F.G. Kuper

1.1k total citations
79 papers, 840 citations indexed

About

F.G. Kuper is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, F.G. Kuper has authored 79 papers receiving a total of 840 indexed citations (citations by other indexed papers that have themselves been cited), including 75 papers in Electrical and Electronic Engineering, 12 papers in Electronic, Optical and Magnetic Materials and 9 papers in Mechanics of Materials. Recurrent topics in F.G. Kuper's work include Semiconductor materials and devices (51 papers), Integrated Circuits and Semiconductor Failure Analysis (29 papers) and Electrostatic Discharge in Electronics (27 papers). F.G. Kuper is often cited by papers focused on Semiconductor materials and devices (51 papers), Integrated Circuits and Semiconductor Failure Analysis (29 papers) and Electrostatic Discharge in Electronics (27 papers). F.G. Kuper collaborates with scholars based in Netherlands, United States and Germany. F.G. Kuper's co-authors include Guido Notermans, Cora Salm, A. Amerasekera, L. van Roozendaal, A. Scarpa, Jurriaan Schmitz, Nguyễn Văn Hiếu, Peter J. de Jong, Gang Tao and K. Verhaege and has published in prestigious journals such as Applied Physics Letters, IEEE Transactions on Electron Devices and Thin Solid Films.

In The Last Decade

F.G. Kuper

72 papers receiving 755 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
F.G. Kuper Netherlands 16 782 72 68 38 37 79 840
B.E. Stine United States 12 474 0.6× 208 2.9× 41 0.6× 28 0.7× 54 1.5× 23 567
P. McLaughlin United States 13 391 0.5× 22 0.3× 295 4.3× 27 0.7× 11 0.3× 31 496
Ming‐Hsien Lin Taiwan 11 307 0.4× 12 0.2× 200 2.9× 28 0.7× 7 0.2× 35 369
O.S. Nakagawa United States 12 410 0.5× 95 1.3× 25 0.4× 33 0.9× 17 0.5× 36 484
Mireille Maenhoudt Belgium 12 419 0.5× 45 0.6× 61 0.9× 18 0.5× 18 0.5× 47 457
Chang-Chi Lee Taiwan 10 311 0.4× 35 0.5× 10 0.1× 21 0.6× 11 0.3× 28 370
Mircea Dusa Netherlands 14 635 0.8× 77 1.1× 31 0.5× 8 0.2× 48 1.3× 109 710
Swapan K. Bhattacharya United States 11 285 0.4× 84 1.2× 14 0.2× 22 0.6× 4 0.1× 40 360
Dimitrios Velenis Belgium 15 789 1.0× 121 1.7× 90 1.3× 15 0.4× 20 0.5× 86 836
В.А. Ващенко United States 15 864 1.1× 20 0.3× 4 0.1× 5 0.1× 4 0.1× 100 908

Countries citing papers authored by F.G. Kuper

Since Specialization
Citations

This map shows the geographic impact of F.G. Kuper's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F.G. Kuper with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F.G. Kuper more than expected).

Fields of papers citing papers by F.G. Kuper

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by F.G. Kuper. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F.G. Kuper. The network helps show where F.G. Kuper may publish in the future.

Co-authorship network of co-authors of F.G. Kuper

This figure shows the co-authorship network connecting the top 25 collaborators of F.G. Kuper. A scholar is included among the top collaborators of F.G. Kuper based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with F.G. Kuper. F.G. Kuper is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Yuan, et al.. (2010). Assessing the degradation mechanisms and current limitation design rules of SiCr-based thin-film resistors in integrated circuits. University of Twente Research Information. 724–730. 6 indexed citations
2.
Knotter, D. Martin, et al.. (2008). Impact of nano particles on semiconductor manufacturing. University of Twente Research Information. 10. 97–99. 2 indexed citations
3.
Knotter, D. Martin, et al.. (2008). Impact of particles in ultra pure water on random yield loss in IC production. Microelectronic Engineering. 86(2). 140–144. 4 indexed citations
4.
Açar, Mustafa, et al.. (2008). RF CMOS reliability simulations. Microelectronics Reliability. 48(8-9). 1581–1585. 11 indexed citations
5.
Jong, P.C. de, et al.. (2005). Significance of including substrate capacitance in the full chip circuit model of ICs under CDM stress. University of Twente Research Information. 608–609. 1 indexed citations
6.
Scarpa, A., et al.. (2005). Strategies to cope with plasma charging damage in design and layout phases. University of Twente Research Information. 91–98. 7 indexed citations
7.
Salm, Cora, et al.. (2004). Full chip model of CMOS Integrated Circuits under Charged Device Model stress. University of Twente Research Information. 801–807. 2 indexed citations
8.
Smedes, Theo, et al.. (2003). Study on the influence of package parasitics and substrate resistance on the Charged Device Model(CDM) failure levels - possible protection methodology. University of Twente Research Information. 657–662. 1 indexed citations
9.
Smedes, Theo, et al.. (2003). Role of package parasitics and substrate resistance on the Charged Device Model (CDM) failure levels –An explanation and die protection strategy. Microelectronics Reliability. 43(9-11). 1569–1575. 8 indexed citations
12.
Kuper, F.G., et al.. (2002). Analysis of the electrical breakdown in hydrogenated amorphous silicon thin-film transistors. IEEE Transactions on Electron Devices. 49(6). 1012–1018. 17 indexed citations
13.
Hiếu, Nguyễn Văn, et al.. (2002). Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime. Microelectronics Reliability. 42(9-11). 1421–1425. 13 indexed citations
14.
Notermans, Guido, Peter J. de Jong, & F.G. Kuper. (2002). Pitfalls when correlating TLP, HBM and MM testing. 170–176. 35 indexed citations
15.
Boselli, Gianluca, et al.. (2001). Modeling substrate diodes under ultra high ESD injection conditions. Electrical Overstress/Electrostatic Discharge Symposium. 70–80. 6 indexed citations
16.
Boselli, Gianluca, et al.. (2000). Rise-time effects in grounded gate nMOS transistors under transmission line pulse stress. Microelectronics Reliability. 40(12). 2061–2067. 4 indexed citations
17.
Kuper, F.G., et al.. (1999). Electrostatic Discharge Induced Degradation in Top Gate Amorphous Silicon Thin Film Transistors. Data Archiving and Networked Services (DANS). 515–520. 1 indexed citations
18.
Notermans, Guido, et al.. (1997). Using an SCR as ESD protection without latch-up danger. Microelectronics Reliability. 37(10-11). 1457–1460. 39 indexed citations
19.
Verhaege, K., et al.. (1995). Fast transient ESD simulation of the NMOS protection transistor. University of Twente Research Information. 307–310. 10 indexed citations
20.
Kuper, F.G., et al.. (1981). On-Site Precast Concrete Frame andPanel System for Multistory Buildings. ACI Concrete International. 3(12). 38–42. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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