Immediate Impact
8 standout
Citing Papers
Improved tribo-corrosion performance of duplex treatment on H13 steel by plasma nitriding and CrAlN coating
2025 Standout
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
2024 Standout
Works of Tong Yan Tee being referenced
INTERFACE FRACTURE TOUGHNESS ASSESSMENT OF SOLDER JOINTS USING DOUBLE CANTILEVER BEAM TEST
2010
Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging
2007
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| Tong Yan Tee | 415 | 118 | 139 | 22 | 451 | |
| Yi-Hsin Pao | 397 | 236 | 179 | 16 | 477 | |
| Charles J. Vath | 364 | 220 | 89 | 16 | 438 | |
| W. T. Chen | 206 | 99 | 323 | 15 | 470 | |
| W. Engelmaier | 364 | 196 | 134 | 15 | 415 | |
| Li Yang | 447 | 85 | 43 | 17 | 502 | |
| Ali Ibrahim | 307 | 118 | 41 | 32 | 439 | |
| Paul G. Harris | 221 | 132 | 66 | 21 | 375 | |
| S. Inoue | 322 | 97 | 103 | 30 | 495 | |
| George G. Harman | 327 | 134 | 78 | 18 | 421 | |
| Minghui Lin | 246 | 134 | 132 | 15 | 381 |
All Works
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