)IEEE Transactions on Electron Devices (2 papers)
Partner nations: Netherlands United States Italy

In The Last Decade

H. Schellevis

58 papers receiving 816 citations

Peers

Countries citing papers authored by H. Schellevis

Since Specialization

Citations

This map shows the geographic impact of H. Schellevis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Schellevis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Schellevis more than expected).

Fields of papers citing papers by H. Schellevis

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Schellevis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Schellevis. The network helps show where H. Schellevis may publish in the future.

Co-authors

The 25 scholars most cited alongside H. Schellevis, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with H. Schellevis Line = papers co-authored together H. Schellevis links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Shear mode resonators based on aluminum nitride round membranes with a ring-shaped electrode Sudheer Vinnakoti, T.S.Y. Moh, G. Pandraud, H. Schellevis, A. Akhnoukh, P.M. Sarro	2013	0
2	Slender piezoelectric cantilevers of high quality AlN layers sputtered on Ti thin film for MEMS actuators Sensors and Actuators A Physical ·Sudheer Vinnakoti, O. Wunnicke, G. Pandraud, Minh D. Nguyen, H. Schellevis, P.M. Sarro	2013	20
3	Contact resistance of low-temperature carbon nanotube vertical interconnects \| NIST IEEE Transactions on Nanotechnology ·Miller Pereira Palão, Sten Vollebregt, Ryo Ishihara, H. Schellevis, Kees Beenakker	2012	1
4	Process for low temperature deposition of strain gauge materials based on Chromium nitride thin films Chen Hong-tin, P.M. Sarro, H. Schellevis, Yaqi Hou	2011	3
5	Sputtered molybdenum as conductive material for high-temperature microhotplates L. Mele, F. Santagata, E. Iervolino, M. Mihailovic, Tommaso Rossi, Sudheer Vinnakoti, H. Schellevis, J.F. Creemer, P.M. Sarro	2011	4
6	Influence of seed layer on crystallinity and orientation of pulsed — DC sputtered AlN thin-films for piezoelectric actuators Procedia Engineering ·Sudheer Vinnakoti, H. Schellevis, H.T.M. Pham, Irene Wu, P.M. Sarro	2010	9
7	Aluminum-nitride thin-film heatspreaders integrated in bipolar transistors L. La Spina, 秀治林, Vincenzo d’Alessandro, H. Schellevis, Lis K. Nanver	2008	5
8	Magnetic-Multilayered Interconnects Featuring Skin Effect Suppression IEEE Electron Device Letters ·Yan Zhuang, B. Rejaei, H. Schellevis, M. Vroubel, Joachim N. Burghartz	2008	27
9	Special RF/microwave devices in Silicon-on-Glass Technology Lis K. Nanver, H. Schellevis, T.L.M. Scholtes, L. La Spina, B. (Bulahepshiba) Alexander, Francesco Sarubbi, امین مسلمی, Alessandra Isis Alves Pinheiro Ramos, Koen Buisman, L.C.N. de Vreede, Ю.А. Ларіна, Наталия Алексеевна Феденко, Zane J. Moore	2008	6
10	Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology Lis K. Nanver, امین مسلمی, Yann Civale, T.L.M. Scholtes, L. La Spina, H. Schellevis, B. (Bulahepshiba) Alexander, Francesco Sarubbi, Alessandra Isis Alves Pinheiro Ramos, Koen Buisman, Наталия Алексеевна Феденко, Zane J. Moore	2008	3
11	New Front To Back-side 3D Interconnects Based High Aspect Ratio Through Silicon Vias Mohamed Saadaoui, 真也上田, Henk van Zeijl, H. Schellevis, О. О. Ільченко, P.M. Sarro	2008	7
12	Bulk-Micromachined Test Structure for Fast and Reliable Determination of the Lateral Thermal Conductivity of Thin Films Journal of Microelectromechanical Systems ·L. La Spina, A.W. van Herwaarden, H. Schellevis, 真也上田, N. Nenadović, Lis K. Nanver	2007	22
13	Silicon-on-glass technology for RF and microwave device fabrication Lis K. Nanver, H. Schellevis, T.L.M. Scholtes, L. La Spina, B. (Bulahepshiba) Alexander, Francesco Sarubbi, امین مسلمی, Alessandra Isis Alves Pinheiro Ramos, Koen Buisman, L.C.N. de Vreede, Ю.А. Ларіна, Наталия Алексеевна Феденко, Zane J. Moore	2006	5
14	MEMS test structure for measuring thermal conductivity of thin films L. La Spina, N. Nenadović, A.W. van Herwaarden, H. Schellevis, 真也上田, Lis K. Nanver	2006	8
15	A Back-Wafer Contacted Silicon-On-Glass Integrated Bipolar Process—Part I: The Conflict Electrical Versus Thermal Isolation IEEE Transactions on Electron Devices ·Lis K. Nanver, N. Nenadović, Vincenzo d’Alessandro, H. Schellevis, Maxence Gouleau, Rommert Dekker, A. M. Jaglom, V. Zieren, J.W. Slotboom	2004	59
16	Saddle add-on metallisation (SAM) for RF inductor implementation in standard IC interconnects B. Rejaei, Joachim N. Burghartz, H. Schellevis	2003	4
17	Ultra-low-temperature low-ohmic contacts for SOA applications Lis K. Nanver, H.W. van Zeijl, H. Schellevis, Rainer Mallée, John Slabbekoorn, Rommert Dekker, J.W. Slotboom	2003	12
18	Sensitive measurement method for evaluation of high thermal resistance in bipolar transistors N. Nenadović, Lis K. Nanver, H. Schellevis, Naseem G Farzana, V. Zieren, J.W. Slotboom	2003	1
19	Analytical formulation and electrical measurements of self-heating in silicon BJT's N. Nenadović, Vincenzo d’Alessandro, А.Д. Фаттахов, N. Rinaldi, H. Schellevis, J.W. Slotboom	2003	8
20	Stability of Oriented Silicalite-1 Films in View of Zeolite Membrane Preparation Zeolites ·M.J. den Exter, H. van Bekkum, C.J.M. van Rijn, Freek Kapteijn, Jacob A. Moulijn, H. Schellevis, G. V. Wise	1997	96

About H. Schellevis

H. Schellevis is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Condensed Matter Physics, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 63 papers that have together received 877 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (15 papers), Acoustic Wave Resonator Technologies (12 papers), Thin-Film Transistor Technologies (11 papers), Semiconductor materials and devices (10 papers), Radio Frequency Integrated Circuit Design (9 papers), Advancements in Semiconductor Devices and Circuit Design (9 papers), Semiconductor materials and interfaces (8 papers) and Mechanical and Optical Resonators (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (623 citations), Materials Chemistry (277 citations), Bioengineering (33 citations), Biomedical Engineering (256 citations) and Inorganic Chemistry (79 citations). H. Schellevis has collaborated with scholars based in Netherlands, United States and Italy. Frequent co-authors include Lis K. Nanver, P.M. Sarro, N. Nenadović, J.W. Slotboom, Ryoichi Ishihara, Vincenzo d’Alessandro, L. La Spina, Freek Kapteijn, Jacob A. Moulijn and C.J.M. van Rijn. Their work appears in journals such as IEEE Electron Device Letters, IEEE Journal of Solid-State Circuits, Sensors and Actuators A Physical, IEEE Microwave and Wireless Components Letters and IEEE Transactions on Electron Devices.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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