Chulmin Oh

649 total citations
52 papers, 475 citations indexed

About

Chulmin Oh is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Chulmin Oh has authored 52 papers receiving a total of 475 indexed citations (citations by other indexed papers that have themselves been cited), including 42 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 9 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Chulmin Oh's work include Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (23 papers) and Copper Interconnects and Reliability (8 papers). Chulmin Oh is often cited by papers focused on Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (23 papers) and Copper Interconnects and Reliability (8 papers). Chulmin Oh collaborates with scholars based in South Korea, Japan and Taiwan. Chulmin Oh's co-authors include Katsuaki Suganuma, Shijo Nagao, Won Sik Hong, Dajung Kim, Mi Song Kim, Keun Lee, Hao Zhang, Yuchen Liu, Shih‐kang Lin and Changwoon Han and has published in prestigious journals such as Applied Physics Letters, Scientific Reports and Solar Energy Materials and Solar Cells.

In The Last Decade

Chulmin Oh

44 papers receiving 451 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chulmin Oh South Korea 12 372 187 67 31 26 52 475
Junting Liu China 12 122 0.3× 146 0.8× 41 0.6× 10 0.3× 15 0.6× 34 446
Stéphane Lefebvre France 13 443 1.2× 82 0.4× 17 0.3× 9 0.3× 7 0.3× 63 628
Yuyi Li China 8 296 0.8× 61 0.3× 66 1.0× 8 0.3× 14 0.5× 18 396
Christine James United States 6 640 1.7× 256 1.4× 80 1.2× 7 0.2× 32 1.2× 13 779
Jiatong Zhang China 12 143 0.4× 112 0.6× 18 0.3× 4 0.1× 60 2.3× 38 413
Yuxiang Liu China 14 64 0.2× 206 1.1× 42 0.6× 20 0.6× 15 0.6× 42 528
Taosheng Wang China 11 353 0.9× 77 0.4× 159 2.4× 12 0.4× 54 2.1× 20 623
Chaoliang Zheng China 12 237 0.6× 108 0.6× 67 1.0× 2 0.1× 7 0.3× 23 310

Countries citing papers authored by Chulmin Oh

Since Specialization
Citations

This map shows the geographic impact of Chulmin Oh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chulmin Oh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chulmin Oh more than expected).

Fields of papers citing papers by Chulmin Oh

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chulmin Oh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chulmin Oh. The network helps show where Chulmin Oh may publish in the future.

Co-authorship network of co-authors of Chulmin Oh

This figure shows the co-authorship network connecting the top 25 collaborators of Chulmin Oh. A scholar is included among the top collaborators of Chulmin Oh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chulmin Oh. Chulmin Oh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kim, Dajung, et al.. (2025). Enhancing long-term thermal reliability of sintered joints through the use of silver-coated copper particles. Microelectronics Reliability. 167. 115654–115654.
2.
3.
Kim, Dajung, et al.. (2025). Pressureless Cu@Ag sintering process with formic acid reducing agent for improved bonding of power semiconductors. Journal of Materials Science Materials in Electronics. 36(9).
4.
Kim, Hyeon Tae, et al.. (2024). Impact of bonding methods and surface finishes on terminal-substrate reliability in EV power modules. Journal of Materials Science Materials in Electronics. 35(23). 1 indexed citations
5.
6.
Hong, Won Sik, Mi Song Kim, & Chulmin Oh. (2019). Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate. Journal of Electronic Materials. 49(1). 188–195. 12 indexed citations
7.
Hong, Won Sik & Chulmin Oh. (2019). Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards. Journal of Electronic Materials. 49(1). 48–58. 8 indexed citations
8.
Hong, Won Sik, et al.. (2019). Pressureless Silver Sintering of Silicon-Carbide Power Modules for Electric Vehicles. JOM. 72(2). 889–897. 29 indexed citations
9.
Oh, Chulmin, et al.. (2019). Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module. Journal of Welding and Joining. 37(2). 15–20. 6 indexed citations
10.
Oh, Chulmin, et al.. (2018). Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive. Journal of Welding and Joining. 36(3). 57–64. 4 indexed citations
11.
Hong, Won Sik, Mi Song Kim, Dajung Kim, & Chulmin Oh. (2018). Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module. Journal of Electronic Materials. 48(1). 122–134. 18 indexed citations
12.
Lin, Shih‐kang, Shijo Nagao, Chulmin Oh, et al.. (2016). Nano-volcanic Eruption of Silver. Scientific Reports. 6(1). 34769–34769. 71 indexed citations
13.
Kim, Dajung, et al.. (2016). Degradation of Backsheets for Crystalline Photovoltaic Modules under Damp Heat Test. New & Renewable Energy. 12(3). 36–43. 2 indexed citations
14.
Fwa, T. F. & Chulmin Oh. (2014). Effect of moisture content on measured properties of asphalt mixtures. National University of Singapore.
15.
Han, Changwoon, et al.. (2011). Life Prediction Model Development of BGA Solder Joint Under Random Vibration. 987–988. 1 indexed citations
16.
Oh, Chulmin, et al.. (2009). The Interfacial Reactions and Reliability of SnAgCu Solder Joints under Thermal Shock Cycles. 47(8). 500–507. 3 indexed citations
17.
Park, Nochang, et al.. (2009). Fatigue life prediction of plated through holes(PTH) under thermal cycling. European Microelectronics and Packaging Conference. 1–4. 4 indexed citations
18.
Oh, Chulmin, et al.. (2009). PoF Based Accelerated Life Prediction with 3 Dimensional Packaging Technology Development. Journal of Welding and Joining. 27(3). 10–16. 5 indexed citations
19.
Oh, Chulmin, et al.. (2008). Solder Joints Fatigue Life of BGA Package with OSP and ENIG Surface Finish. 46(2). 80–87. 4 indexed citations
20.
Oh, Chulmin, et al.. (1997). AN EFFICIENT PHOTOINDUCED CYCLOPROPYL RING OPENING REACTION OF 2-PHENYL-4-CYCLOPROPYLMETHYLIDENE-5(4H)-OXAZOLONE. Bulletin of the Korean Chemical Society. 18(11). 1137–1139.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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