Trevor Clark
Impact in
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- Microstructure and mechanical properties
- Ferroelectric and Piezoelectric Materials
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- Nanowire Synthesis and Applications
Papers in
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- Semiconductor materials and devices 4
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- Microstructure and mechanical properties 6
- Co-authors
- Christopher L. Muhlstein (5 shared papers)Elizabeth C. Dickey (1 shared paper)Kok‐Keong Lew (1 shared paper)Joan M. Redwing (1 shared paper)Ling Pan (1 shared paper)Suveen N. Mathaudhu (5 shared papers)Stephen F. Poterala (1 shared paper)Richard J. Meyer (1 shared paper)
- Journals
- Microscopy and Microanalysis (3 papers)Journal of Applied Physics (2 papers)Journal of Visualized Experiments (2 papers)Acta Materialia (2 papers)Microelectronics Reliability (1 paper)
- Partner nations
- United StatesFranceChina
In The Last Decade
Trevor Clark
34 papers receiving 556 citations
Peers
Comparison fields: 5 of 57
- Materials Chemistry 290
- Biomedical Engineering 206
- Electronic, Optical and Magnetic Materials 83
- Electrical and Electronic Engineering 246
- Mechanical Engineering 151
Countries citing papers authored by Trevor Clark
This map shows the geographic impact of Trevor Clark's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Trevor Clark with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Trevor Clark more than expected).
Fields of papers citing papers by Trevor Clark
This network shows the impact of papers produced by Trevor Clark. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Trevor Clark. The network helps show where Trevor Clark may publish in the future.
Co-authors
The 25 scholars most cited alongside Trevor Clark, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 34 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 124 | |
| 2 | 2010 | 71 | |
| 3 | 2010 | 49 | |
| 4 | 2017 | 47 | |
| 5 | 2015 | 34 | |
| 6 | 2011 | 29 | |
| 7 | 1975 | 24 | |
| 8 | 2009 | 19 | |
| 9 | 2017 | 17 | |
| 10 | 2009 | 16 | |
| 11 | 2008 | 15 | |
| 12 | 2010 | 14 | |
| 13 | 2010 | 13 | |
| 14 | 2021 | 12 | |
| 15 | 2019 | 11 | |
| 16 | 2019 | 10 | |
| 17 | 2019 | 9 | |
| 18 | 2023 | 8 | |
| 19 | 2014 | 8 | |
| 20 | 2019 | 7 |
About Trevor Clark
Trevor Clark is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 34 papers that have together received 571 indexed citations. Recurring topics across this work include Microstructure and mechanical properties (6 papers), Electron and X-Ray Spectroscopy Techniques (5 papers), High-Temperature Coating Behaviors (4 papers), Advanced materials and composites (4 papers), Metal and Thin Film Mechanics (4 papers), Semiconductor materials and devices (4 papers), Ion-surface interactions and analysis (4 papers) and Advanced Electron Microscopy Techniques and Applications (3 papers). The work is most often cited by research in Materials Chemistry (290 citations), Biomedical Engineering (206 citations), Electronic, Optical and Magnetic Materials (83 citations), Electrical and Electronic Engineering (246 citations) and Mechanical Engineering (151 citations). Trevor Clark has collaborated with scholars based in United States, France and China. Frequent co-authors include Christopher L. Muhlstein, Elizabeth C. Dickey, Kok‐Keong Lew, Joan M. Redwing, Ling Pan, Suveen N. Mathaudhu, Stephen F. Poterala, Richard J. Meyer, Yunfei Chang and Gary L. Messing. Their work appears in journals such as Microscopy and Microanalysis, Journal of Applied Physics, Journal of Visualized Experiments, Acta Materialia and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.