Jacob Rajkumar Minz
- Electrical and Electronic Engineering top 10%
- Computer Networks and Communications top 10%
- Hardware and Architecture top 10%
- Automotive Engineering
- Industrial and Manufacturing Engineering
- Co-authors
- Sung Kyu LimXin ZhaoE.H. WongMongkol EkpanyapongHsien-Hsin S. LeeMohit PathakEric T. WongCheng‐Kok Koh
- Topics
- VLSI and FPGA Design Techniques (22 papers)3D IC and TSV technologies (22 papers)Interconnection Networks and Systems (14 papers)
- Cited by
- Hardware and ArchitectureComputer Networks and CommunicationsElectrical and Electronic Engineering
- Journals
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and SystemsIEEE Transactions on Very Large Scale Integration (VLSI) SystemsIEEE Transactions on Components and Packaging Technologies
- Partner nations
- United States
In The Last Decade
Jacob Rajkumar Minz
27 papers receiving 306 citations
Peers
Comparison fields: 5 of 18
- Electrical and Electronic Engineering 316
- Computer Networks and Communications 153
- Hardware and Architecture 66
- Automotive Engineering 28
- Industrial and Manufacturing Engineering 9
Countries citing papers authored by Jacob Rajkumar Minz
This map shows the geographic impact of Jacob Rajkumar Minz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jacob Rajkumar Minz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jacob Rajkumar Minz more than expected).
Fields of papers citing papers by Jacob Rajkumar Minz
This network shows the impact of papers produced by Jacob Rajkumar Minz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jacob Rajkumar Minz. The network helps show where Jacob Rajkumar Minz may publish in the future.
Co-authorship network of co-authors of Jacob Rajkumar Minz
This figure shows the co-authorship network connecting the top 25 collaborators of Jacob Rajkumar Minz. A scholar is included among the top collaborators of Jacob Rajkumar Minz based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jacob Rajkumar Minz. Jacob Rajkumar Minz is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 38 | |
| 2 | 10 | |
| 3 | 9 | |
| 4 | 9 | |
| 5 | 2 | |
| 6 | 6 | |
| 7 | 8 | |
| 8 | Placement and Routing for 3D System-On-Package Designs | 7 |
| 9 | 13 | |
| 10 | 4 | |
| 11 | 13 | |
| 12 | 6 | |
| 13 | 4 | |
| 14 | 6 | |
| 15 | 13 | |
| 16 | 7 | |
| 17 | 4 | |
| 18 | 41 | |
| 19 | Global Routing Paradigm for System-on-Package | 2 |
| 20 | Layer Assignment for System on Packages | 8 |
About Jacob Rajkumar Minz
Jacob Rajkumar Minz is a scholar working on Hardware and Architecture, Computer Networks and Communications and Electrical and Electronic Engineering, having authored 27 papers that have together received 326 indexed citations. Recurring topics across this work include VLSI and FPGA Design Techniques (22 papers), 3D IC and TSV technologies (22 papers) and Interconnection Networks and Systems (14 papers). The work is most often cited by research in Hardware and Architecture (66 citations), Computer Networks and Communications (153 citations) and Electrical and Electronic Engineering (316 citations). Jacob Rajkumar Minz has collaborated with scholars based in United States. Frequent co-authors include Sung Kyu Lim, Xin Zhao, E.H. Wong, Mongkol Ekpanyapong, Hsien-Hsin S. Lee, Mohit Pathak, Eric T. Wong, Cheng‐Kok Koh, Ramprasad Ravichandran and Madhavan Swaminathan. Their work appears in journals such as IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on Very Large Scale Integration (VLSI) Systems and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.