David L. Rath
Impact in
- Electrochemistry top 5%
- Electrochemical Analysis and Applications
- Surfaces, Coatings and Films top 5%
- Electron and X-Ray Spectroscopy Techniques
Papers in
-
- Copper Interconnects and Reliability 10
-
- Semiconductor materials and devices 11
- Electronic Packaging and Soldering Technologies 5
- 3D IC and TSV technologies 3
- Electrodeposition and Electroless Coatings 3
- Co-authors
- D.M. Kolb (4 shared papers)Wilford Nels. Hansen (3 shared papers)R.A. Wille (2 shared papers)Peter Kolb et al. (1 shared paper)Eric G. Liniger (3 shared papers)Steffen K. Kaldor (3 shared papers)Andrew H. Simon (3 shared papers)Wei‐Tsu Tseng (3 shared papers)
- Journals
- Surface Science (4 papers)Thin Solid Films (2 papers)IBM Journal of Research and Development (1 paper)Applied Physics Letters (1 paper)Journal of Applied Physics (1 paper)
- Partner nations
- United StatesGermany
In The Last Decade
David L. Rath
26 papers receiving 592 citations
Peers
Comparison fields: 5 of 44
- Electrochemistry 196
- Surfaces, Coatings and Films 92
- Electronic, Optical and Magnetic Materials 204
- Bioengineering 57
- Electrical and Electronic Engineering 398
Countries citing papers authored by David L. Rath
This map shows the geographic impact of David L. Rath's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David L. Rath with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David L. Rath more than expected).
Fields of papers citing papers by David L. Rath
This network shows the impact of papers produced by David L. Rath. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David L. Rath. The network helps show where David L. Rath may publish in the future.
Co-authors
The 25 scholars most cited alongside David L. Rath, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1983 | 99 | |
| 2 | 2003 | 95 | |
| 3 | 1981 | 75 | |
| 4 | 1980 | 61 | |
| 5 | 2004 | 45 | |
| 6 | 1984 | 36 | |
| 7 | 1980 | 30 | |
| 8 | 2005 | 28 | |
| 9 | 1983 | 25 | |
| 10 | 2001 | 24 | |
| 11 | 1984 | 21 | |
| 12 | 2017 | 16 | |
| 13 | 1988 | 12 | |
| 14 | 1981 | 9 | |
| 15 | 1988 | 9 | |
| 16 | 2005 | 8 | |
| 17 | Improved manufacturability of Cu bond pads and implementation of seal design in 3D integrated circuits and packages | 2006 | 8 |
| 18 | 2001 | 6 | |
| 19 | 2012 | 3 | |
| 20 | 2014 | 3 |
About David L. Rath
David L. Rath is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Surfaces, Coatings and Films, Materials Chemistry and Electrochemistry, having authored 26 papers that have together received 622 indexed citations. Recurring topics across this work include Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (10 papers), Electron and X-Ray Spectroscopy Techniques (5 papers), Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (3 papers), Electrodeposition and Electroless Coatings (3 papers), Corrosion Behavior and Inhibition (3 papers) and Surface and Thin Film Phenomena (2 papers). The work is most often cited by research in Electrochemistry (196 citations), Surfaces, Coatings and Films (92 citations), Electronic, Optical and Magnetic Materials (204 citations), Bioengineering (57 citations) and Electrical and Electronic Engineering (398 citations). David L. Rath has collaborated with scholars based in United States and Germany. Frequent co-authors include D.M. Kolb, Wilford Nels. Hansen, R.A. Wille, Peter Kolb et al., Eric G. Liniger, Steffen K. Kaldor, Andrew H. Simon, Wei‐Tsu Tseng, L. M. Gignac and C.‐K. Hu. Their work appears in journals such as Surface Science, Thin Solid Films, IBM Journal of Research and Development, Applied Physics Letters and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.