Martin Becker
About
In The Last Decade
Martin Becker
55 papers receiving 1.4k citations
Hit Papers
Peers
Comparison fields: 5 of 84
- Materials Chemistry 913
- Electrical and Electronic Engineering 584
- Electronic, Optical and Magnetic Materials 238
- Polymers and Plastics 234
- Mechanics of Materials 166
Countries citing papers authored by Martin Becker
This map shows the geographic impact of Martin Becker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Martin Becker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Martin Becker more than expected).
Fields of papers citing papers by Martin Becker
This network shows the impact of papers produced by Martin Becker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Martin Becker. The network helps show where Martin Becker may publish in the future.
Co-authorship network of co-authors of Martin Becker
This figure shows the co-authorship network connecting the top 25 collaborators of Martin Becker. A scholar is included among the top collaborators of Martin Becker based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Martin Becker. Martin Becker is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 2 | |
| 3 | 0 | |
| 4 | 4 | |
| 5 | 5 | |
| 6 | 11 | |
| 7 | 10 | |
| 8 | 3 | |
| 9 | Reliability of SiC MOSFET with Danfoss Bond Buffer Technology in Automotive Traction Power Modules | 10 |
| 10 | 20 | |
| 11 | 1 | |
| 12 | Feasibility of Copper-Based Ribbon Bonding as an Assembly Method for Advanced Power Modules | 3 |
| 13 | 3 | |
| 14 | 53 | |
| 15 | 10 | |
| 16 | Influence of Danfoss Bond Buffer and Cu-Wire Bonds on the Electrical Switching Behaviour of IGBTs | 4 |
| 17 | Binary copper oxide semiconductors: From materials towards devices breakdown → | 597 |
| 18 | 4 | |
| 19 | 12 | |
| 20 | 4 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.