David A. Hutt
Impact in
-
- Molecular Junctions and Nanostructures
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
- Surfaces, Coatings and Films top 5%
- Polymer Surface Interaction Studies
Papers in
-
- Electronic Packaging and Soldering Technologies 37
- 3D IC and TSV technologies 25
- Molecular Junctions and Nanostructures 20
- Nanomaterials and Printing Technologies 15
- Electrodeposition and Electroless Coatings 14
- Semiconductor Lasers and Optical Devices 8
-
- Nanofabrication and Lithography Techniques 11
- Co-authors
- Graham J. Leggett (8 shared papers)D.C. Whalley (38 shared papers)Paul Conway (43 shared papers)Changqing Liu (19 shared papers)S.H. Mannan (17 shared papers)Elaine Cooper (3 shared papers)Jianfeng Li (5 shared papers)M.P. Clode (4 shared papers)
- Journals
- IEEE Transactions on Components and Packaging Technologies (6 papers)Langmuir (3 papers)Journal of Materials Chemistry (2 papers)Acta Materialia (2 papers)Journal of Materials Processing Technology (1 paper)
- Partner nations
- United KingdomCanadaHong Kong
In The Last Decade
David A. Hutt
103 papers receiving 1.5k citations
Peers
Comparison fields: 5 of 82
- Electrical and Electronic Engineering 1.2k
- Surfaces, Coatings and Films 140
- Biomedical Engineering 400
- Electronic, Optical and Magnetic Materials 162
- Materials Chemistry 388
Countries citing papers authored by David A. Hutt
This map shows the geographic impact of David A. Hutt's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David A. Hutt with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David A. Hutt more than expected).
Fields of papers citing papers by David A. Hutt
This network shows the impact of papers produced by David A. Hutt. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David A. Hutt. The network helps show where David A. Hutt may publish in the future.
Co-authors
The 25 scholars most cited alongside David A. Hutt, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 104 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 196 | |
| 2 | 1996 | 131 | |
| 3 | 2005 | 107 | |
| 4 | 1998 | 103 | |
| 5 | 1997 | 61 | |
| 6 | 2012 | 58 | |
| 7 | 1997 | 55 | |
| 8 | 2002 | 49 | |
| 9 | 2011 | 41 | |
| 10 | 2015 | 35 | |
| 11 | 2017 | 32 | |
| 12 | 2003 | 32 | |
| 13 | 2022 | 28 | |
| 14 | 1999 | 27 | |
| 15 | 2009 | 25 | |
| 16 | 1998 | 24 | |
| 17 | 2013 | 23 | |
| 18 | 2006 | 22 | |
| 19 | 2016 | 21 | |
| 20 | 2008 | 21 |
About David A. Hutt
David A. Hutt is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Computational Mechanics, Materials Chemistry and Atomic and Molecular Physics, and Optics, having authored 104 papers that have together received 1.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (25 papers), Molecular Junctions and Nanostructures (20 papers), Nanomaterials and Printing Technologies (15 papers), Electrodeposition and Electroless Coatings (14 papers), Nanofabrication and Lithography Techniques (11 papers), Laser Material Processing Techniques (9 papers) and Semiconductor Lasers and Optical Devices (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.2k citations), Surfaces, Coatings and Films (140 citations), Biomedical Engineering (400 citations), Electronic, Optical and Magnetic Materials (162 citations) and Materials Chemistry (388 citations). David A. Hutt has collaborated with scholars based in United Kingdom, Canada and Hong Kong. Frequent co-authors include Graham J. Leggett, D.C. Whalley, Paul Conway, Changqing Liu, S.H. Mannan, Elaine Cooper, Jianfeng Li, M.P. Clode, Yingtao Tian and F. Sarvar. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Langmuir, Journal of Materials Chemistry, Acta Materialia and Journal of Materials Processing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.