E. Meusel

Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management

Machine learning-based fatigue life prediction of metal materials: Perspectives of physics-informed and data-driven hybrid methods

Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints

Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation