Bernd Ebersberger
Impact in
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- Force Microscopy Techniques and Applications
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- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advancements in Semiconductor Devices and Circuit Design
Papers in
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- Force Microscopy Techniques and Applications 16
- Surface and Thin Film Phenomena 2
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- Integrated Circuits and Semiconductor Failure Analysis 19
- Semiconductor materials and devices 12
- 3D IC and TSV technologies 4
- Electronic Packaging and Soldering Technologies 4
- Advancements in Semiconductor Devices and Circuit Design 3
- Co-authors
- Alexander Olbrich (16 shared papers)Christian Boit (12 shared papers)Montserrat Nafria (8 shared papers)X. Aymerich (8 shared papers)Marc Porti (8 shared papers)Charles Lee (1 shared paper)R. S. Bauer (2 shared papers)Johann Vancea (3 shared papers)
- Journals
- Microelectronics Reliability (5 papers)Applied Physics Letters (4 papers)Nanotechnology (2 papers)Journal of The Electrochemical Society (1 paper)Microelectronic Engineering (1 paper)
- Partner nations
- GermanySpainUnited States
In The Last Decade
Bernd Ebersberger
26 papers receiving 558 citations
Peers
Comparison fields: 5 of 33
- Atomic and Molecular Physics, and Optics 267
- Electrical and Electronic Engineering 466
- Structural Biology 8
- Electronic, Optical and Magnetic Materials 61
- Biomedical Engineering 136
Countries citing papers authored by Bernd Ebersberger
This map shows the geographic impact of Bernd Ebersberger's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bernd Ebersberger with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bernd Ebersberger more than expected).
Fields of papers citing papers by Bernd Ebersberger
This network shows the impact of papers produced by Bernd Ebersberger. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bernd Ebersberger. The network helps show where Bernd Ebersberger may publish in the future.
Co-authors
The 25 scholars most cited alongside Bernd Ebersberger, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1998 | 147 | |
| 2 | 2002 | 86 | |
| 3 | 1999 | 45 | |
| 4 | 2001 | 45 | |
| 5 | 2008 | 45 | |
| 6 | 2005 | 36 | |
| 7 | 1998 | 34 | |
| 8 | 2001 | 23 | |
| 9 | 2001 | 17 | |
| 10 | 2004 | 17 | |
| 11 | 1998 | 14 | |
| 12 | 1994 | 11 | |
| 13 | 2008 | 10 | |
| 14 | 1999 | 7 | |
| 15 | 2001 | 7 | |
| 16 | 2002 | 7 | |
| 17 | 2000 | 5 | |
| 18 | 2003 | 5 | |
| 19 | 1996 | 4 | |
| 20 | 2001 | 4 |
About Bernd Ebersberger
Bernd Ebersberger is a scholar working on Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering, Structural Biology, Surfaces, Coatings and Films and Materials Chemistry, having authored 26 papers that have together received 583 indexed citations. Recurring topics across this work include Integrated Circuits and Semiconductor Failure Analysis (19 papers), Force Microscopy Techniques and Applications (16 papers), Semiconductor materials and devices (12 papers), 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (4 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers), Advanced Electron Microscopy Techniques and Applications (3 papers) and Surface and Thin Film Phenomena (2 papers). The work is most often cited by research in Atomic and Molecular Physics, and Optics (267 citations), Electrical and Electronic Engineering (466 citations), Structural Biology (8 citations), Electronic, Optical and Magnetic Materials (61 citations) and Biomedical Engineering (136 citations). Bernd Ebersberger has collaborated with scholars based in Germany, Spain and United States. Frequent co-authors include Alexander Olbrich, Christian Boit, Montserrat Nafria, X. Aymerich, Marc Porti, Charles Lee, R. S. Bauer, Johann Vancea, W. Hänni and Hannes Hoffmann. Their work appears in journals such as Microelectronics Reliability, Applied Physics Letters, Nanotechnology, Journal of The Electrochemical Society and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.