Taein Shin
Impact in
- Hardware and Architecture top 10%
- VLSI and Analog Circuit Testing
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- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Advanced Memory and Neural Computing
- VLSI and FPGA Design Techniques
- Energy Harvesting in Wireless Networks
- Wireless Power Transfer Systems
Papers in
-
- 3D IC and TSV technologies 22
- Electromagnetic Compatibility and Noise Suppression 13
- VLSI and FPGA Design Techniques 8
- Electronic Packaging and Soldering Technologies 7
- Advanced Memory and Neural Computing 6
- Low-power high-performance VLSI design 6
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- Parallel Computing and Optimization Techniques 5
- Co-authors
- Joungho Kim (45 shared papers)Seongguk Kim (34 shared papers)Hyunwook Park (35 shared papers)Subin Kim (13 shared papers)Gapyeol Park (17 shared papers)Keunwoo Kim (34 shared papers)Daehwan Lho (22 shared papers)Boogyo Sim (24 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)IEEE Transactions on Electromagnetic Compatibility (2 papers)IEEE Transactions on Microwave Theory and Techniques (1 paper)PubMed (1 paper)IEEE Conference Proceedings (1 paper)
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Taein Shin
45 papers receiving 242 citations
Peers
Comparison fields: 5 of 33
- Hardware and Architecture 31
- Electrical and Electronic Engineering 203
- Industrial and Manufacturing Engineering 10
- Cellular and Molecular Neuroscience 16
- Computer Networks and Communications 18
Countries citing papers authored by Taein Shin
This map shows the geographic impact of Taein Shin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Taein Shin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Taein Shin more than expected).
Fields of papers citing papers by Taein Shin
This network shows the impact of papers produced by Taein Shin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Taein Shin. The network helps show where Taein Shin may publish in the future.
Co-authors
The 25 scholars most cited alongside Taein Shin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 55 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 28 | |
| 2 | 2021 | 23 | |
| 3 | 2019 | 17 | |
| 4 | 2022 | 17 | |
| 5 | 2024 | 13 | |
| 6 | 2022 | 10 | |
| 7 | 2021 | 8 | |
| 8 | 2020 | 8 | |
| 9 | 2020 | 8 | |
| 10 | 2019 | 8 | |
| 11 | 2020 | 7 | |
| 12 | 2020 | 7 | |
| 13 | 2021 | 7 | |
| 14 | 2023 | 6 | |
| 15 | 2021 | 5 | |
| 16 | 2021 | 5 | |
| 17 | 2005 | 5 | |
| 18 | 2019 | 5 | |
| 19 | 2019 | 4 | |
| 20 | 2024 | 4 |
About Taein Shin
Taein Shin is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Cellular and Molecular Neuroscience and Sociology and Political Science, having authored 55 papers that have together received 246 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (22 papers), Electromagnetic Compatibility and Noise Suppression (13 papers), VLSI and FPGA Design Techniques (8 papers), Electronic Packaging and Soldering Technologies (7 papers), Advanced Memory and Neural Computing (6 papers), Neuroscience and Neural Engineering (6 papers), Low-power high-performance VLSI design (6 papers) and Parallel Computing and Optimization Techniques (5 papers). The work is most often cited by research in Hardware and Architecture (31 citations), Electrical and Electronic Engineering (203 citations), Industrial and Manufacturing Engineering (10 citations), Cellular and Molecular Neuroscience (16 citations) and Computer Networks and Communications (18 citations). Taein Shin has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include Joungho Kim, Seongguk Kim, Hyunwook Park, Subin Kim, Gapyeol Park, Keunwoo Kim, Daehwan Lho, Boogyo Sim, Shinyoung Park and Minsu Kim. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Microwave Theory and Techniques, PubMed and IEEE Conference Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.