Won Sik Hong
- Electrical and Electronic Engineering
- Mechanical Engineering
- Renewable Energy, Sustainability and the Environment
- Materials Chemistry
- Condensed Matter Physics
- Co-authors
- Chulmin OhMi Song KimDajung KimJong‐Woong KimNamsu KimDae‐Gon KimKyung‐Jun HwangChangwoon Han
- Topics
- Electronic Packaging and Soldering Technologies (34 papers)3D IC and TSV technologies (23 papers)Advanced Welding Techniques Analysis (13 papers)
- Cited by
- Electrical and Electronic EngineeringMechanical EngineeringRenewable Energy, Sustainability and the Environment
- Journals
- IEEE Transactions on Industry ApplicationsSolar Energy Materials and Solar CellsSAE technical papers on CD-ROM/SAE technical paper series
- Partner nations
- South Korea
In The Last Decade
Won Sik Hong
35 papers receiving 314 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 268
- Mechanical Engineering 144
- Renewable Energy, Sustainability and the Environment 39
- Materials Chemistry 35
- Condensed Matter Physics 24
Countries citing papers authored by Won Sik Hong
This map shows the geographic impact of Won Sik Hong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Won Sik Hong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Won Sik Hong more than expected).
Fields of papers citing papers by Won Sik Hong
This network shows the impact of papers produced by Won Sik Hong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Won Sik Hong. The network helps show where Won Sik Hong may publish in the future.
Co-authorship network of co-authors of Won Sik Hong
This figure shows the co-authorship network connecting the top 25 collaborators of Won Sik Hong. A scholar is included among the top collaborators of Won Sik Hong based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Won Sik Hong. Won Sik Hong is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 3 | |
| 5 | 1 | |
| 6 | 1 | |
| 7 | 2 | |
| 8 | 4 | |
| 9 | 4 | |
| 10 | 5 | |
| 11 | 2 | |
| 12 | 12 | |
| 13 | 1 | |
| 14 | 13 | |
| 15 | 12 | |
| 16 | 8 | |
| 17 | 29 | |
| 18 | 4 | |
| 19 | 2 | |
| 20 | The Interfacial Reactions and Reliability of SnAgCu Solder Joints under Thermal Shock Cycles | 3 |
About Won Sik Hong
Won Sik Hong is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Ceramics and Composites, having authored 42 papers that have together received 333 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (23 papers) and Advanced Welding Techniques Analysis (13 papers). The work is most often cited by research in Electrical and Electronic Engineering (268 citations), Mechanical Engineering (144 citations) and Renewable Energy, Sustainability and the Environment (39 citations). Won Sik Hong has collaborated with scholars based in South Korea. Frequent co-authors include Chulmin Oh, Mi Song Kim, Dajung Kim, Jong‐Woong Kim, Namsu Kim, Dae‐Gon Kim, Kyung‐Jun Hwang, Changwoon Han, Seung‐Boo Jung and Young‐Seok Kim. Their work appears in journals such as IEEE Transactions on Industry Applications, Solar Energy Materials and Solar Cells and SAE technical papers on CD-ROM/SAE technical paper series.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.