Sanka Ganesan
- Electrical and Electronic Engineering
- Mechanical Engineering
- Control and Systems Engineering
- Safety, Risk, Reliability and Quality top 10%
- Mechanics of Materials
- Topics
- Integrated Circuits and Semiconductor Failure Analysis (3 papers)Electronic Packaging and Soldering Technologies (3 papers)Manufacturing Process and Optimization (2 papers)
- Cited by
- General Materials ScienceSafety, Risk, Reliability and QualityElectrical and Electronic Engineering
- Journals
- Microelectronics ReliabilityIEEE Transactions on Electronics Packaging ManufacturingCircuit World
- Partner nations
- United States
In The Last Decade
Sanka Ganesan
8 papers receiving 295 citations
Peers
Comparison fields: 5 of 51
- Electrical and Electronic Engineering 217
- Mechanical Engineering 94
- Control and Systems Engineering 58
- Safety, Risk, Reliability and Quality 42
- Mechanics of Materials 30
Countries citing papers authored by Sanka Ganesan
This map shows the geographic impact of Sanka Ganesan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sanka Ganesan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sanka Ganesan more than expected).
Fields of papers citing papers by Sanka Ganesan
This network shows the impact of papers produced by Sanka Ganesan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sanka Ganesan. The network helps show where Sanka Ganesan may publish in the future.
Co-authorship network of co-authors of Sanka Ganesan
This figure shows the co-authorship network connecting the top 25 collaborators of Sanka Ganesan. A scholar is included among the top collaborators of Sanka Ganesan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sanka Ganesan. Sanka Ganesan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 146 | |
| 2 | 5 | |
| 3 | 9 | |
| 4 | Lead-free Electronics | 120 |
| 5 | 5 | |
| 6 | 1 | |
| 7 | 0 | |
| 8 | 28 | |
| 9 | 1 |
About Sanka Ganesan
Sanka Ganesan is a scholar working on Industrial and Manufacturing Engineering, Ceramics and Composites and Management of Technology and Innovation, having authored 9 papers that have together received 315 indexed citations. Recurring topics across this work include Integrated Circuits and Semiconductor Failure Analysis (3 papers), Electronic Packaging and Soldering Technologies (3 papers) and Manufacturing Process and Optimization (2 papers). The work is most often cited by research in General Materials Science (15 citations), Safety, Risk, Reliability and Quality (42 citations) and Electrical and Electronic Engineering (217 citations). Sanka Ganesan has collaborated with scholars based in United States. Frequent co-authors include Michael Pecht, Haiyu Qi, Isabel K. Lloyd, Michael Osterman, Diganta Das and T.Y. Lin. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Electronics Packaging Manufacturing and Circuit World.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.