G. Chrysler

2.1k total citations · 1 hit paper
28 papers, 1.7k citations indexed

About

G. Chrysler is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, G. Chrysler has authored 28 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Mechanical Engineering, 11 papers in Electrical and Electronic Engineering and 9 papers in Materials Chemistry. Recurrent topics in G. Chrysler's work include Heat Transfer and Optimization (16 papers), Heat Transfer and Boiling Studies (8 papers) and Thermal properties of materials (7 papers). G. Chrysler is often cited by papers focused on Heat Transfer and Optimization (16 papers), Heat Transfer and Boiling Studies (8 papers) and Thermal properties of materials (7 papers). G. Chrysler collaborates with scholars based in United States. G. Chrysler's co-authors include Ravi Mahajan, Chia‐Pin Chiu, Ravi Prasher, Kelly Lofgreen, Sridhar Narasimhan, Ihtesham H. Chowdhury, R. E. Alley, R. Venkatasubramanian, E. M. Sparrow and David Koester and has published in prestigious journals such as Nature Nanotechnology, Proceedings of the IEEE and The Journal of the Acoustical Society of America.

In The Last Decade

G. Chrysler

28 papers receiving 1.6k citations

Hit Papers

On-chip cooling by superlattice-based thin-film thermoele... 2009 2026 2014 2020 2009 200 400 600

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
G. Chrysler United States 16 910 768 386 357 253 28 1.7k
Masayuki Niino Japan 14 809 0.9× 316 0.4× 204 0.5× 468 1.3× 83 0.3× 54 1.5k
Hongxiang Wang China 23 584 0.6× 450 0.6× 459 1.2× 364 1.0× 130 0.5× 76 1.2k
Tomohide Yabuki Japan 14 445 0.5× 420 0.5× 195 0.5× 216 0.6× 262 1.0× 37 966
Yadong Deng China 23 1.2k 1.3× 911 1.2× 194 0.5× 792 2.2× 92 0.4× 70 1.9k
B.L. Wang China 27 1.2k 1.3× 636 0.8× 146 0.4× 584 1.6× 46 0.2× 96 2.0k
Wenjie Feng China 22 503 0.6× 366 0.5× 238 0.6× 141 0.4× 56 0.2× 101 1.4k
Sidy Ndao United States 20 177 0.2× 794 1.0× 229 0.6× 310 0.9× 595 2.4× 41 1.5k
K.F. Wang China 28 1.3k 1.4× 686 0.9× 162 0.4× 432 1.2× 55 0.2× 133 2.0k
Wenjie Zhou China 18 381 0.4× 878 1.1× 279 0.7× 80 0.2× 154 0.6× 47 1.3k

Countries citing papers authored by G. Chrysler

Since Specialization
Citations

This map shows the geographic impact of G. Chrysler's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. Chrysler with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. Chrysler more than expected).

Fields of papers citing papers by G. Chrysler

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G. Chrysler. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. Chrysler. The network helps show where G. Chrysler may publish in the future.

Co-authorship network of co-authors of G. Chrysler

This figure shows the co-authorship network connecting the top 25 collaborators of G. Chrysler. A scholar is included among the top collaborators of G. Chrysler based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G. Chrysler. G. Chrysler is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chowdhury, Ihtesham H., Ravi Prasher, Kelly Lofgreen, et al.. (2009). On-chip cooling by superlattice-based thin-film thermoelectrics. Nature Nanotechnology. 4(4). 235–238. 700 indexed citations breakdown →
2.
Chrysler, G., et al.. (2007). A Novel Carbon Nano Tube based Wick Structure for Heat Pipes/Vapor Chambers. 102–104. 16 indexed citations
3.
Agonafer, Dereje, et al.. (2006). Design rule for minimizing thermal resistance in a non~uniformly powered microprocessor. 108–115. 6 indexed citations
4.
Chau, David, et al.. (2006). Feasibility study of using solid state refrigeration technologies for electronic cooling. 464–469. 7 indexed citations
5.
Narasimhan, Sridhar, Kelly Lofgreen, David Chau, & G. Chrysler. (2006). Thin film thermoelectric cooler thermal validation and product thermal performance estimation. 470–475. 4 indexed citations
6.
Narasimhan, Sridhar, et al.. (2006). Use-condition thermal metrics for characterization of thin film TEC modules on electronic packages. 476–482. 2 indexed citations
7.
Ramanathan, Shanthi & G. Chrysler. (2006). Solid-state refrigeration for cooling microprocessors. IEEE Transactions on Components and Packaging Technologies. 29(1). 179–183. 10 indexed citations
8.
Chrysler, G., et al.. (2005). Silicon/water vapor chamber as heat spreaders for microelectronic packages. 182–186. 11 indexed citations
9.
Prasher, Ravi, Je-Young Chang, Hakan Ertürk, et al.. (2005). Thermal Performance and Key Challenges for Future CPU Cooling Technologies. 353–364. 41 indexed citations
10.
Chiu, Chia‐Pin, et al.. (2005). Density factor approach to representing impact of die power maps on thermal management. IEEE Transactions on Advanced Packaging. 28(4). 659–664. 22 indexed citations
11.
Chrysler, G., et al.. (2003). Air-cooling extension - performance limits for processor cooling applications. 59 indexed citations
12.
Chu, Richard C., Robert E. Simons, & G. Chrysler. (2003). Experimental investigation of an enhanced thermosyphon heat loop for cooling of a high performance electronics module. 1–9. 20 indexed citations
13.
Mahajan, Ravi, Debendra Mallik, John Tang, et al.. (2003). Critical Aspects of High-Performance Microprocessor Packaging. MRS Bulletin. 28(1). 21–34. 21 indexed citations
14.
Chrysler, G., Richard C. Chu, & Robert E. Simons. (2002). Jet impingement boiling of a dielectric coolant in narrow gaps. 1–8. 9 indexed citations
15.
Chrysler, G., et al.. (2002). Spreading in the heat sink base: phase change systems or solid metals??. IEEE Transactions on Components and Packaging Technologies. 25(4). 621–628. 61 indexed citations
16.
Chrysler, G., et al.. (1995). Experimental investigation of subcooled liquid nitrogen impingement cooling of a silicon chip. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 18(4). 788–794. 20 indexed citations
17.
Chrysler, G., et al.. (1994). Electronics package with improved thermal management by thermoacoustic heat pumping. The Journal of the Acoustical Society of America. 96(4). 2617–2617. 1 indexed citations
18.
Chrysler, G. & E. M. Sparrow. (1986). Turbulent Flow and Heat Transfer in Bends of Circular Cross Section: II—Pressure Distribution Experiments. Journal of Heat Transfer. 108(1). 212–216. 6 indexed citations
19.
Sparrow, E. M., et al.. (1982). Heat Transfer by Natural Convection From an Array of Short, Wall-Attached Horizontal Cylinders. Journal of Heat Transfer. 104(1). 125–131. 8 indexed citations
20.
Sparrow, E. M. & G. Chrysler. (1981). Natural Convection Heat Transfer Coefficients for a Short Horizontal Cylinder Attached to a Vertical Plate. Journal of Heat Transfer. 103(4). 630–637. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Rankless by CCL
2026