Immediate Impact
26 standout
Citing Papers
Roadmapping the next generation of silicon photonics
2024 Standout
Monolithic three-dimensional integration of complementary two-dimensional field-effect transistors
2024 Standout
Works of Yi-Hsin Pao being referenced
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
1996
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| Yi-Hsin Pao | 397 | 179 | 236 | 16 | 477 | |
| Tong Yan Tee | 415 | 139 | 118 | 22 | 451 | |
| W. Engelmaier | 364 | 134 | 196 | 15 | 415 | |
| Charles J. Vath | 364 | 89 | 220 | 16 | 438 | |
| W. T. Chen | 206 | 323 | 99 | 15 | 470 | |
| Jun Zhang | 140 | 171 | 263 | 27 | 452 | |
| Kyle Yazzie | 197 | 195 | 335 | 21 | 491 | |
| Yuting Zuo | 100 | 98 | 154 | 21 | 445 | |
| Guanhu He | 448 | 48 | 224 | 20 | 566 | |
| Ruyu Tian | 333 | 60 | 343 | 27 | 504 | |
| Gerd Schlottig | 208 | 84 | 280 | 35 | 455 |
All Works
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