Dajung Kim

880 citations
36 papers · 661 indexed · h-index 13
Topics
Electronic Packaging and Soldering Technologies (10 papers)3D IC and TSV technologies (6 papers)Topological Materials and Phenomena (6 papers)

In The Last Decade

Dajung Kim

31 papers receiving 645 citations

Peers

Dajung Kim
Comparison fields: 5 of 92
  • Materials Chemistry 260
  • Electrical and Electronic Engineering 182
  • Renewable Energy, Sustainability and the Environment 166
  • Biomedical Engineering 144
  • Biomaterials 99
Replace Rike Yudianti with:
Rike Yudianti Indonesia
Saud Hashmi Pakistan
Lü Shaojie China
J. Andrés Ortiz Chile
Maryam Al‐Ejji Qatar
Zefeng Wang China
Xiaoping Qin China
Aurel Diacon Romania
Han Xue China
Fatma A. Taher Egypt
Dajung Kim relative to Rike Yudianti Indonesia Rike Yudianti's profile →
Citations per field
00.5×1.5×2.0×
Rike Yudianti · 1×
Citations per year

Countries citing papers authored by Dajung Kim

Since Specialization
Citations

This map shows the geographic impact of Dajung Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dajung Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dajung Kim more than expected).

Fields of papers citing papers by Dajung Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dajung Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dajung Kim. The network helps show where Dajung Kim may publish in the future.

Co-authorship network of co-authors of Dajung Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Dajung Kim. A scholar is included among the top collaborators of Dajung Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dajung Kim. Dajung Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
#WorkIndexed citations
1 0
2 0
3 0
4 2
5 3
6 0
7 4
8 1
9 4
10 6
11 4
12 11
13 36
14 56
15 13
16 18
17 2
18 2
19 33
20 5

About Dajung Kim

Dajung Kim is a scholar working on Molecular Medicine, Renewable Energy, Sustainability and the Environment and Electrical and Electronic Engineering, having authored 36 papers that have together received 661 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (6 papers) and Topological Materials and Phenomena (6 papers). The work is most often cited by research in Renewable Energy, Sustainability and the Environment (166 citations), Molecular Medicine (50 citations) and Biomaterials (99 citations). Dajung Kim has collaborated with scholars based in South Korea, United States and United Kingdom. Frequent co-authors include Ara Joe, Kwang-Hwan Jhee, Seho Park, Eue‐Soon Jang, Namsu Kim, Hyo Won Lee, Seunho Jung, Chulmin Oh, Kyung‐Jun Hwang and Won Sik Hong. Their work appears in journals such as ACS Nano, Bioresource Technology and Energy.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Rankless by CCL
2026