Murli Tirumala

725 total citations
19 papers, 616 citations indexed

About

Murli Tirumala is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Hardware and Architecture. According to data from OpenAlex, Murli Tirumala has authored 19 papers receiving a total of 616 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 6 papers in Hardware and Architecture. Recurrent topics in Murli Tirumala's work include Low-power high-performance VLSI design (10 papers), Heat Transfer and Optimization (7 papers) and VLSI and FPGA Design Techniques (7 papers). Murli Tirumala is often cited by papers focused on Low-power high-performance VLSI design (10 papers), Heat Transfer and Optimization (7 papers) and VLSI and FPGA Design Techniques (7 papers). Murli Tirumala collaborates with scholars based in United States, United Kingdom and China. Murli Tirumala's co-authors include Qingsong Yu, C. Wilson, Hongbin Ma, B. Borgmeyer, Soo-Chang Choi, Ung-Kyu Choi, Sheldon X.-D. Tan, Peter Wayner, Raj Yavatkar and Duo Li and has published in prestigious journals such as Applied Physics Letters, Journal of Heat Transfer and IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

In The Last Decade

Murli Tirumala

19 papers receiving 586 citations

Peers

Countries citing papers authored by Murli Tirumala

Since Specialization

Citations

This map shows the geographic impact of Murli Tirumala's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Murli Tirumala with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Murli Tirumala more than expected).

Fields of papers citing papers by Murli Tirumala

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Murli Tirumala. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Murli Tirumala. The network helps show where Murli Tirumala may publish in the future.

Co-authorship network of co-authors of Murli Tirumala

This figure shows the co-authorship network connecting the top 25 collaborators of Murli Tirumala. A scholar is included among the top collaborators of Murli Tirumala based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Murli Tirumala. Murli Tirumala is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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19 of 19 papers shown

#	Work	Indexed citations
1	General Parameterized Thermal Modeling for High-Performance Microprocessor Design 2011 ·IEEE Transactions on Very Large Scale Integration (VLSI) Systems ·(unknown), Sheldon X.-D. Tan, (unknown), Duo Li, (unknown), Murli Tirumala, Lingli Wang	20
2	General behavioral thermal modeling and characterization for multi-core microprocessor design 2010 ·Design, Automation, and Test in Europe ·(unknown), Sheldon X.-D. Tan, (unknown), (unknown), Murli Tirumala	7
3	Composable thermal modeling and characterization for fast temperature estimation 2010 ·Hai Wang, Duo Li, Sheldon X.-D. Tan, Murli Tirumala, Ashish Gupta	4
4	Parameterized architecture-level dynamic thermal models for multicore microprocessors 2010 ·ACM Transactions on Design Automation of Electronic Systems ·Duo Li, Sheldon X.-D. Tan, (unknown), Murli Tirumala	21
5	General behavioral thermal modeling and characterization for multi-core microprocessor design 2010 ·(unknown), Sheldon X.-D. Tan, (unknown), (unknown), Murli Tirumala	8
6	Architecture level thermal modeling for multi-core systems using subspace system method 2009 ·(unknown), (unknown), Sheldon X.-D. Tan, (unknown), Murli Tirumala	1
7	Architecture-Level Thermal Characterization for Multicore Microprocessors 2009 ·IEEE Transactions on Very Large Scale Integration (VLSI) Systems ·Duo Li, Sheldon X.-D. Tan, (unknown), Murli Tirumala	11
8	Parameterized transient thermal behavioral modeling for chip multiprocessors 2008 ·International Conference on Computer Aided Design ·Duo Li, Sheldon X.-D. Tan, (unknown), Murli Tirumala	3
9	Architecture-level thermal behavioral characterization for multi-core microprocessors 2008 ·Asia and South Pacific Design Automation Conference ·Duo Li, Sheldon X.-D. Tan, Murli Tirumala	11
10	A Fast Architecture-Level Thermal Analysis Method for Runtime Thermal Regulation 2008 ·Journal of Low Power Electronics ·Sheldon X.-D. Tan, Pu Liu, Lin Jiang, Wei Wu, Murli Tirumala	1
11	Platform wide innovations to overcome thermal challenges 2008 ·Microelectronics Journal ·Raj Yavatkar, Murli Tirumala	18
12	Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components 2008 ·Journal of Electronic Packaging ·Mark A. Trautman, Murli Tirumala, S. M. You	1
13	Parameterized transient thermal behavioral modeling for chip multiprocessors 2008 ·Duo Li, Sheldon X.-D. Tan, (unknown), Murli Tirumala	1
14	A Novel Carbon Nano Tube based Wick Structure for Heat Pipes/Vapor Chambers 2007 ·(unknown), G. Chrysler, (unknown), Murli Tirumala	16
15	Architecture-level thermal behavioral models for quad-core microprocessors 2007 ·Duo Li, Sheldon X.-D. Tan, Murli Tirumala	1
16	Effect of nanofluid on the heat transport capability in an oscillating heat pipe 2006 ·Applied Physics Letters ·Hongbin Ma, C. Wilson, B. Borgmeyer, (unknown), Qingsong Yu, Soo-Chang Choi, Murli Tirumala	276
17	An Experimental Investigation of Heat Transport Capability in a Nanofluid Oscillating Heat Pipe 2006 ·Journal of Heat Transfer ·Hongbin Ma, C. Wilson, Qingsong Yu, (unknown), Ung-Kyu Choi, Murli Tirumala	178
18	Investigation of Microporous Coatings and Meso-Scale Structures for Two-Phase Cooling of Electronic Components 2005 ·Mark A. Trautman, Murli Tirumala, S. M. You	1
19	Experimental Study of Evaporation in the Contact Line Region of a Thin Film of Hexane 1985 ·Journal of Heat Transfer ·Peter Wayner, (unknown), Murli Tirumala, (unknown)	37

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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