Wei Dai

1.3k total citations
61 papers, 1.1k citations indexed

About

Wei Dai is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Aerospace Engineering. According to data from OpenAlex, Wei Dai has authored 61 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Mechanical Engineering, 25 papers in Electrical and Electronic Engineering and 16 papers in Aerospace Engineering. Recurrent topics in Wei Dai's work include Aluminum Alloy Microstructure Properties (15 papers), Aluminum Alloys Composites Properties (14 papers) and Advanced Welding Techniques Analysis (12 papers). Wei Dai is often cited by papers focused on Aluminum Alloy Microstructure Properties (15 papers), Aluminum Alloys Composites Properties (14 papers) and Advanced Welding Techniques Analysis (12 papers). Wei Dai collaborates with scholars based in China, United States and Germany. Wei Dai's co-authors include Songbai Xue, Feng Ji, Lili Gao, Liang Zhang, Guang Zeng, Guang Zeng, Liang Zhang, YU Sheng-lin, Shulin Lü and Shusen Wu and has published in prestigious journals such as Biomaterials, Materials Science and Engineering A and Expert Systems with Applications.

In The Last Decade

Wei Dai

58 papers receiving 1.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Wei Dai China 19 760 490 319 172 100 61 1.1k
S. Ranganathan India 12 756 1.0× 319 0.7× 115 0.4× 175 1.0× 72 0.7× 35 897
Che Chung Wang Taiwan 17 1.0k 1.3× 619 1.3× 73 0.2× 146 0.8× 61 0.6× 21 1.3k
Jinbao Li China 14 270 0.4× 128 0.3× 194 0.6× 153 0.9× 48 0.5× 52 512
Mingfang Wu China 20 677 0.9× 394 0.8× 187 0.6× 283 1.6× 116 1.2× 72 1.3k
Yilin Wang China 17 514 0.7× 122 0.2× 118 0.4× 157 0.9× 160 1.6× 59 1.4k
Yingdong Qu China 18 832 1.1× 70 0.1× 568 1.8× 493 2.9× 104 1.0× 118 1.1k
Olivér Krammer Hungary 17 376 0.5× 646 1.3× 60 0.2× 65 0.4× 117 1.2× 112 904

Countries citing papers authored by Wei Dai

Since Specialization
Citations

This map shows the geographic impact of Wei Dai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei Dai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei Dai more than expected).

Fields of papers citing papers by Wei Dai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wei Dai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei Dai. The network helps show where Wei Dai may publish in the future.

Co-authorship network of co-authors of Wei Dai

This figure shows the co-authorship network connecting the top 25 collaborators of Wei Dai. A scholar is included among the top collaborators of Wei Dai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wei Dai. Wei Dai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Dai, Wei, et al.. (2025). Surface integrity deterioration by the volcano-like craters eruption during pulse laser polishing of NAK80 tool steel. Optics & Laser Technology. 184. 112470–112470. 1 indexed citations
2.
Dai, Wei, Fan Yin, Xiao Liu, et al.. (2025). Systematic study of α decay half-life within cluster-formation model*. Chinese Physics C. 50(1). 14103–14103. 1 indexed citations
3.
4.
Kan, Lili, et al.. (2024). Red mud-derived activator to develop greener engineered geopolymer composite. Ceramics International. 51(5). 6799–6806. 8 indexed citations
5.
Zheng, Xinyao, Shaohui Deng, Yuan Li, et al.. (2024). Targeting m6A demethylase FTO to heal diabetic wounds with ROS-scavenging nanocolloidal hydrogels. Biomaterials. 317. 123065–123065. 8 indexed citations
6.
Dai, Wei, C. S. Fang, Xiaowen Wu, Zhizhen Zheng, & Jianjun Li. (2024). Enhanced Wear Properties of an Inspired Fish-Scale Film Structure in Terms of Microstructured Self-Lubrication Induced Effects by High-Speed Laser Surface Remelting Processing. International Journal of Precision Engineering and Manufacturing-Green Technology. 11(3). 833–847. 5 indexed citations
7.
Temmler, André, et al.. (2020). Experimental investigation on surface structuring by laser remelting (WaveShape) on Inconel 718 using varying laser beam diameters and scan speeds. Applied Surface Science. 541. 147814–147814. 18 indexed citations
8.
Dai, Wei, et al.. (2016). Feature article: Network Neutrality [Neutrality between a vertically integrated cable provider and an over-the-top video provider]. Journal of Communications and Networks. 18(6). 962–974. 4 indexed citations
9.
Guo, Jingdong, et al.. (2015). Microstructure evolution in metals induced by high density electric current pulses. Materials Science and Technology. 31(13). 1545–1554. 45 indexed citations
10.
Xue, Songbai, et al.. (2014). Development of novel CsF–RbF–AlF3 flux for brazing aluminum to stainless steel with Zn–Al filler metal. Materials & Design (1980-2015). 64. 110–115. 25 indexed citations
11.
Dai, Wei, et al.. (2013). Brazing 6061 aluminum alloy with Al-Si-Zn filler metals containing Sr. International Journal of Minerals Metallurgy and Materials. 20(4). 365–370. 22 indexed citations
12.
Dai, Wei, et al.. (2012). Microstructure and Properties of 6061 Aluminum Alloy Brazing Joint with Al–Si–Zn Filler Metal. MATERIALS TRANSACTIONS. 53(9). 1638–1643. 18 indexed citations
13.
Lü, Shulin, Shusen Wu, Wei Dai, Chong Lin, & Ping An. (2012). The indirect ultrasonic vibration process for rheo-squeeze casting of A356 aluminum alloy. Journal of Materials Processing Technology. 212(6). 1281–1287. 53 indexed citations
14.
Dai, Wei, Shusen Wu, Shulin Lü, & Chong Lin. (2012). Effects of rheo-squeeze casting parameters on microstructure and mechanical properties of AlCuMnTi alloy. Materials Science and Engineering A. 538. 320–326. 46 indexed citations
15.
Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2011). Microstructure characterization of SnAgCu solder bearing Ce for electronic packaging. Microelectronic Engineering. 88(9). 2848–2851. 20 indexed citations
16.
Zhang, Liang, Songbai Xue, Lili Gao, et al.. (2011). Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints. Soldering and Surface Mount Technology. 23(1). 4–9. 7 indexed citations
17.
Zeng, Guang, et al.. (2010). A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates. Journal of Materials Science Materials in Electronics. 21(5). 421–440. 136 indexed citations
18.
19.
Dai, Wei, Weiguo Sun, Hao Feng, & Yongjian Tang. (2007). Studies on differential cross-sections of e–N2scattering. Molecular Physics. 105(23-24). 2935–2944. 1 indexed citations
20.
Dai, Wei, et al.. (2006). Studies on vibrational excitation differential cross-sections of low-energy electron scattering from N2 molecule. The European Physical Journal D. 39(3). 385–389. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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