C.Y. Li

420 total citations
20 papers, 342 citations indexed

About

C.Y. Li is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, C.Y. Li has authored 20 papers receiving a total of 342 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 14 papers in Electronic, Optical and Magnetic Materials and 7 papers in Materials Chemistry. Recurrent topics in C.Y. Li's work include Copper Interconnects and Reliability (13 papers), Semiconductor materials and devices (13 papers) and Ferroelectric and Piezoelectric Materials (3 papers). C.Y. Li is often cited by papers focused on Copper Interconnects and Reliability (13 papers), Semiconductor materials and devices (13 papers) and Ferroelectric and Piezoelectric Materials (3 papers). C.Y. Li collaborates with scholars based in Singapore, China and United States. C.Y. Li's co-authors include Charles R. Watts, Deborah A. Kallick, D.H. Zhang, P.D. Foo, Xi Yao, Guoqiang You, Manwen Yao, Liping Yang, Andrew T. S. Wee and X.P. Zhang and has published in prestigious journals such as Advanced Functional Materials, Chemical Engineering Journal and Journal of Materials Chemistry A.

In The Last Decade

C.Y. Li

19 papers receiving 336 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
C.Y. Li Singapore 9 140 124 104 80 53 20 342
John S. Zetts United States 10 141 1.0× 113 0.9× 136 1.3× 79 1.0× 12 0.2× 31 356
Ray Hasegawa Japan 8 84 0.6× 272 2.2× 40 0.4× 67 0.8× 9 0.2× 17 335
Hiroyoshi Fukuro Japan 11 149 1.1× 441 3.6× 71 0.7× 128 1.6× 29 0.5× 22 561
D. V. Shmeliova Russia 10 58 0.4× 269 2.2× 44 0.4× 46 0.6× 11 0.2× 49 331
M. J. Towler United Kingdom 11 74 0.5× 399 3.2× 118 1.1× 60 0.8× 9 0.2× 29 415
Taiju Takahashi Japan 11 62 0.4× 331 2.7× 122 1.2× 51 0.6× 8 0.2× 39 361
Michal Poksinski Sweden 7 119 0.8× 73 0.6× 107 1.0× 41 0.5× 7 0.1× 8 358
Olena Zribi United States 7 123 0.9× 65 0.5× 72 0.7× 54 0.7× 6 0.1× 7 325
Matthew E. Sousa United States 10 101 0.7× 243 2.0× 26 0.3× 91 1.1× 9 0.2× 26 326
Yuichi Momoi Japan 10 72 0.5× 267 2.2× 31 0.3× 95 1.2× 10 0.2× 28 396

Countries citing papers authored by C.Y. Li

Since Specialization
Citations

This map shows the geographic impact of C.Y. Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.Y. Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.Y. Li more than expected).

Fields of papers citing papers by C.Y. Li

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C.Y. Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.Y. Li. The network helps show where C.Y. Li may publish in the future.

Co-authorship network of co-authors of C.Y. Li

This figure shows the co-authorship network connecting the top 25 collaborators of C.Y. Li. A scholar is included among the top collaborators of C.Y. Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C.Y. Li. C.Y. Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, C.Y., Manwen Yao, Xi Yao, & Chunyu Li. (2025). A hybrid processing technology for fabricating lead zirconate-based ceramics with high energy storage density, high efficiency, and low sintering temperature. Journal of Materiomics. 11(6). 101077–101077. 1 indexed citations
2.
Li, C.Y., Manwen Yao, Tongqing Yang, & Xi Yao. (2024). Optimizing energy storage performance of lead zirconate-based antiferroelectric ceramics by a phase modulation strategy. Chemical Engineering Journal. 497. 154913–154913. 5 indexed citations
3.
Li, C.Y., Manwen Yao, & Xi Yao. (2023). An effective strategy for enhancing energy storage density in (Pb1−1.5xGdx)(Zr0.87Sn0.12Ti0.01)O3 antiferroelectric ceramics. Journal of Materials Chemistry A. 11(35). 18689–18701. 18 indexed citations
4.
Chen, Fuyao, et al.. (2015). Size effects on tensile strength of aluminum–bronze alloy at room temperature. Materials & Design. 85. 778–784. 33 indexed citations
5.
Li, C.Y., D.H. Zhang, S. S. Su, et al.. (2004). Comparative study of argon and hydrogen/helium plasma treatments on the properties of Cu/SiLK damascene structures for interconnect technology. Thin Solid Films. 462-463. 172–175. 2 indexed citations
6.
Tsang, C.F., C.Y. Li, Ahila Krishnamoorthy, et al.. (2004). Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. Microelectronics Journal. 35(9). 693–700. 1 indexed citations
7.
Zhang, D.H., et al.. (2004). Thermal stability of Cu/α-Ta/SiO2/Si structures. Thin Solid Films. 462-463. 284–287. 19 indexed citations
8.
Yang, Liping, et al.. (2004). Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects. Thin Solid Films. 462-463. 182–185. 1 indexed citations
9.
Li, H.Y., C.Y. Li, Yi Su, & C.F. Tsang. (2004). Impact of barrier metal on electrical performance of Cu/low K (Black Diamond™) in 0.13μm dual damascene interconnection. Thin Solid Films. 462-463. 245–249. 2 indexed citations
10.
Zhang, D.H., et al.. (2004). Study of copper diffusion into Ta and TaN barrier materials for MOS devices. Thin Solid Films. 462-463. 240–244. 32 indexed citations
11.
Yang, Liping, D.H. Zhang, C.Y. Li, & P.D. Foo. (2004). Comparative study of Ta, TaN and Ta/TaN bi-layer barriers for Cu-ultra low-k porous polymer integration. Thin Solid Films. 462-463. 176–181. 33 indexed citations
12.
Yang, Zhaoqi, D.H. Zhang, C.Y. Li, Cher Ming Tan, & K. Prasad. (2004). Barrier layer effects on reliabilities of copper metallization. Thin Solid Films. 462-463. 288–291. 8 indexed citations
13.
Yang, Liping, D.H. Zhang, C.Y. Li, Shaoteng Wu, & P.D. Foo. (2004). Improving electrical performance of Cu/porous ultra-low k dielectrics single damascene lines. Electronics Letters. 40(12). 729–730.
14.
Ge, Jason J., Seok‐Cheol Hong, C.Y. Li, et al.. (2003). Assembly of Photopolymerizable Discotic Molecules on an Aligned Polyimide Layer Surface to Form a Negative Retardation Film with an Oblique Optical Axis. Advanced Functional Materials. 13(9). 718–725. 14 indexed citations
15.
You, Guoqiang, et al.. (2002). Investigation of the effects of byproduct components in Cu plating for advanced interconnect metallization. Microelectronics Journal. 33(3). 229–234. 32 indexed citations
16.
Shen, Luming, Jisheng Pan, An Du, et al.. (2002). A Correlation Study of Thermal Stability on Porous Low k. MRS Proceedings. 716. 5 indexed citations
17.
Teh, W. H., et al.. (2001). Evaluation of the performance of TaN diffusionbarrier againstcopper diffusion using SIMS and AFM. Electronics Letters. 37(10). 660–661. 3 indexed citations
18.
19.
Li, C.Y. & D.H. Zhang. (1996). Effects of As cell temperature on oval defect density and C acceptor concentration of light Si-doped GaAs grown by molecular beam epitaxy. Journal of Crystal Growth. 165(1-2). 15–18. 1 indexed citations
20.
Kallick, Deborah A., et al.. (1995). The Use of Dodecylphosphocholine Micelles in Solution NMR. Journal of Magnetic Resonance Series B. 109(1). 60–65. 130 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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