Chengdi Xiao
- Electrical and Electronic Engineering
- Mechanical Engineering
- Materials Chemistry
- Biomedical Engineering
- Civil and Structural Engineering
- Co-authors
- Junhui LiWenhui ZhuXixin RaoHailong LiaoHu HeHaitao ZhangYan WangCheng Jin
- Topics
- 3D IC and TSV technologies (10 papers)Heat Transfer and Optimization (8 papers)Electronic Packaging and Soldering Technologies (8 papers)
- Cited by
- Mechanical EngineeringIndustrial and Manufacturing EngineeringElectrical and Electronic Engineering
- Journals
- IEEE Transactions on Industrial ElectronicsInternational Journal of Heat and Mass TransferIEEE Access
- Partner nations
- China
In The Last Decade
Chengdi Xiao
31 papers receiving 295 citations
Peers
Comparison fields: 5 of 54
- Electrical and Electronic Engineering 133
- Mechanical Engineering 127
- Materials Chemistry 64
- Biomedical Engineering 42
- Civil and Structural Engineering 29
Countries citing papers authored by Chengdi Xiao
This map shows the geographic impact of Chengdi Xiao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chengdi Xiao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chengdi Xiao more than expected).
Fields of papers citing papers by Chengdi Xiao
This network shows the impact of papers produced by Chengdi Xiao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chengdi Xiao. The network helps show where Chengdi Xiao may publish in the future.
Co-authorship network of co-authors of Chengdi Xiao
This figure shows the co-authorship network connecting the top 25 collaborators of Chengdi Xiao. A scholar is included among the top collaborators of Chengdi Xiao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chengdi Xiao. Chengdi Xiao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 0 | |
| 5 | 1 | |
| 6 | 10 | |
| 7 | 3 | |
| 8 | 5 | |
| 9 | 47 | |
| 10 | 2 | |
| 11 | 1 | |
| 12 | 2 | |
| 13 | 2 | |
| 14 | 14 | |
| 15 | 11 | |
| 16 | 4 | |
| 17 | 1 | |
| 18 | 1 | |
| 19 | 3 | |
| 20 | 6 |
About Chengdi Xiao
Chengdi Xiao is a scholar working on Industrial and Manufacturing Engineering, Ceramics and Composites and Automotive Engineering, having authored 34 papers that have together received 299 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (10 papers), Heat Transfer and Optimization (8 papers) and Electronic Packaging and Soldering Technologies (8 papers). The work is most often cited by research in Mechanical Engineering (127 citations), Industrial and Manufacturing Engineering (27 citations) and Electrical and Electronic Engineering (133 citations). Chengdi Xiao has collaborated with scholars based in China. Frequent co-authors include Junhui Li, Wenhui Zhu, Xixin Rao, Hailong Liao, Hu He, Haitao Zhang, Yan Wang, Cheng Jin, Guolong Cui and Can Zhou. Their work appears in journals such as IEEE Transactions on Industrial Electronics, International Journal of Heat and Mass Transfer and IEEE Access.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.