Yishu Wang

843 total citations
83 papers, 638 citations indexed

About

Yishu Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Yishu Wang has authored 83 papers receiving a total of 638 indexed citations (citations by other indexed papers that have themselves been cited), including 50 papers in Electrical and Electronic Engineering, 32 papers in Mechanical Engineering and 15 papers in Materials Chemistry. Recurrent topics in Yishu Wang's work include Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (27 papers) and Aluminum Alloys Composites Properties (13 papers). Yishu Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (27 papers) and Aluminum Alloys Composites Properties (13 papers). Yishu Wang collaborates with scholars based in China, United States and Japan. Yishu Wang's co-authors include Fu Guo, Fu Guo, Xiaolu Wang, Sihong Liu, Yufeng Wu, Limin Ma, Xingquan He, Bowen Zhang, Jing Han and Qiang Jia and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and Journal of Cleaner Production.

In The Last Decade

Yishu Wang

75 papers receiving 627 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yishu Wang China 14 287 243 112 105 88 83 638
Hao Shi China 14 97 0.3× 155 0.6× 101 0.9× 90 0.9× 34 0.4× 38 611
Dongyan Liu China 11 134 0.5× 318 1.3× 185 1.7× 140 1.3× 64 0.7× 40 626
Weijie Chen China 12 101 0.4× 167 0.7× 249 2.2× 147 1.4× 75 0.9× 31 661
Guanwei Jia China 14 159 0.6× 113 0.5× 250 2.2× 182 1.7× 52 0.6× 44 749
Botao Lin China 19 172 0.6× 249 1.0× 208 1.9× 232 2.2× 50 0.6× 48 818
Xin Wei China 15 203 0.7× 169 0.7× 215 1.9× 161 1.5× 33 0.4× 82 767
Zhiheng Cheng China 9 186 0.6× 180 0.7× 29 0.3× 39 0.4× 56 0.6× 16 427
Yongwei Li China 14 222 0.8× 93 0.4× 88 0.8× 343 3.3× 194 2.2× 70 839
Dongying Wang China 17 142 0.5× 250 1.0× 59 0.5× 151 1.4× 90 1.0× 55 806
Bin Gu China 15 62 0.2× 162 0.7× 67 0.6× 129 1.2× 173 2.0× 32 639

Countries citing papers authored by Yishu Wang

Since Specialization
Citations

This map shows the geographic impact of Yishu Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yishu Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yishu Wang more than expected).

Fields of papers citing papers by Yishu Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yishu Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yishu Wang. The network helps show where Yishu Wang may publish in the future.

Co-authorship network of co-authors of Yishu Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Yishu Wang. A scholar is included among the top collaborators of Yishu Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yishu Wang. Yishu Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wang, Yishu, et al.. (2025). Preventing alkali-injury in heavy metal-free preserved eggs: Model development. Journal of Food Composition and Analysis. 140. 107285–107285. 1 indexed citations
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Han, Jing, et al.. (2025). Failure analysis and simulation of IGBT under active and passive thermal cycling. Microelectronics Reliability. 167. 115638–115638. 1 indexed citations
4.
Hu, Huan, Qiang Jia, Yishu Wang, et al.. (2024). Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging. Journal of Materials Processing Technology. 329. 118438–118438. 4 indexed citations
5.
Liu, Aiwei, et al.. (2024). Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging. Engineering Fracture Mechanics. 307. 110265–110265. 1 indexed citations
6.
Liu, Aiwei, et al.. (2024). Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field. Journal of Materials Processing Technology. 326. 118345–118345. 3 indexed citations
7.
Jia, Qiang, Yishu Wang, Dan Li, et al.. (2024). Preparation of Ag-Cu nanoparticle film using a dual-beam pulsed laser deposition for power electronic packaging. Journal of Laser Applications. 36(2). 2 indexed citations
8.
Han, Jing, et al.. (2023). Study on morphology and interface relationship between Ag3(Sn, In) and Cu6(Sn, In)5. Materials Chemistry and Physics. 297. 127402–127402. 3 indexed citations
9.
Ma, Limin, et al.. (2023). Pressure dependence of mechanical and thermodynamic properties of Al2Si4Sr3: A first-principles study. Computational and Theoretical Chemistry. 1230. 114400–114400. 1 indexed citations
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Wang, Xiaolu, et al.. (2023). Improved Polyol Syntheses of Silver Right Bipyramids and Nanorods: Camphorquinone-Mediated Morphology Control Methods. Crystal Growth & Design. 23(3). 1455–1465. 8 indexed citations
14.
Gao, Qian, et al.. (2023). Investigation of ethylene glycol, α-terpineol, and polyethylene glycol 400 on the sintering properties of Cu–Ag core–shell micro/nano-mixed paste. Journal of Materials Science Materials in Electronics. 34(21). 6 indexed citations
15.
Wang, Xiaolu, et al.. (2023). Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition. Journal of Material Cycles and Waste Management. 25(2). 1108–1119. 9 indexed citations
16.
Wang, Yishu, et al.. (2023). A new bio-oxidation method for removing iron deposits from waterlogged wood of Nanhai I shipwreck, Guangdong, China. SHILAP Revista de lepidopterología. 4(1). 100107–100107. 3 indexed citations
17.
Han, Jing, et al.. (2023). Effect of different IMCs on the crystal orientation of IMCs/solder joint/Cu. Journal of Materials Science Materials in Electronics. 34(3).
18.
Wang, Xiaolu, et al.. (2022). Optimizing the Leaching Parameters and Studying the Kinetics of Copper Recovery from Waste Printed Circuit Boards. ACS Omega. 7(4). 3689–3699. 50 indexed citations
19.
Wang, Yishu, et al.. (2020). Effect of Sn Grain c-Axis on Cu Atomic Motion in Cu Reinforced Composite Solder Joints Under Electromigration. Journal of Electronic Materials. 49(3). 2159–2163. 4 indexed citations
20.
Liu, Sihong, et al.. (2018). Experimental study on crushable coarse granular materials during monotonic simple shear tests. Geomechanics and Engineering. 15(1). 687–694. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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