Zonghe Lai
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Mechanics of Materials top 10%
- Materials Chemistry
- Mechanical Engineering
- Topics
- Electronic Packaging and Soldering Technologies (26 papers)3D IC and TSV technologies (15 papers)Integrated Circuits and Semiconductor Failure Analysis (6 papers)
- Partner nations
- SwedenChinaUnited States
In The Last Decade
Zonghe Lai
38 papers receiving 654 citations
Peers
Comparison fields: 5 of 43
- Electrical and Electronic Engineering 537
- Biomedical Engineering 195
- Mechanics of Materials 153
- Materials Chemistry 113
- Mechanical Engineering 111
Countries citing papers authored by Zonghe Lai
This map shows the geographic impact of Zonghe Lai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zonghe Lai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zonghe Lai more than expected).
Fields of papers citing papers by Zonghe Lai
This network shows the impact of papers produced by Zonghe Lai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zonghe Lai. The network helps show where Zonghe Lai may publish in the future.
Co-authorship network of co-authors of Zonghe Lai
This figure shows the co-authorship network connecting the top 25 collaborators of Zonghe Lai. A scholar is included among the top collaborators of Zonghe Lai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zonghe Lai. Zonghe Lai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 34 | |
| 3 | 22 | |
| 4 | Electron traps at HfO2/SiOx interfaces | 3 |
| 5 | Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application | 2 |
| 6 | 0 | |
| 7 | Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive | 0 |
| 8 | 2 | |
| 9 | 3 | |
| 10 | 8 | |
| 11 | 8 | |
| 12 | Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate using the peel test with different moisture environment | 1 |
| 13 | Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film | 2 |
| 14 | Reliability of ACA flip-chip joints on FR-4 substrate | 2 |
| 15 | 2 | |
| 16 | 30 | |
| 17 | Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives | 8 |
| 18 | 32 | |
| 19 | 16 | |
| 20 | 31 |
About Zonghe Lai
Zonghe Lai is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Hardware and Architecture, having authored 41 papers that have together received 704 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (15 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (537 citations), Mechanics of Materials (153 citations) and Polymers and Plastics (78 citations). Zonghe Lai has collaborated with scholars based in Sweden, China and United States. Frequent co-authors include Johan Liu, A.R. Thölén, Lilei Ye, Yuxin Song, Xitao Wang, Shumin Wang, Guoliang Chen, Yanli Wang, Liqiang Cao and Ying Fu. Their work appears in journals such as Advanced Materials, Applied Physics Letters and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.