Katsuya Kikuchi

1.4k total citations
158 papers, 1.0k citations indexed

About

Katsuya Kikuchi is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Katsuya Kikuchi has authored 158 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 130 papers in Electrical and Electronic Engineering, 25 papers in Biomedical Engineering and 17 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Katsuya Kikuchi's work include 3D IC and TSV technologies (95 papers), Electronic Packaging and Soldering Technologies (44 papers) and Semiconductor materials and devices (28 papers). Katsuya Kikuchi is often cited by papers focused on 3D IC and TSV technologies (95 papers), Electronic Packaging and Soldering Technologies (44 papers) and Semiconductor materials and devices (28 papers). Katsuya Kikuchi collaborates with scholars based in Japan, Vietnam and United States. Katsuya Kikuchi's co-authors include Masahiro Aoyagi, Naoya Watanabe, Tomonao Miyadai, H. Shimamoto, Hiroshi Nakagawa, Yoshikazu Ishikawa, Masatoshi Arai, Tung Thanh Bui, Michitaka Honda and Kenichi Komatsu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Katsuya Kikuchi

142 papers receiving 1.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Katsuya Kikuchi Japan 15 577 224 201 190 165 158 1.0k
H. Ahmed United Kingdom 19 949 1.6× 502 2.2× 577 2.9× 102 0.5× 97 0.6× 74 1.6k
Tianjiao Liang China 17 592 1.0× 182 0.8× 46 0.2× 115 0.6× 15 0.1× 76 1.1k
G. Sarrabayrouse France 18 913 1.6× 189 0.8× 116 0.6× 53 0.3× 46 0.3× 123 1.0k
Yigang Li China 20 743 1.3× 645 2.9× 168 0.8× 100 0.5× 47 0.3× 88 1.5k
Christer Svensson Sweden 23 1.7k 2.9× 263 1.2× 425 2.1× 28 0.1× 34 0.2× 110 2.1k
Beng Koon Ng Singapore 21 579 1.0× 300 1.3× 387 1.9× 124 0.7× 92 0.6× 66 1.1k
Xi Liang China 16 189 0.3× 554 2.5× 99 0.5× 51 0.3× 206 1.2× 106 805
Masoud Moslehi United States 16 643 1.1× 159 0.7× 116 0.6× 77 0.4× 33 0.2× 72 919
A. Müller Romania 21 789 1.4× 379 1.7× 608 3.0× 101 0.5× 340 2.1× 135 1.4k

Countries citing papers authored by Katsuya Kikuchi

Since Specialization
Citations

This map shows the geographic impact of Katsuya Kikuchi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Katsuya Kikuchi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Katsuya Kikuchi more than expected).

Fields of papers citing papers by Katsuya Kikuchi

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Katsuya Kikuchi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Katsuya Kikuchi. The network helps show where Katsuya Kikuchi may publish in the future.

Co-authorship network of co-authors of Katsuya Kikuchi

This figure shows the co-authorship network connecting the top 25 collaborators of Katsuya Kikuchi. A scholar is included among the top collaborators of Katsuya Kikuchi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Katsuya Kikuchi. Katsuya Kikuchi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kikuchi, Katsuya. (2023). R&D of 3D-IC Technology for System Integration. Journal of The Japan Institute of Electronics Packaging. 26(4). 326–332.
2.
Shimamoto, H., et al.. (2023). Wafer-to-Wafer Bonding Fabrication Process-Induced Wafer Warpage. IEEE Transactions on Semiconductor Manufacturing. 36(3). 398–403. 6 indexed citations
3.
Fujino, Masahisa, et al.. (2023). Nb–Nb direct bonding at room temperature for superconducting interconnects. Journal of Applied Physics. 133(1). 3 indexed citations
4.
Nakagawa, Hiroshi, et al.. (2023). Demonstration of 90 000 superconductive bump connections for massive quantum computing. Japanese Journal of Applied Physics. 62(SC). SC1094–SC1094. 2 indexed citations
5.
Shimamoto, H., et al.. (2022). Warpage Reduction and Thermal Stress Study of Dicing Process in Wafer-to-Wafer Bonding Fabrication. IEEE Transactions on Electron Devices. 69(11). 6265–6269. 7 indexed citations
6.
Shimamoto, H., et al.. (2022). Study of wafer warpage reduction by dicing street. Japanese Journal of Applied Physics. 61(SJ). SJ1001–SJ1001. 3 indexed citations
7.
Kikuchi, Katsuya, et al.. (2021). Thermal management of a 3D packaging structure for superconducting quantum annealing machines. Applied Physics Letters. 118(17). 8 indexed citations
8.
Watanabe, Naoya, H. Shimamoto, Katsuya Kikuchi, et al.. (2020). Secure 3D CMOS Chip Stacks with Backside Buried Metal Power Delivery Networks for Distributed Decoupling Capacitance. 31.5.1–31.5.4. 2 indexed citations
9.
Fujino, Masahisa, et al.. (2019). 300 mm wafer-level hybrid bonding for Cu/interlayer dielectric bonding in vacuum. Japanese Journal of Applied Physics. 59(SB). SBBA02–SBBA02. 23 indexed citations
10.
Watanabe, Naoya, Hidekazu Kikuchi, H. Shimamoto, et al.. (2019). Fabrication and stacking of through-silicon-via array chip formed by notchless Si etching and wet cleaning of first metal layer. Japanese Journal of Applied Physics. 58(SD). SDDL09–SDDL09. 2 indexed citations
11.
Shimamoto, H., et al.. (2018). Investigation of transient thermal dissipation in thinned LSI for advanced packaging. Japanese Journal of Applied Physics. 57(4S). 04FC06–04FC06. 1 indexed citations
12.
Bui, Tung Thanh, et al.. (2016). Fabrication and stress analysis of annular-trench-isolated TSV. Microelectronics Reliability. 63. 142–147. 11 indexed citations
13.
Watanabe, Naoya, et al.. (2012). 3D Interconnect Technology by the Ultrawide-Interchip-Bus System for 3D Stacked LSI Systems. IEICE Technical Report; IEICE Tech. Rep.. 112(170). 43–48. 6 indexed citations
14.
Suzuki, Atsushi, T. Ishikawa, Y. Hashimoto, et al.. (2009). Low-Cost Optical Subassembly Using VCSEL Pre-Self-Aligned With Optical Fiber for Optical Interconnect Applications. Journal of Lightwave Technology. 27(20). 4516–4523. 8 indexed citations
15.
Myoren, Hiroaki, Katsuya Kikuchi, Hiroshi Nakagawa, et al.. (2006). Polyimide Buffer Layer for STJ Photon Detector. Journal of Physics Conference Series. 43. 1319–1321. 1 indexed citations
16.
Kikuchi, Katsuya, et al.. (2005). Characteristic dielectric constant for polyimide thin films at 10GHz. IEICE Technical Report; IEICE Tech. Rep.. 105(265). 7–12. 1 indexed citations
17.
Kikuchi, Katsuya, et al.. (2005). Micropattern Formation of Photosensitive Imide Block Copolymer Thick Films. Journal of Photopolymer Science and Technology. 18(2). 301–306. 2 indexed citations
18.
Kikuchi, Katsuya, et al.. (2003). New fabrication process for josephson tunnel junctions using photosensitive polyimide insulation layer for superconducting integrated circuits. IEEE Transactions on Applied Superconductivity. 13(2). 119–122. 7 indexed citations
19.
Honda, Michitaka, Katsuya Kikuchi, & Kenichi Komatsu. (1991). Method for estimating the intensity of scattered radiation using a scatter generation model. Medical Physics. 18(2). 219–226. 34 indexed citations
20.
Taniguchi, Y, et al.. (1989). AN IMAGE PROCESSING OF HISTOGRAM FLATTENING IN HSV COLOR SPACE ON THE TV-ENDOSCOPIC PICTURE. Acta gastro-enterologica belgica. 31(9). 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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