Charles J. Vath

28 papers · 707 indexed citations

Immediate Impact

22 hit

Sub-graph 1 of 11

Monolithic three-dimensional integration of complementary two-dimensional field-effect transistors

2024 Hit

Roadmapping the next generation of silicon photonics

2024 Hit

12 intermediate papers

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

2011

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

2009

Peers are selected by citation overlap in the author's most active subfields. citations · hero ref

Author						Papers	Cites
Charles J. Vath	621	299	119	98	66	28	707
Bob Chylak	543 0.9×	224 0.7×	62 0.5×	117 1.2×	79 1.2×	50	631
George G. Harman	526 0.8×	200 0.7×	117 1.0×	74 0.8×	99 1.5×	23	641
E. Ristolainen	618 1.0×	264 0.9×	139 1.2×	44 0.4×	183 2.8×	63	795
C.D. Breach	538 0.9×	366 1.2×	139 1.2×	101 1.0×	140 2.1×	44	759
Yi-Shao Lai	552 0.9×	248 0.8×	223 1.9×	211 2.2×	161 2.4×	41	783
Ren Jialie	320 0.5×	520 1.7×	140 1.2×	40 0.4×	180 2.7×	33	767
Tengfei Jiang	577 0.9×	136 0.5×	65 0.5×	98 1.0×	73 1.1×	45	716
Laura J. Evans	398 0.6×	298 1.0×	108 0.9×	40 0.4×	186 2.8×	39	778
Kyung-Wook Paik	506 0.8×	171 0.6×	138 1.2×	63 0.6×	128 1.9×	36	715
Gaohong Xu	778 1.3×	148 0.5×	98 0.8×	268 2.7×	102 1.5×	47	888

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