J. C. Bea

Low-dimensional nanostructures for monolithic 3D-integrated flexible and stretchable electronics

Editors’ Choice—Challenges and Opportunities for Developing Electrochemical Biosensors with Commercialization Potential in the Point-of-Care Diagnostics Market

Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film

Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation