Jian-Qiang Lü

1.0k total citations
47 papers, 729 citations indexed

About

Jian-Qiang Lü is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Jian-Qiang Lü has authored 47 papers receiving a total of 729 indexed citations (citations by other indexed papers that have themselves been cited), including 37 papers in Electrical and Electronic Engineering, 10 papers in Biomedical Engineering and 9 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Jian-Qiang Lü's work include 3D IC and TSV technologies (24 papers), Electronic Packaging and Soldering Technologies (17 papers) and Semiconductor Quantum Structures and Devices (8 papers). Jian-Qiang Lü is often cited by papers focused on 3D IC and TSV technologies (24 papers), Electronic Packaging and Soldering Technologies (17 papers) and Semiconductor Quantum Structures and Devices (8 papers). Jian-Qiang Lü collaborates with scholars based in United States, China and Taiwan. Jian-Qiang Lü's co-authors include M. S. Shur, Zheng Xu, R.J. Gutmann, Yanqing Deng, Cameron Saylor, W. Knap, Sergey Rumyantsev, L. C. Brunel, Kenneth Rose and Robert M. Weikle and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and The FASEB Journal.

In The Last Decade

Jian-Qiang Lü

43 papers receiving 701 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jian-Qiang Lü United States 13 639 217 133 101 75 47 729
Ahmet Çağrı Ulusoy Germany 22 1.7k 2.7× 150 0.7× 84 0.6× 228 2.3× 17 0.2× 156 1.8k
Qun Jane Gu United States 24 1.8k 2.9× 170 0.8× 109 0.8× 216 2.1× 5 0.1× 164 1.9k
B.G. Rax United States 17 1.0k 1.6× 51 0.2× 15 0.1× 55 0.5× 61 0.8× 64 1.1k
Leif Scheick United States 18 813 1.3× 34 0.2× 32 0.2× 22 0.2× 17 0.2× 80 889
Hirokazu Masui Japan 11 297 0.5× 62 0.3× 100 0.8× 17 0.2× 28 0.4× 74 452
Bin Wei China 18 963 1.5× 172 0.8× 68 0.5× 212 2.1× 35 0.5× 140 1.1k
Martin Mundt Germany 7 378 0.6× 149 0.7× 215 1.6× 39 0.4× 7 0.1× 13 467
A. Ege Engin United States 16 979 1.5× 39 0.2× 135 1.0× 40 0.4× 10 0.1× 75 1.0k
Qiang Fu China 17 574 0.9× 418 1.9× 15 0.1× 51 0.5× 20 0.3× 114 722
Ya Zhang Japan 12 310 0.5× 164 0.8× 61 0.5× 99 1.0× 3 0.0× 49 445

Countries citing papers authored by Jian-Qiang Lü

Since Specialization
Citations

This map shows the geographic impact of Jian-Qiang Lü's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jian-Qiang Lü with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jian-Qiang Lü more than expected).

Fields of papers citing papers by Jian-Qiang Lü

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jian-Qiang Lü. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jian-Qiang Lü. The network helps show where Jian-Qiang Lü may publish in the future.

Co-authorship network of co-authors of Jian-Qiang Lü

This figure shows the co-authorship network connecting the top 25 collaborators of Jian-Qiang Lü. A scholar is included among the top collaborators of Jian-Qiang Lü based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jian-Qiang Lü. Jian-Qiang Lü is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Huang, Yi, et al.. (2022). Global trends and hot topics in electrical stimulation of skeletal muscle research over the past decade: A bibliometric analysis. Frontiers in Neurology. 13. 991099–991099. 2 indexed citations
2.
Xie, Xiangpeng, Jian-Qiang Lü, Dong Yue, & Da‐Wei Ding. (2021). Enhanced Fuzzy Fault Estimation of Discrete-Time Nonlinear Systems via a New Real-Time Gain-Scheduling Mechanism. IEEE Transactions on Cybernetics. 53(3). 1607–1617. 12 indexed citations
3.
Xie, Xiangpeng, Jian-Qiang Lü, & Dong Yue. (2021). Resilient stabilization of discrete-time Takagi-Sugeno fuzzy systems: Dynamic trade-off between conservatism and complexity. Information Sciences. 582. 181–197. 18 indexed citations
4.
Xie, Xiangpeng, et al.. (2021). Quantitative assessment method of power grid disaster response capability based on fuzzy comprehensive evaluation and comprehensive weight1. IOP Conference Series Earth and Environmental Science. 675(1). 12035–12035. 1 indexed citations
5.
Yang, Pengfei, et al.. (2019). State evaluation of relay protection system for state maintenance. IOP Conference Series Earth and Environmental Science. 354(1). 12120–12120. 1 indexed citations
6.
He, Huanyu, Xiaoxiong Gu, & Jian-Qiang Lü. (2014). Modeling of switching noise and coupling in multiple chips of 3D TSV-based systems. 548–553. 4 indexed citations
7.
Xu, Zheng & Jian-Qiang Lü. (2012). Three-Dimensional Coaxial Through-Silicon-Via (TSV) Design. IEEE Electron Device Letters. 33(10). 1441–1443. 73 indexed citations
8.
Chen, Kuan‐Neng, et al.. (2011). Fabrication of Nano-Scale Cu Bond Pads with Seal Design in 3D Integration Applications. Journal of Nanoscience and Nanotechnology. 11(4). 3336–3339. 1 indexed citations
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Lü, Jian-Qiang, et al.. (2007). Thermally induced stresses in 3D-IC inter-wafer interconnects: A combined grain-continuum and continuum approach. Microelectronic Engineering. 84(11). 2750–2756. 6 indexed citations
12.
Niklaus, Frank, J. J. McMahon, Jian Yu, et al.. (2006). Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs. MRS Proceedings. 914. 12 indexed citations
13.
Gutmann, R.J., et al.. (2005). Wafer-Level Via-First 3D Integration With Hybrid-Bonding Of Cu/BCB Redistribution Layers. 2(1). 122–127. 4 indexed citations
14.
Hella, Mona M., et al.. (2005). Die-on-wafer and wafer-level 3D integration for millimeter-wave smart antenna transceivers. pv 2003 13. 125–128. 2 indexed citations
15.
Wimplinger, Markus, Jian-Qiang Lü, Jian Yu, et al.. (2004). Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy. MRS Proceedings. 812. 7 indexed citations
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Lü, Jian-Qiang, Yongchai Kwon, G. Rajagopalan, et al.. (2003). A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects. 89. 78–80. 19 indexed citations
18.
Gutmann, R.J., Jian-Qiang Lü, Yongchai Kwon, J. F. McDonald, & T.S. Cale. (2002). Three-dimensional (3D) ICs: a technology platform for integrated systems and opportunities for new polymeric adhesives. 173–180. 25 indexed citations
19.
Lü, Jian-Qiang, et al.. (2002). A resonant terahertz detector utilizing a high electron mobility transistor. 32. 453–456. 11 indexed citations
20.
Lü, Jian-Qiang & M. S. Shur. (2001). Terahertz Detection by High Electron Mobility Transistor: Effect of Drain Current. 103. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026