Brandon Noia

536 total citations
18 papers, 399 citations indexed

About

Brandon Noia is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Automotive Engineering. According to data from OpenAlex, Brandon Noia has authored 18 papers receiving a total of 399 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 9 papers in Hardware and Architecture and 1 paper in Automotive Engineering. Recurrent topics in Brandon Noia's work include 3D IC and TSV technologies (18 papers), Integrated Circuits and Semiconductor Failure Analysis (11 papers) and Advancements in Photolithography Techniques (9 papers). Brandon Noia is often cited by papers focused on 3D IC and TSV technologies (18 papers), Integrated Circuits and Semiconductor Failure Analysis (11 papers) and Advancements in Photolithography Techniques (9 papers). Brandon Noia collaborates with scholars based in United States, Belgium and Netherlands. Brandon Noia's co-authors include Krishnendu Chakrabarty, Erik Jan Marinissen, Jouke Verbree, Yuan Xie, S.K. Goel, Sandeep Goel, Sung Kyu Lim, Shreepad Panth, Zhenqian Zhang and Paul D. Franzon and has published in prestigious journals such as IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on Very Large Scale Integration (VLSI) Systems and Journal of Electronic Testing.

In The Last Decade

Brandon Noia

18 papers receiving 386 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Brandon Noia United States 11 389 192 43 38 28 18 399
Jouke Verbree Netherlands 7 345 0.9× 205 1.1× 23 0.5× 30 0.8× 27 1.0× 8 357
Ang-Chih Hsieh Taiwan 6 349 0.9× 96 0.5× 124 2.9× 29 0.8× 91 3.3× 14 368
T. Rahal-Arabi United States 8 375 1.0× 119 0.6× 10 0.2× 78 2.1× 6 0.2× 17 385
John G. Petrovick United States 8 406 1.0× 222 1.2× 66 1.5× 32 0.8× 3 0.1× 13 429
Yuh-Fang Tsai United States 8 334 0.9× 234 1.2× 148 3.4× 9 0.2× 14 0.5× 11 399
Jung-Bae Lee South Korea 9 169 0.4× 56 0.3× 40 0.9× 48 1.3× 4 0.1× 26 202
Behnam Amelifard United States 11 308 0.8× 99 0.5× 13 0.3× 43 1.1× 10 0.4× 23 318
Jacob Rajkumar Minz United States 10 316 0.8× 66 0.3× 153 3.6× 6 0.2× 28 1.0× 27 326
Michael Sperling United States 8 234 0.6× 83 0.4× 27 0.6× 81 2.1× 3 0.1× 11 258
K. Ishibashi Japan 11 376 1.0× 91 0.5× 25 0.6× 54 1.4× 2 0.1× 28 387

Countries citing papers authored by Brandon Noia

Since Specialization
Citations

This map shows the geographic impact of Brandon Noia's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Brandon Noia with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Brandon Noia more than expected).

Fields of papers citing papers by Brandon Noia

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Brandon Noia. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Brandon Noia. The network helps show where Brandon Noia may publish in the future.

Co-authorship network of co-authors of Brandon Noia

This figure shows the co-authorship network connecting the top 25 collaborators of Brandon Noia. A scholar is included among the top collaborators of Brandon Noia based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Brandon Noia. Brandon Noia is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

18 of 18 papers shown
1.
Noia, Brandon & Krishnendu Chakrabarty. (2014). Retiming for Delay Recovery After DfT Insertion on Interdie Paths in 3-D ICs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 33(3). 464–475. 1 indexed citations
2.
Noia, Brandon, Shreepad Panth, Krishnendu Chakrabarty, & Sung Kyu Lim. (2014). Scan Test of Die Logic in 3-D ICs Using TSV Probing. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 23(2). 317–330. 18 indexed citations
3.
Chakrabarty, Krishnendu, Mukesh Agrawal, Sergej Deutsch, et al.. (2014). Test and Design-for-Testability Solutions for 3D Integrated Circuits. 7(0). 56–73. 13 indexed citations
4.
Noia, Brandon & Krishnendu Chakrabarty. (2013). Pre-Bond Probing of Through-Silicon Vias in 3-D Stacked ICs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 32(4). 547–558. 16 indexed citations
5.
Noia, Brandon & Krishnendu Chakrabarty. (2013). Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs. CERN Document Server (European Organization for Nuclear Research). 17 indexed citations
6.
Noia, Brandon & Krishnendu Chakrabarty. (2013). Post-DfT-insertion retiming for delay recovery on inter-die paths in 3D ICs. 10. 1–6. 1 indexed citations
7.
Zhang, Zhenqian, Brandon Noia, Krishnendu Chakrabarty, & Paul D. Franzon. (2013). Face-to-face bus design with built-in self-test in 3D ICs. 1–7. 7 indexed citations
8.
Noia, Brandon, Shreepad Panth, Krishnendu Chakrabarty, & Sung Kyu Lim. (2012). Scan test of die logic in 3D ICs using TSV probing. 2012. 1–8. 10 indexed citations
9.
Noia, Brandon & Krishnendu Chakrabarty. (2012). Pre-bond testing of die logic and TSVs in high performance 3D-SICs. 1–5. 5 indexed citations
10.
Noia, Brandon, Krishnendu Chakrabarty, S.K. Goel, Erik Jan Marinissen, & Jouke Verbree. (2011). Test-Architecture Optimization and Test Scheduling for TSV-Based 3-D Stacked ICs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 30(11). 1705–1718. 43 indexed citations
11.
Noia, Brandon & Krishnendu Chakrabarty. (2011). Identification of Defective TSVs in Pre-Bond Testing of 3D ICs. 187–194. 21 indexed citations
12.
Noia, Brandon & Krishnendu Chakrabarty. (2011). Pre-bond probing of TSVs in 3D stacked ICs. 1–10. 93 indexed citations
13.
Noia, Brandon, Krishnendu Chakrabarty, & Erik Jan Marinissen. (2011). Optimization Methods for Post-Bond Testing of 3D Stacked ICs. Journal of Electronic Testing. 28(1). 103–120. 20 indexed citations
14.
Noia, Brandon & Krishnendu Chakrabarty. (2011). Testing and Design-for-Testability Techniques for 3D Integrated Circuits. 474–479. 9 indexed citations
15.
Noia, Brandon & Krishnendu Chakrabarty. (2011). Test-wrapper optimisation for embedded cores in through-silicon via-based three-dimensional system on chips. IET Computers & Digital Techniques. 5(3). 186–197. 4 indexed citations
16.
Noia, Brandon, Krishnendu Chakrabarty, & Erik Jan Marinissen. (2010). Optimization methods for post-bond die-internal/external testing in 3D stacked ICs. 1–9. 48 indexed citations
17.
Noia, Brandon, Sandeep Goel, Krishnendu Chakrabarty, Erik Jan Marinissen, & Jouke Verbree. (2010). Test-architecture optimization for TSV-based 3D stacked ICs. 24–29. 39 indexed citations
18.
Noia, Brandon, Krishnendu Chakrabarty, & Yuan Xie. (2009). Test-wrapper optimization for embedded cores in TSV-based three-dimensional SOCs. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 70–77. 34 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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