Yishu Wang
Impact in
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- Recycling and Waste Management Techniques
- Mechanical Engineering top 10%
- Extraction and Separation Processes
- Aluminum Alloys Composites Properties
Papers in
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- Electronic Packaging and Soldering Technologies 39
- 3D IC and TSV technologies 27
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- Aluminum Alloys Composites Properties 13
- Advanced Welding Techniques Analysis 10
- Intermetallics and Advanced Alloy Properties 5
- Co-authors
- Fu Guo (24 shared papers)Fu Guo (31 shared papers)Xiaolu Wang (8 shared papers)Sihong Liu (5 shared papers)Yufeng Wu (7 shared papers)Limin Ma (26 shared papers)Bowen Zhang (4 shared papers)Xingquan He (4 shared papers)
- Journals
- Journal of Materials Science Materials in Electronics (11 papers)Journal of Electronic Materials (11 papers)Materials Characterization (4 papers)RSC Advances (3 papers)Journal of Materials Science (3 papers)
- Partner nations
- ChinaUnited StatesJapan
In The Last Decade
Yishu Wang
75 papers receiving 627 citations
Peers
Comparison fields: 5 of 74
- Industrial and Manufacturing Engineering 71
- Mechanical Engineering 243
- Management, Monitoring, Policy and Law 65
- Civil and Structural Engineering 112
- Electrical and Electronic Engineering 287
Countries citing papers authored by Yishu Wang
This map shows the geographic impact of Yishu Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yishu Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yishu Wang more than expected).
Fields of papers citing papers by Yishu Wang
This network shows the impact of papers produced by Yishu Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yishu Wang. The network helps show where Yishu Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Yishu Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 83 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 50 | |
| 2 | 2015 | 37 | |
| 3 | 2020 | 36 | |
| 4 | 2018 | 32 | |
| 5 | 2022 | 27 | |
| 6 | 2024 | 19 | |
| 7 | 2022 | 18 | |
| 8 | 2023 | 17 | |
| 9 | 2015 | 17 | |
| 10 | 2023 | 16 | |
| 11 | 2009 | 14 | |
| 12 | 2020 | 13 | |
| 13 | 2014 | 13 | |
| 14 | 2022 | 13 | |
| 15 | 2018 | 11 | |
| 16 | 2016 | 11 | |
| 17 | 2022 | 11 | |
| 18 | 2018 | 11 | |
| 19 | 2022 | 11 | |
| 20 | 2017 | 11 |
About Yishu Wang
Yishu Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Civil and Structural Engineering and Electronic, Optical and Magnetic Materials, having authored 83 papers that have together received 638 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (27 papers), Aluminum Alloys Composites Properties (13 papers), Advanced Welding Techniques Analysis (10 papers), Geotechnical Engineering and Soil Mechanics (6 papers), Recycling and Waste Management Techniques (5 papers), Copper Interconnects and Reliability (5 papers) and Intermetallics and Advanced Alloy Properties (5 papers). The work is most often cited by research in Industrial and Manufacturing Engineering (71 citations), Mechanical Engineering (243 citations), Management, Monitoring, Policy and Law (65 citations), Civil and Structural Engineering (112 citations) and Electrical and Electronic Engineering (287 citations). Yishu Wang has collaborated with scholars based in China, United States and Japan. Frequent co-authors include Fu Guo, Fu Guo, Xiaolu Wang, Sihong Liu, Yufeng Wu, Limin Ma, Bowen Zhang, Xingquan He, Qiang Jia and Jing Han. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Journal of Electronic Materials, Materials Characterization, RSC Advances and Journal of Materials Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.