Debendra Mallik

590 total citations
11 papers, 392 citations indexed

About

Debendra Mallik is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Debendra Mallik has authored 11 papers receiving a total of 392 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 1 paper in Automotive Engineering. Recurrent topics in Debendra Mallik's work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). Debendra Mallik is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). Debendra Mallik collaborates with scholars based in United States and Japan. Debendra Mallik's co-authors include Robert Sankman, Ravi Mahajan, Neha Patel, Zhiguo Qian, Kemal Aygün, Yidnekachew S. Mekonnen, Islam A. Salama, Deepti Iyengar, Dae Woo Kim and Somnath Paul and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, MRS Bulletin and IEEE Transactions on Components Hybrids and Manufacturing Technology.

In The Last Decade

Debendra Mallik

11 papers receiving 364 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Debendra Mallik United States	7	339	75	57	45	41	11	392
Dan Oh United States	15	605 1.8×	94 1.3×	98 1.7×	41 0.9×	41 1.0×	78	682
C.-P Hung Taiwan	9	321 0.9×	41 0.5×	47 0.8×	39 0.9×	21 0.5×	51	375
Robert Sankman United States	5	301 0.9×	79 1.1×	54 0.9×	21 0.5×	42 1.0×	8	336
Chang-Chi Lee Taiwan	10	311 0.9×	35 0.5×	125 2.2×	58 1.3×	60 1.5×	28	370
S. Bracho Spain	11	332 1.0×	62 0.8×	58 1.0×	100 2.2×	22 0.5×	44	367
Gapyeol Park South Korea	13	336 1.0×	40 0.5×	24 0.4×	29 0.6×	20 0.5×	41	389
Seongguk Kim South Korea	10	315 0.9×	41 0.5×	19 0.3×	33 0.7×	29 0.7×	57	375
Kodai Yamada Japan	11	459 1.4×	48 0.6×	25 0.4×	45 1.0×	21 0.5×	21	497
Krit Athikulwongse Thailand	13	612 1.8×	90 1.2×	84 1.5×	11 0.2×	146 3.6×	33	667
Franco Fiori Italy	18	1.0k 3.1×	39 0.5×	197 3.5×	62 1.4×	68 1.7×	131	1.1k

Countries citing papers authored by Debendra Mallik

Since Specialization

Citations

This map shows the geographic impact of Debendra Mallik's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Debendra Mallik with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Debendra Mallik more than expected).

Fields of papers citing papers by Debendra Mallik

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Debendra Mallik. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Debendra Mallik. The network helps show where Debendra Mallik may publish in the future.

Co-authorship network of co-authors of Debendra Mallik

This figure shows the co-authorship network connecting the top 25 collaborators of Debendra Mallik. A scholar is included among the top collaborators of Debendra Mallik based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Debendra Mallik. Debendra Mallik is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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11 of 11 papers shown

1.

Paul, Somnath, Ryan Kim, Paolo Aseron, et al.. (2017). A Sub-cm³ Energy-Harvesting Stacked Wireless Sensor Node Featuring a Near-Threshold Voltage IA-32 Microcontroller in 14-nm Tri-Gate CMOS for Always-ON Always-Sensing Applications. IEEE Journal of Solid-State Circuits. 52(4). 961–971. 46 indexed citations

2.

Mahajan, Ravi, Robert Sankman, Neha Patel, et al.. (2016). Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect. 557–565. 245 indexed citations

3.

Paul, Somnath, Ryan Kim, Paolo Aseron, et al.. (2016). An energy harvesting wireless sensor node for IoT systems featuring a near-threshold voltage IA-32 microcontroller in 14nm tri-gate CMOS. 1–2. 19 indexed citations

4.

Mahajan, Ravi, et al.. (2006). Advances and Challenges in Flip-Chip Packaging. 703–709. 8 indexed citations

5.

Mallik, Debendra. (2005). Advanced Package Technologies for High-Performance Systems. 9(4). 29 indexed citations

6.

Mallik, Debendra, et al.. (2003). Multi-layer molded plastic package. 221–229. 2 indexed citations

7.

Mallik, Debendra & Bidyut K. Bhattacharyya. (2003). High-performance PQFP. chmt 4. 494–503. 2 indexed citations

8.

Mahajan, Ravi, Debendra Mallik, John Tang, et al.. (2003). Critical Aspects of High-Performance Microprocessor Packaging. MRS Bulletin. 28(1). 21–34. 21 indexed citations

9.

Mallik, Debendra, et al.. (2003). A new technique for measuring the inductance of pin grid array packages. 280–285. 1 indexed citations

10.

Mallik, Debendra, et al.. (1993). Packaging alternatives for high lead count, fine pitch, surface mount technology. IEEE Transactions on Components Hybrids and Manufacturing Technology. 16(4). 396–401. 3 indexed citations

11.

Mallik, Debendra, et al.. (1990). Thermal characteristics of single and multilayer high performance PQFP packages. IEEE Transactions on Components Hybrids and Manufacturing Technology. 13(4). 975–979. 16 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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