Ji Fan

1.7k total citations
91 papers, 1.2k citations indexed

About

Ji Fan is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Ocean Engineering. According to data from OpenAlex, Ji Fan has authored 91 papers receiving a total of 1.2k indexed citations (citations by other indexed papers that have themselves been cited), including 61 papers in Electrical and Electronic Engineering, 17 papers in Biomedical Engineering and 15 papers in Ocean Engineering. Recurrent topics in Ji Fan's work include 3D IC and TSV technologies (23 papers), Advanced MEMS and NEMS Technologies (20 papers) and Electronic Packaging and Soldering Technologies (16 papers). Ji Fan is often cited by papers focused on 3D IC and TSV technologies (23 papers), Advanced MEMS and NEMS Technologies (20 papers) and Electronic Packaging and Soldering Technologies (16 papers). Ji Fan collaborates with scholars based in China, Singapore and Finland. Ji Fan's co-authors include Liangcheng Tu, Chuan Seng Tan, Zuqing Zhu, Xiaoliang Chen, Wenjie Wu, Huafeng Liu, D. F. Lim, Jinquan Liu, Lan Peng and Chenyuan Hu and has published in prestigious journals such as Chemical Engineering Journal, Optics Letters and Energy.

In The Last Decade

Ji Fan

88 papers receiving 1.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ji Fan China 20 870 209 167 160 125 91 1.2k
Luca Schenato Italy 21 820 0.9× 205 1.0× 83 0.5× 88 0.6× 98 0.8× 119 1.4k
Shaohua Gao China 19 471 0.5× 211 1.0× 47 0.3× 177 1.1× 105 0.8× 88 1.5k
Honghui Wang China 18 348 0.4× 193 0.9× 35 0.2× 83 0.5× 84 0.7× 84 1.1k
Tong Hao China 19 269 0.3× 69 0.3× 180 1.1× 226 1.4× 34 0.3× 80 924
Kaushik Das United States 16 284 0.3× 265 1.3× 129 0.8× 172 1.1× 157 1.3× 78 978
Rong Liu China 19 346 0.4× 59 0.3× 49 0.3× 89 0.6× 108 0.9× 116 1.0k
Jin Zhang China 23 531 0.6× 80 0.4× 21 0.1× 491 3.1× 315 2.5× 128 1.8k
Chong Zhao China 18 217 0.2× 95 0.5× 45 0.3× 70 0.4× 100 0.8× 77 824

Countries citing papers authored by Ji Fan

Since Specialization
Citations

This map shows the geographic impact of Ji Fan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ji Fan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ji Fan more than expected).

Fields of papers citing papers by Ji Fan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ji Fan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ji Fan. The network helps show where Ji Fan may publish in the future.

Co-authorship network of co-authors of Ji Fan

This figure shows the co-authorship network connecting the top 25 collaborators of Ji Fan. A scholar is included among the top collaborators of Ji Fan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ji Fan. Ji Fan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Ruobing, et al.. (2025). Manganese Hexacyanoferrate/Polyaniline Composite Electrode with High Cycling Stability for Antifreezing Supercapacitors. ACS Applied Polymer Materials. 7(4). 2459–2469. 1 indexed citations
2.
Yu, Xiaobing, Ji Fan, Chenyuan Hu, et al.. (2025). Research on Compensation Approach for Motion Error of Rotating Accelerometer Gravity Gradiometer. IEEE Transactions on Instrumentation and Measurement. 74. 1–8.
3.
Fan, Ji, Qiang Yang, Shuhui Lv, et al.. (2025). Synergetic tensile properties and thermal conductivity of high-pressure die casting Mg-Al-RE alloys controlling by various Al and La additions. Journal of Alloys and Compounds. 1032. 181121–181121. 4 indexed citations
4.
Liu, Haoran, Yalun Li, Jiatong Jiang, et al.. (2025). Heat pump-assisted waste heat recovery for thermal management in hydrogen-enabled integrated energy systems. Energy. 338. 138874–138874. 1 indexed citations
5.
Jiang, Tao, B. C. Ke, Yu Li, et al.. (2025). Gravity gradient signal extraction based on time-frequency feature threshold method. Journal of Applied Geophysics. 234. 105643–105643. 2 indexed citations
6.
Li, Rui, Linping Zhang, Ji Fan, et al.. (2025). Synergistic confinement and heavy atom effects in carbon dots for enhanced phosphorescence: Matrix-free and matrix conditions. Chemical Engineering Journal. 526. 171205–171205.
7.
Jiang, Tao, Yu Li, Ji Fan, et al.. (2024). Quantitative analysis and cancellation of rotating modulation noise in gravity gradient measurement. Sensors and Actuators A Physical. 374. 115477–115477. 1 indexed citations
8.
Yu, Xiaobing, Chenyuan Hu, Ji Fan, et al.. (2024). Error analysis of calibration for horizontal tensor rotating accelerometer gravity gradiometer. Measurement Science and Technology. 35(5). 55121–55121. 1 indexed citations
9.
Jiang, Jiatong, Yu Zhou, Ji Fan, et al.. (2024). Internal thermal management cooling strategies for high-temperature heat pump. Energy. 313. 133871–133871. 5 indexed citations
10.
Hu, Chenyuan, et al.. (2022). Quantitative Analysis of the Effects of Environmental Magnetic Field in Gravity Gradient Sensing. IEEE Sensors Journal. 23(2). 1060–1065. 1 indexed citations
11.
Rao, K. S. Prakasa, Huafeng Liu, Wenjie Wu, et al.. (2020). A High-resolution Area-change-based Capacitive MEMS Accelerometer for Tilt Sensing. 1–4. 6 indexed citations
12.
Wei, Xiaoli, et al.. (2019). Electroplating of 3D Sn-rich solder for MEMS packaging applications. Journal of Micromechanics and Microengineering. 29(4). 45008–45008. 5 indexed citations
13.
Tang, Shihao, Huafeng Liu, Shitao Yan, et al.. (2019). A high-sensitivity MEMS gravimeter with a large dynamic range. Microsystems & Nanoengineering. 5(1). 45–45. 91 indexed citations
14.
Song, Xiaoxiao, Huafeng Liu, Guangbin Dou, et al.. (2018). A method for alleviating the effect of pinhole defects in inter-metal dielectric films. Journal of Micromechanics and Microengineering. 29(1). 15012–15012. 4 indexed citations
15.
16.
Li, Junjie, Liang Qi, Tielin Shi, et al.. (2018). Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding. Journal of Alloys and Compounds. 772. 793–800. 81 indexed citations
17.
18.
Fan, Ji, D. F. Lim, & Chuan Seng Tan. (2013). Effects of surface treatment on the bonding quality of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration. Journal of Micromechanics and Microengineering. 23(4). 45025–45025. 42 indexed citations
19.
Fan, Ji, Lan Peng, King Ho Holden Li, & Chuan Seng Tan. (2012). Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability. Journal of Micromechanics and Microengineering. 22(10). 105004–105004. 19 indexed citations
20.
Fan, Ji, et al.. (2007). Advanced Photodiode Detector For Medical CT Imaging: Design and Performance. i. 2730–2735. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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