Uwe Scheuermann
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
- Electrostatic Discharge in Electronics
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Multilevel Inverters and Converters
- Advanced DC-DC Converters
- Automotive Engineering top 10%
Papers in
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- Silicon Carbide Semiconductor Technologies 16
- Electronic Packaging and Soldering Technologies 14
- Electromagnetic Compatibility and Noise Suppression 6
- Advancements in Semiconductor Devices and Circuit Design 5
- Electrostatic Discharge in Electronics 3
- 3D IC and TSV technologies 3
- Radiation Effects in Electronics 3
- Co-authors
- Rik De DonckerJosef LutzHeinrich SchlangenottoRalf SchmidtU. SchillingJohannes StröbelFengqun LangF. R. Keßler
- Journals
- Microelectronics Reliability (7 papers)IET Power Electronics (1 paper)EPE Journal (1 paper)CERN Document Server (European Organization for Nuclear Research) (1 paper)OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (1 paper)
- Partner nations
- GermanySwitzerland
In The Last Decade
Uwe Scheuermann
29 papers receiving 1.5k citations
Hit Papers
Peers
Comparison fields: 5 of 45
- Electrical and Electronic Engineering 1.6k
- Automotive Engineering 78
- Mechanical Engineering 184
- Renewable Energy, Sustainability and the Environment 76
- Condensed Matter Physics 48
Countries citing papers authored by Uwe Scheuermann
This map shows the geographic impact of Uwe Scheuermann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Uwe Scheuermann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Uwe Scheuermann more than expected).
Fields of papers citing papers by Uwe Scheuermann
This network shows the impact of papers produced by Uwe Scheuermann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Uwe Scheuermann. The network helps show where Uwe Scheuermann may publish in the future.
Co-authors
The 8 scholars most cited alongside Uwe Scheuermann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | Statistical Evaluation of Current Imbalance in Parallel Devices | 2016 | 3 |
| 2 | Packaging and Reliability of Power Modules - Principles, Achievements and Future Challenges | 2015 | 6 |
| 3 | Cosmic Ray Failures of Power Modules - The Diode Makes the Difference | 2015 | 5 |
| 4 | Investigation on Isolated Failure Mechanisms in Active Power Cycle Testing | 2015 | 19 |
| 5 | 2014 | 50 | |
| 6 | 2013 | 40 | |
| 7 | 2013 | 49 | |
| 8 | Separating Failure Modes in Power Cycling Tests | 2012 | 49 |
| 9 | Reliability of Planar SKiN Interconnect Technology | 2012 | 22 |
| 10 | Semiconductor Power Devices Hit paper breakdown → | 2011 | 547 |
| 11 | 2011 | 231 | |
| 12 | Impact of solder fatigue on module lifetime in power cycling tests | 2011 | 22 |
| 13 | 2010 | 75 | |
| 14 | Using the chip as a temperature sensor — The influence of steep lateral temperature gradients on the V ce (T)-measurement | 2009 | 77 |
| 15 | Increasing component reliability by eliminating solder interfaces | 2009 | 3 |
| 16 | The Road to the Next Generation Power Module - 100% Solder Free Design | 2008 | 33 |
| 17 | Packaging of Large Area Power Chips - Extending the Limits of Standard Module Technology | 2006 | 2 |
| 18 | 2003 | 3 | |
| 19 | Low temperature joining technology - a high reliability alternative to solder contacts | 1997 | 37 |
| 20 | 1990 | 1 |
About Uwe Scheuermann
Uwe Scheuermann is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanical Engineering, Hardware and Architecture and Industrial and Manufacturing Engineering, having authored 29 papers that have together received 1.6k indexed citations. Recurring topics across this work include Silicon Carbide Semiconductor Technologies (16 papers), Electronic Packaging and Soldering Technologies (14 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers), Electrical Contact Performance and Analysis (4 papers), Electrostatic Discharge in Electronics (3 papers), 3D IC and TSV technologies (3 papers) and Radiation Effects in Electronics (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.6k citations), Automotive Engineering (78 citations), Mechanical Engineering (184 citations), Renewable Energy, Sustainability and the Environment (76 citations) and Condensed Matter Physics (48 citations). Uwe Scheuermann has collaborated with scholars based in Germany and Switzerland. Frequent co-authors include Rik De Doncker, Josef Lutz, Heinrich Schlangenotto, Ralf Schmidt, U. Schilling, Johannes Ströbel, Fengqun Lang and F. R. Keßler. Their work appears in journals such as Microelectronics Reliability, IET Power Electronics, EPE Journal, CERN Document Server (European Organization for Nuclear Research) and OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.