David A. Hutt

1.9k total citations
104 papers, 1.5k citations indexed

About

David A. Hutt is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Computational Mechanics. According to data from OpenAlex, David A. Hutt has authored 104 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 89 papers in Electrical and Electronic Engineering, 30 papers in Biomedical Engineering and 17 papers in Computational Mechanics. Recurrent topics in David A. Hutt's work include Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (25 papers) and Molecular Junctions and Nanostructures (20 papers). David A. Hutt is often cited by papers focused on Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (25 papers) and Molecular Junctions and Nanostructures (20 papers). David A. Hutt collaborates with scholars based in United Kingdom, Canada and Singapore. David A. Hutt's co-authors include Graham J. Leggett, D.C. Whalley, Paul Conway, Changqing Liu, S.H. Mannan, Elaine Cooper, Jianfeng Li, M.P. Clode, Yingtao Tian and F. Sarvar and has published in prestigious journals such as Applied Physics Letters, The Journal of Physical Chemistry B and Journal of The Electrochemical Society.

In The Last Decade

David A. Hutt

103 papers receiving 1.5k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
David A. Hutt United Kingdom 21 1.2k 397 384 292 184 104 1.5k
Xiongying Ye China 30 994 0.8× 1.3k 3.2× 704 1.8× 278 1.0× 136 0.7× 103 2.3k
Maoxiang Hou China 21 1.1k 1.0× 649 1.6× 249 0.6× 149 0.5× 257 1.4× 63 1.7k
Peter Schweizer Switzerland 20 739 0.6× 252 0.6× 620 1.6× 181 0.6× 128 0.7× 65 1.5k
Shashishekar P. Adiga India 22 574 0.5× 335 0.8× 584 1.5× 119 0.4× 128 0.7× 48 1.4k
Peiyun Yi China 20 638 0.5× 675 1.7× 255 0.7× 150 0.5× 75 0.4× 47 1.2k
Benji Maruyama United States 25 666 0.6× 559 1.4× 968 2.5× 295 1.0× 130 0.7× 59 1.8k
Jiuhong Wang China 21 699 0.6× 676 1.7× 241 0.6× 154 0.5× 94 0.5× 87 1.3k
Jiupeng Zhao China 27 931 0.8× 335 0.8× 560 1.5× 106 0.4× 321 1.7× 90 2.4k
Xianhua Tan China 22 1.3k 1.1× 258 0.6× 891 2.3× 89 0.3× 56 0.3× 46 1.8k
Zhankun Weng China 18 415 0.3× 422 1.1× 374 1.0× 160 0.5× 131 0.7× 96 1.2k

Countries citing papers authored by David A. Hutt

Since Specialization
Citations

This map shows the geographic impact of David A. Hutt's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David A. Hutt with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David A. Hutt more than expected).

Fields of papers citing papers by David A. Hutt

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by David A. Hutt. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David A. Hutt. The network helps show where David A. Hutt may publish in the future.

Co-authorship network of co-authors of David A. Hutt

This figure shows the co-authorship network connecting the top 25 collaborators of David A. Hutt. A scholar is included among the top collaborators of David A. Hutt based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with David A. Hutt. David A. Hutt is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Yendall, Keith, et al.. (2022). Damp‐heat induced degradation in photovoltaic modules manufactured with passivated emitter and rear contact solar cells. Progress in Photovoltaics Research and Applications. 30(9). 1061–1071. 28 indexed citations
2.
Abhyankar, Hrushikesh, D.P. Webb, Geoff West, & David A. Hutt. (2020). Characterization of metal‐polymer interaction forces by AFM for insert molding applications. Polymer Engineering and Science. 60(12). 3036–3045. 2 indexed citations
3.
Hou, Shuai, et al.. (2017). Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures. Journal of Materials Processing Technology. 254. 310–324. 32 indexed citations
4.
Graves, John, et al.. (2014). Functionalised copper nanoparticles as catalysts for electroless plating. Pure (Coventry University). 235–240. 6 indexed citations
5.
Vaidhyanathan, Bala, et al.. (2013). Conventional and microwave-assisted processing of Cu-loaded ICAs for electronic interconnect applications. Journal of Materials Science. 48(20). 7204–7214. 8 indexed citations
6.
Liu, Changqing, et al.. (2012). Metal-coated mono-sized polymer core particles for fine pitch flip-chip interconnects. 314. 218–224. 4 indexed citations
7.
Rajamohan, Divya, et al.. (2012). A multi‐electrode array (MEA) biochip with excimer laser‐produced micro‐well features. Circuit World. 38(1). 30–37. 1 indexed citations
8.
Conway, Paul, et al.. (2009). Polymer optical waveguide fabrication using laser ablation. Loughborough University Institutional Repository (Loughborough University). 936–941. 12 indexed citations
9.
Tian, Yingtao, David A. Hutt, Changqing Liu, & Robert S. Stevens. (2009). High density indium bumping through pulse plating used for pixel X-Ray detectors. 456–460. 5 indexed citations
10.
Selviah, David R., F.A. Fernández, Ioannis Papakonstantinou, et al.. (2008). Integrated optical and electronic interconnect printed circuit board manufacturing. Circuit World. 34(2). 21–26. 10 indexed citations
11.
Li, Jianfeng, S.H. Mannan, M.P. Clode, et al.. (2008). Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects. IEEE Transactions on Components and Packaging Technologies. 31(3). 574–585. 5 indexed citations
12.
Williams, Karen, et al.. (2008). Excimer laser micromachining of glass substrates. 8. 1–2. 1 indexed citations
13.
Williams, Karen, et al.. (2007). Process Optimisation and Characterization of Excimer Laser Drilling of Microvias in Glass. 8. 196–201. 11 indexed citations
14.
Hutt, David A., et al.. (2006). Challenges in the Manufacture of Glass Substrates for Electrical and Optical Interconnect. 1279–1285. 2 indexed citations
15.
Liu, Changqing, et al.. (2006). Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection. IEEE Transactions on Components and Packaging Technologies. 29(4). 869–876. 3 indexed citations
16.
Hutt, David A. & Changqing Liu. (2005). Oxidation protection of copper surfaces using self-assembled monolayers of octadecanethiol. Applied Surface Science. 252(2). 400–411. 107 indexed citations
17.
Hutt, David A., et al.. (2004). Materials and processes issues in fine pitch eutectic solder flip chip interconnection. Loughborough University Institutional Repository (Loughborough University). 14. 213–220. 2 indexed citations
18.
Hutt, David A., Elaine Cooper, & Graham J. Leggett. (1998). Structure and Mechanism of Photooxidation of Self-assembled Monolayers of Alkylthiols on Silver Studied by XPS and Static SIMS. The Journal of Physical Chemistry B. 102(1). 174–184. 102 indexed citations
19.
Cooper, Elaine, et al.. (1997). Rates of attachment of fibroblasts to self-assembled monolayers formed by the adsorption of alkylthiols onto gold surfaces. Journal of Materials Chemistry. 7(3). 435–441. 55 indexed citations
20.
Stroink, G., R. A. Dunlap, & David A. Hutt. (1981). Room-Temperature Magnetization Measurements of some Canadian Chrysotile and Uicc Asbestos Samples. The Canadian Mineralogist. 19(4). 519–524. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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