T. Nishimura

705 total citations
24 papers, 459 citations indexed

About

T. Nishimura is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, T. Nishimura has authored 24 papers receiving a total of 459 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 10 papers in Aerospace Engineering. Recurrent topics in T. Nishimura's work include Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloy Microstructure Properties (5 papers). T. Nishimura is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloy Microstructure Properties (5 papers). T. Nishimura collaborates with scholars based in Japan, Australia and United Kingdom. T. Nishimura's co-authors include C.M. Gourlay, Kazuhiro Nogita, S. Belyakov, Zhaolong Ma, Jingwei Xian, Hideaki Tsukamoto, A. M. Engwall, Eric Chason, A. K. Dahle and Stuart D. McDonald and has published in prestigious journals such as Nature Communications, Journal of Applied Physics and The Astrophysical Journal.

In The Last Decade

T. Nishimura

22 papers receiving 447 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
T. Nishimura Japan	10	384	285	103	47	40	24	459
Brian Reed United States	15	117 0.3×	67 0.2×	348 3.4×	88 1.9×	12 0.3×	51	541
A. Refke Switzerland	13	62 0.2×	90 0.3×	253 2.5×	256 5.4×	7 0.2×	23	411
C. E. Ryan United States	6	276 0.7×	59 0.2×	39 0.4×	90 1.9×	3 0.1×	22	378
E.K. Ohriner United States	12	33 0.1×	226 0.8×	65 0.6×	205 4.4×	16 0.4×	29	341
Etsuo Ishitsuka Japan	12	31 0.1×	82 0.3×	128 1.2×	354 7.5×	14 0.3×	65	446
Valiantsin M. Astashynski Belarus	12	102 0.3×	117 0.4×	40 0.4×	205 4.4×	3 0.1×	66	375
W. Nüchter Germany	12	192 0.5×	175 0.6×	77 0.7×	73 1.6×	6 0.1×	18	331
A. M. Kuzmitski Belarus	11	87 0.2×	99 0.3×	33 0.3×	176 3.7×	3 0.1×	57	314
Jaeyel Lee United States	11	89 0.2×	47 0.2×	73 0.7×	82 1.7×	3 0.1×	39	341

Countries citing papers authored by T. Nishimura

Since Specialization

Citations

This map shows the geographic impact of T. Nishimura's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Nishimura with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Nishimura more than expected).

Fields of papers citing papers by T. Nishimura

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Nishimura. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Nishimura. The network helps show where T. Nishimura may publish in the future.

Co-authorship network of co-authors of T. Nishimura

This figure shows the co-authorship network connecting the top 25 collaborators of T. Nishimura. A scholar is included among the top collaborators of T. Nishimura based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Nishimura. T. Nishimura is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Belyakov, S., et al.. (2019). Role of Bi, Sb and In in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections. 235–239. 8 indexed citations

Belyakov, S., et al.. (2018). Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability. 211–215. 4 indexed citations

Chason, Eric, et al.. (2018). Kinetic model for thin film stress including the effect of grain growth. Journal of Applied Physics. 123(18). 35 indexed citations

Belyakov, S., et al.. (2018). Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints. Journal of Materials Science Materials in Electronics. 30(1). 378–390. 30 indexed citations

Ikeda, N., et al.. (2017). Shape and Orbit Estimation Technique for Space Debris Observation Using the Middle and Upper Atmosphere Radar (MU Radar). amos. 90. 1 indexed citations

Ma, Zhaolong, et al.. (2017). Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections. Nature Communications. 8(1). 1916–1916. 70 indexed citations

Belyakov, S., et al.. (2017). Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints. Journal of Alloys and Compounds. 701. 321–334. 43 indexed citations

Nogita, Kazuhiro, et al.. (2017). Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects. 377–380. 9 indexed citations

Enomoto, Yûji, et al.. (2013). Distribution of Residual Stresses in 1070 Single Phase Aluminium with Grain Size Gradient Formed by RBT Treatment. Materials science forum. 768-769. 343–350.

10.

Nogita, Kazuhiro, et al.. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. Queensland's institutional digital repository (The University of Queensland). 1–6. 5 indexed citations

11.

Nogita, Kazuhiro, et al.. (2008). Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder. MATERIALS TRANSACTIONS. 49(3). 443–448. 23 indexed citations

12.

Nishimura, T., Hiroyuki Toda, Masakazu Kobayashi, et al.. (2008). Change in microstructure of Al–Si–Cu casting alloys during high temperature solution treatment. International Journal of Cast Metals Research. 21(1-4). 114–118. 2 indexed citations

13.

Gourlay, C.M., Kazuhiro Nogita, Stuart D. McDonald, et al.. (2006). A rheological assessment of the effect of trace level Ni additions on the solidification of Sn–0.7Cu. Scripta Materialia. 54(9). 1557–1562. 19 indexed citations

14.

Kawashima, N., et al.. (1992). Pulsar timing observation at Usuda Deep Space Center.. 1648. 1 indexed citations

15.

Nishimura, T.. (1991). Overview of VSOP Mission. 3. 1 indexed citations

16.

Linfield, R. P., G. S. Levy, J. S. Ulvestad, et al.. (1989). VLBI using a telescope in Earth orbit. II - Brightness temperatures exceeding the inverse Compton limit. The Astrophysical Journal. 336. 1105–1105. 31 indexed citations

17.

Nishimura, T., Tadashi Takano, Takahiro Yamada, T. Kato, & T. Yano. (1986). Tracking and orbit determination of 'SAKIGAKE' and 'SUISEI' encountering Halley's comet. 2. 1775–1780. 1 indexed citations

18.

Michel, K. W. & T. Nishimura. (1976). 3.5 The Dust Coma of Comets. International Astronomical Union Colloquium. 31. 328–333.

19.

Barbieri, C., C. B. Cosmovici, K. W. Michel, T. Nishimura, & A. E. Roche. (1974). Near-infrared observations of the dust coma of Comet Kohoutek (1973f) with a tilting-filter Fabry-Perot photometer. Icarus. 23(4). 568–576. 3 indexed citations

20.

Matsumoto, Toshio, et al.. (1968). Infrared observations of the moon. Icarus. 9(1-3). 357–359. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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