Kun‐An Chiu
Impact in
- Nuclear Energy and Engineering top 10%
-
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Radiation Effects in Electronics
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Metal and Thin Film Mechanics 13
- Co-authors
- J. R. SrourO. L. CurtisLi ChangRobert W. GedridgeG. B. StringfellowThi HienJeong‐Hun ShinWei‐Chun Chen
- Journals
- Surface and Coatings Technology (6 papers)IEEE Transactions on Nuclear Science (5 papers)Thin Solid Films (3 papers)Journal of Crystal Growth (2 papers)Surface Topography Metrology and Properties (1 paper)
- Partner nations
- TaiwanUnited States
In The Last Decade
Kun‐An Chiu
30 papers receiving 328 citations
Peers
Comparison fields: 5 of 33
- Nuclear Energy and Engineering 9
- Electrical and Electronic Engineering 299
- Ceramics and Composites 19
- Materials Chemistry 131
- Atomic and Molecular Physics, and Optics 83
Countries citing papers authored by Kun‐An Chiu
This map shows the geographic impact of Kun‐An Chiu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kun‐An Chiu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kun‐An Chiu more than expected).
Fields of papers citing papers by Kun‐An Chiu
This network shows the impact of papers produced by Kun‐An Chiu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kun‐An Chiu. The network helps show where Kun‐An Chiu may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Kun‐An Chiu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 1 | |
| 2 | 2024 | 1 | |
| 3 | 2024 | 1 | |
| 4 | 2023 | 1 | |
| 5 | 2023 | 1 | |
| 6 | 2023 | 1 | |
| 7 | 2022 | 6 | |
| 8 | 2021 | 2 | |
| 9 | 2020 | 11 | |
| 10 | 2020 | 5 | |
| 11 | 2019 | 8 | |
| 12 | 2019 | 8 | |
| 13 | 2019 | 4 | |
| 14 | 2015 | 8 | |
| 15 | 2014 | 4 | |
| 16 | 2013 | 4 | |
| 17 | 2013 | 4 | |
| 18 | 2009 | 6 | |
| 19 | Damage coefficients in low resistivity silicon | 1975 | 1 |
| 20 | 1975 | 8 |
About Kun‐An Chiu
Kun‐An Chiu is a scholar working on Mechanics of Materials, Ceramics and Composites, Condensed Matter Physics, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 31 papers that have together received 351 indexed citations. Recurring topics across this work include Semiconductor materials and devices (16 papers), Metal and Thin Film Mechanics (13 papers), Semiconductor materials and interfaces (7 papers), MXene and MAX Phase Materials (5 papers), GaN-based semiconductor devices and materials (5 papers), Diamond and Carbon-based Materials Research (4 papers), Silicon and Solar Cell Technologies (4 papers) and Acoustic Wave Resonator Technologies (3 papers). The work is most often cited by research in Nuclear Energy and Engineering (9 citations), Electrical and Electronic Engineering (299 citations), Ceramics and Composites (19 citations), Materials Chemistry (131 citations) and Atomic and Molecular Physics, and Optics (83 citations). Kun‐An Chiu has collaborated with scholars based in Taiwan and United States. Frequent co-authors include J. R. Srour, O. L. Curtis, Li Chang, Li Chang, Robert W. Gedridge, G. B. Stringfellow, Thi Hien, Jeong‐Hun Shin, Wei‐Chun Chen and Chun-Yen Peng. Their work appears in journals such as Surface and Coatings Technology, IEEE Transactions on Nuclear Science, Thin Solid Films, Journal of Crystal Growth and Surface Topography Metrology and Properties.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.