W. H. Teh

815 total citations
29 papers, 633 citations indexed

About

W. H. Teh is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, W. H. Teh has authored 29 papers receiving a total of 633 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 7 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in W. H. Teh's work include 3D IC and TSV technologies (13 papers), Semiconductor materials and devices (9 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). W. H. Teh is often cited by papers focused on 3D IC and TSV technologies (13 papers), Semiconductor materials and devices (9 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). W. H. Teh collaborates with scholars based in United States, United Kingdom and Singapore. W. H. Teh's co-authors include Charles G. Smith, Ute Drechsler, H.‐J. Güntherodt, U. Dürig, Mark R. Graham, Roy E. Welsch, Duane S. Boning, John F. Potter, Phyo Kyaw Myint and Joao H. Bettencourt‐Silva and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

W. H. Teh

29 papers receiving 604 citations

Peers

W. H. Teh
S. Kim United States
Michael Muehlberger Austria
Tomasz Zawada Poland
Ichiro Mori Japan
Kyu-Seok Lee South Korea
Hamza Ashraf Pakistan
И. П. Пронин Russia
Yûzô Katayama Japan
Kevin Lister United States
Koenraad Van Schuylenbergh United States
S. Kim United States
W. H. Teh
Citations per year, relative to W. H. Teh W. H. Teh (= 1×) peers S. Kim

Countries citing papers authored by W. H. Teh

Since Specialization
Citations

This map shows the geographic impact of W. H. Teh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W. H. Teh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W. H. Teh more than expected).

Fields of papers citing papers by W. H. Teh

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by W. H. Teh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W. H. Teh. The network helps show where W. H. Teh may publish in the future.

Co-authorship network of co-authors of W. H. Teh

This figure shows the co-authorship network connecting the top 25 collaborators of W. H. Teh. A scholar is included among the top collaborators of W. H. Teh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with W. H. Teh. W. H. Teh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Teh, W. H., Craig J. Smith, Raphae S. Barlas, et al.. (2018). Impact of stroke-associated pneumonia on mortality, length of hospitalization, and functional outcome. Acta Neurologica Scandinavica. 138(4). 293–300. 120 indexed citations
2.
Teh, W. H., Duane S. Boning, & Roy E. Welsch. (2015). Multi-strata subsurface laser die singulation to enable defect-free ultra-thin stacked memory dies. AIP Advances. 5(5). 7 indexed citations
3.
Teh, W. H., Duane S. Boning, & Roy E. Welsch. (2015). Multistrata Subsurface Laser-Modified Microstructure With Backgrind-Assisted Controlled Fracture for Defect-Free Ultrathin Die Fabrication. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(7). 1006–1018. 9 indexed citations
4.
Teh, W. H., et al.. (2010). Backside Infrared Interferometric Patterned Wafer Thickness Sensing for Through-Silicon-Via (TSV) Etch Metrology. IEEE Transactions on Semiconductor Manufacturing. 23(3). 419–422. 13 indexed citations
5.
Teh, W. H., et al.. (2010). 300-mm Production-Worthy Magnetically Enhanced Non-Bosch Through-Si-Via Etch for 3-D Logic Integration. IEEE Transactions on Semiconductor Manufacturing. 23(2). 293–302. 6 indexed citations
6.
Young, Richard, et al.. (2010). Sample Preparation and Analysis on Full-Thickness Silicon Wafers for Wafer-to-Wafer Bonding Process Development. Proceedings - International Symposium for Testing and Failure Analysis. 30415. 186–190. 1 indexed citations
7.
8.
9.
Grant, David, et al.. (2009). Wafer Thickness Sensor (WTS) for etch depth measurement of TSV. 1–5. 13 indexed citations
10.
11.
Teh, W. H., C.F. Tsang, Rakesh Kumar, et al.. (2006). Adhesion Studies of Ta∕Low-k (Black Diamond) Interface using Thermocompressive Wafer Bonding and Four-Point Bend. Journal of The Electrochemical Society. 153(9). G795–G795. 7 indexed citations
12.
Teh, W. H., A. D. Trigg, Ching‐Hsuan Tung, et al.. (2005). 200 mm wafer-scale epitaxial transfer of single crystal Si on glass by anodic bonding of silicon-on-insulator wafers. Applied Physics Letters. 87(7). 11 indexed citations
13.
Teh, W. H., U. Dürig, Ute Drechsler, Charles G. Smith, & H.‐J. Güntherodt. (2005). Effect of low numerical-aperture femtosecond two-photon absorption on (SU-8) resist for ultrahigh-aspect-ratio microstereolithography. Journal of Applied Physics. 97(5). 117 indexed citations
14.
Teh, W. H., Rakesh Kumar, & Dim‐Lee Kwong. (2005). 200 mm wafer-scale substrate transfer of 0.13μmCu∕low-k (Black Diamond™) dual-damascene interconnection to glass substrates. Applied Physics Letters. 87(4). 3 indexed citations
15.
Liao, E.B., et al.. (2005). Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks. Thin Solid Films. 504(1-2). 252–256. 15 indexed citations
16.
Teh, W. H., Jiapeng Luo, Mark R. Graham, Alexander A. Pavlov, & Charles G. Smith. (2003). Near-zero curvature fabrication of miniaturized micromechanical Ni switches using electron beam cross-linked PMMA. Journal of Micromechanics and Microengineering. 13(5). 591–598. 29 indexed citations
17.
Teh, W. H. & C. G. Smith. (2003). Fabrication of quasi-three-dimensional micro/nanomechanical components using electron beam cross-linked poly (methyl methacrylate) resist. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 21(6). 3007–3011. 15 indexed citations
18.
Teh, W. H. & Charles G. Smith. (2003). Reversible electrostatic control of micromechanical structure tunneling characteristics. Journal of Applied Physics. 94(7). 4614–4618. 1 indexed citations
19.
Teh, W. H., Chi‐Te Liang, Mark R. Graham, & Charles G. Smith. (2003). Cross-linked PMMA as a low-dimensional dielectric sacrificial layer. Journal of Microelectromechanical Systems. 12(5). 641–648. 41 indexed citations
20.
Teh, W. H., et al.. (2001). Evaluation of the performance of TaN diffusionbarrier againstcopper diffusion using SIMS and AFM. Electronics Letters. 37(10). 660–661. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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