This map shows the geographic impact of Johan Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Johan Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Johan Liu more than expected).
This network shows the impact of papers produced by Johan Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Johan Liu. The network helps show where Johan Liu may publish in the future.
Co-authorship network of co-authors of Johan Liu
This figure shows the co-authorship network connecting the top 25 collaborators of Johan Liu.
A scholar is included among the top collaborators of Johan Liu based on the total number of
citations received by their joint publications. Widths of edges
represent the number of papers authors have co-authored together.
Node borders
signify the number of papers an author published with Johan Liu. Johan Liu is excluded from
the visualization to improve readability, since they are connected to all nodes in the network.
Zehri, Abdelhafid, Josef Hansson, Lilei Ye, Yifeng Fu, & Johan Liu. (2016). Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art. Chalmers Research (Chalmers University of Technology).1 indexed citations
Gao, Zhaoli, Yong Zhang, Yifeng Fu, M.M.F. Yuen, & Johan Liu. (2012). Graphene heat spreader for thermal management of hot spots in electronic packaging. Chalmers Publication Library (Chalmers University of Technology). 217–220.13 indexed citations
10.
Zhang, Yan, et al.. (2009). Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive. Chalmers Publication Library (Chalmers University of Technology).2 indexed citations
11.
Wang, Teng, Björn Carlberg, & Johan Liu. (2007). Development and Characterization of Carbon Nanotube-based Bumps for Ultra Fine Pitch Flip Chip Interconnection. Chalmers Publication Library (Chalmers University of Technology).1 indexed citations
12.
Liu, Johan. (2007). Manufacturing and Characterisation of Silver nano particles based Nano Thermal Interface material. Chalmers Publication Library (Chalmers University of Technology).1 indexed citations
13.
Liu, Johan. (2006). Development of nanosolders and nanothermal interface materials and cooling devices based on nanocarbon tubes. Chalmers Publication Library (Chalmers University of Technology).1 indexed citations
14.
Lai, Zonghe, et al.. (2006). Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application. Chalmers Publication Library (Chalmers University of Technology).2 indexed citations
15.
Cao, Liqiang, et al.. (2005). Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive. Chalmers Publication Library (Chalmers University of Technology).
16.
Liu, Johan, et al.. (2003). Design and Development of Thin Film and LCP-Based System-on-Package Modules for RF/Wireless Applications. Chalmers Publication Library (Chalmers University of Technology).7 indexed citations
17.
Kang, Yilan, Johan Liu, Zonghe Lai, Zhifeng Zhang, & Yu Qiu. (2002). Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film. Chalmers Publication Library (Chalmers University of Technology).2 indexed citations
18.
Liu, Johan & Zonghe Lai. (2002). Reliability of ACA flip-chip joints on FR-4 substrate. Chalmers Publication Library (Chalmers University of Technology).2 indexed citations
19.
Pinardi, K., et al.. (2000). Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application. Chalmers Publication Library (Chalmers University of Technology).4 indexed citations
20.
Fu, Ying, Yanli Wang, Xitao Wang, et al.. (2000). Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives. Chalmers Publication Library (Chalmers University of Technology).8 indexed citations
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive
bibliographic database. While OpenAlex provides broad and valuable coverage of the global
research landscape, it—like all bibliographic datasets—has inherent limitations. These include
incomplete records, variations in author disambiguation, differences in journal indexing, and
delays in data updates. As a result, some metrics and network relationships displayed in
Rankless may not fully capture the entirety of a scholar's output or impact.