Zonghe Lai

903 total citations
41 papers, 704 citations indexed

About

Zonghe Lai is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Biomedical Engineering. According to data from OpenAlex, Zonghe Lai has authored 41 papers receiving a total of 704 indexed citations (citations by other indexed papers that have themselves been cited), including 33 papers in Electrical and Electronic Engineering, 11 papers in Mechanics of Materials and 9 papers in Biomedical Engineering. Recurrent topics in Zonghe Lai's work include Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (15 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). Zonghe Lai is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (15 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). Zonghe Lai collaborates with scholars based in Sweden, China and United States. Zonghe Lai's co-authors include Johan Liu, A.R. Thölén, Lilei Ye, Yuxin Song, Xitao Wang, Shumin Wang, Yanli Wang, Guoliang Chen, Liqiang Cao and Danqing Yi and has published in prestigious journals such as Advanced Materials, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Zonghe Lai

38 papers receiving 654 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Zonghe Lai Sweden 15 537 195 153 113 111 41 704
Kyung-Wook Paik South Korea 13 507 0.9× 168 0.9× 139 0.9× 128 1.1× 173 1.6× 37 721
P. French United Kingdom 16 125 0.2× 255 1.3× 169 1.1× 172 1.5× 190 1.7× 33 658
Khairudin Mohamed Malaysia 10 307 0.6× 343 1.8× 38 0.2× 197 1.7× 56 0.5× 45 674
Y. C. Lee United States 10 308 0.6× 98 0.5× 50 0.3× 164 1.5× 116 1.0× 38 501
Seonhee Jang United States 10 358 0.7× 250 1.3× 43 0.3× 183 1.6× 89 0.8× 32 531
R. Zabels Latvia 12 137 0.3× 116 0.6× 87 0.6× 186 1.6× 52 0.5× 43 410
J.H. Tortai France 13 285 0.5× 305 1.6× 42 0.3× 219 1.9× 31 0.3× 44 574
Dalius Jucius Lithuania 11 103 0.2× 200 1.0× 60 0.4× 70 0.6× 32 0.3× 32 344
Pavel Škarvada Czechia 11 199 0.4× 158 0.8× 59 0.4× 74 0.7× 94 0.8× 50 439
K. Yatsuzuka Japan 13 309 0.6× 333 1.7× 66 0.4× 86 0.8× 79 0.7× 36 595

Countries citing papers authored by Zonghe Lai

Since Specialization
Citations

This map shows the geographic impact of Zonghe Lai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zonghe Lai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zonghe Lai more than expected).

Fields of papers citing papers by Zonghe Lai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Zonghe Lai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zonghe Lai. The network helps show where Zonghe Lai may publish in the future.

Co-authorship network of co-authors of Zonghe Lai

This figure shows the co-authorship network connecting the top 25 collaborators of Zonghe Lai. A scholar is included among the top collaborators of Zonghe Lai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zonghe Lai. Zonghe Lai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhao, Huan, et al.. (2014). Effect of buffer quality on the performance of InAs/AlSb Heterostructure Backward Tunneling Diode. Chalmers Research (Chalmers University of Technology). 21. 1–2. 1 indexed citations
2.
Fu, Yifeng, Björn Carlberg, Niklas Lindahl, et al.. (2012). Templated Growth of Covalently Bonded Three‐Dimensional Carbon Nanotube Networks Originated from Graphene. Advanced Materials. 24(12). 1576–1581. 34 indexed citations
3.
Song, Yuxin, et al.. (2010). Enhancement of optical quality in metamorphic quantum wells using dilute nitride buffers. Applied Physics Letters. 97(9). 11 indexed citations
4.
Song, Yuxin, et al.. (2009). Effects of doping and grading slope on surface and structure of metamorphic InGaAs buffers on GaAs substrates. Journal of Applied Physics. 106(12). 22 indexed citations
5.
Raeissi, Bahman, et al.. (2008). Electron traps at HfO2/SiOx interfaces. Chalmers Publication Library (Chalmers University of Technology). 3 indexed citations
6.
Lai, Zonghe, et al.. (2006). Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application. Chalmers Publication Library (Chalmers University of Technology). 2 indexed citations
7.
Zhou, Hua, et al.. (2006). Design for embedded chinese display smart card. 2. 152–156.
8.
Cao, Liqiang, et al.. (2005). Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive. Chalmers Publication Library (Chalmers University of Technology).
9.
Lai, Zonghe, et al.. (2005). Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection. Journal of Electronic Packaging. 128(3). 177–183. 2 indexed citations
10.
Lai, Zonghe, et al.. (2004). Thermal fatigue cracking of surface mount conductive adhesive joints. Soldering and Surface Mount Technology. 16(1). 48–52. 8 indexed citations
11.
12.
Cao, Liqiang, Zonghe Lai, & Johan Liu. (2003). Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate using the peel test with different moisture environment. Chalmers Publication Library (Chalmers University of Technology). 15(8). 309–313. 1 indexed citations
13.
Kang, Yilan, Johan Liu, Zonghe Lai, Zhifeng Zhang, & Yu Qiu. (2002). Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film. Chalmers Publication Library (Chalmers University of Technology). 2 indexed citations
14.
Liu, Johan & Zonghe Lai. (2002). Reliability of ACA flip-chip joints on FR-4 substrate. Chalmers Publication Library (Chalmers University of Technology). 2 indexed citations
15.
Mannan, S.H., et al.. (2002). The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrate. Loughborough University Institutional Repository (Loughborough University). 2 indexed citations
16.
Li, Li, et al.. (2002). Reliability and failure mechanism of isotropically conductive adhesives joints. 114–120. 15 indexed citations
17.
Fu, Ying, Yanli Wang, Xitao Wang, et al.. (2000). Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives. Chalmers Publication Library (Chalmers University of Technology). 8 indexed citations
18.
Fu, Ying, Yanli Wang, Xitao Wang, et al.. (2000). Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesive. IEEE Transactions on Advanced Packaging. 23(1). 15–21. 32 indexed citations
19.
Lai, Zonghe, et al.. (1998). EFFECT OF BUMP HEIGHT ON THE RELIABILITY OF ACA FLIP CHIP JOINING WITH FR4 RIGID AND POLYIMIDE FLEXIBLE SUBSTRATE. Journal of Electronics Manufacturing. 8(03n04). 217–224. 16 indexed citations
20.
Yi, Danqing, et al.. (1998). Ternary alloying study of MoSi2. Metallurgical and Materials Transactions A. 29(1). 119–129. 31 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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