Naoya Watanabe

1.1k total citations
132 papers, 800 citations indexed

About

Naoya Watanabe is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Computer Networks and Communications. According to data from OpenAlex, Naoya Watanabe has authored 132 papers receiving a total of 800 indexed citations (citations by other indexed papers that have themselves been cited), including 110 papers in Electrical and Electronic Engineering, 26 papers in Biomedical Engineering and 13 papers in Computer Networks and Communications. Recurrent topics in Naoya Watanabe's work include 3D IC and TSV technologies (78 papers), Electronic Packaging and Soldering Technologies (37 papers) and Semiconductor materials and devices (28 papers). Naoya Watanabe is often cited by papers focused on 3D IC and TSV technologies (78 papers), Electronic Packaging and Soldering Technologies (37 papers) and Semiconductor materials and devices (28 papers). Naoya Watanabe collaborates with scholars based in Japan, United States and United Kingdom. Naoya Watanabe's co-authors include Tanemasa Asano, Masahiro Aoyagi, Katsuya Kikuchi, H. Shimamoto, Tung Thanh Bui, Koji Nii, Fumiki Kato, K. Dosaka, Kōichiro Tanaka and Isao Tsunoda and has published in prestigious journals such as Acta Materialia, IEEE Journal on Selected Areas in Communications and IEEE Journal of Solid-State Circuits.

In The Last Decade

Naoya Watanabe

121 papers receiving 769 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Naoya Watanabe Japan 14 633 148 135 88 61 132 800
Daeyeon Kim United States 16 905 1.4× 221 1.5× 156 1.2× 112 1.3× 25 0.4× 54 1.1k
Roshan Weerasekera United Kingdom 15 710 1.1× 152 1.0× 167 1.2× 173 2.0× 30 0.5× 60 850
Yiqun Zhang United States 19 750 1.2× 346 2.3× 130 1.0× 65 0.7× 53 0.9× 32 1.0k
Alan J. Weger United States 16 785 1.2× 135 0.9× 364 2.7× 105 1.2× 56 0.9× 58 962
Alexandre Valentian France 16 622 1.0× 86 0.6× 127 0.9× 125 1.4× 49 0.8× 59 708
Taigon Song South Korea 16 1.3k 2.0× 99 0.7× 91 0.7× 138 1.6× 82 1.3× 58 1.3k
Tom J. Kázmierski United Kingdom 13 666 1.1× 187 1.3× 122 0.9× 70 0.8× 57 0.9× 110 871
Fabrice Paillet United States 14 834 1.3× 200 1.4× 99 0.7× 48 0.5× 131 2.1× 21 1.0k
Kyeong‐Sik Min South Korea 20 1.2k 1.9× 110 0.7× 74 0.5× 51 0.6× 34 0.6× 132 1.3k
R. Canegallo Italy 15 530 0.8× 164 1.1× 208 1.5× 238 2.7× 22 0.4× 71 823

Countries citing papers authored by Naoya Watanabe

Since Specialization
Citations

This map shows the geographic impact of Naoya Watanabe's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Naoya Watanabe with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Naoya Watanabe more than expected).

Fields of papers citing papers by Naoya Watanabe

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Naoya Watanabe. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Naoya Watanabe. The network helps show where Naoya Watanabe may publish in the future.

Co-authorship network of co-authors of Naoya Watanabe

This figure shows the co-authorship network connecting the top 25 collaborators of Naoya Watanabe. A scholar is included among the top collaborators of Naoya Watanabe based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Naoya Watanabe. Naoya Watanabe is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Watanabe, Naoya, et al.. (2024). Resiliency evaluation of sheltering in a net-zero energy house during summer power outage. Building and Environment. 267. 112204–112204. 1 indexed citations
2.
Akimoto, T., et al.. (2024). CHANGES IN POWER CONSUMPTION OF DETACHED ZEH BY WORKING AT HOME. Journal of Environmental Engineering (Transactions of AIJ). 89(817). 171–181.
4.
Akimoto, T., et al.. (2024). “NEW NORMAL” IMPACTS ON ELECTRIC POWER CONSUMPTION IN DETACHED HOUSES. Journal of Environmental Engineering (Transactions of AIJ). 89(817). 160–170.
5.
Watanabe, Naoya, H. Shimamoto, Katsuya Kikuchi, et al.. (2020). Secure 3D CMOS Chip Stacks with Backside Buried Metal Power Delivery Networks for Distributed Decoupling Capacitance. 31.5.1–31.5.4. 2 indexed citations
6.
Chen, Jiamin, Yuya Sakuraba, Kay Yakushiji, et al.. (2020). Fully epitaxial giant magnetoresistive devices with half-metallic Heusler alloy fabricated on poly-crystalline electrode using three-dimensional integration technology. Acta Materialia. 200. 1038–1045. 11 indexed citations
7.
Watanabe, Naoya, Hidekazu Kikuchi, H. Shimamoto, et al.. (2019). Fabrication and stacking of through-silicon-via array chip formed by notchless Si etching and wet cleaning of first metal layer. Japanese Journal of Applied Physics. 58(SD). SDDL09–SDDL09. 2 indexed citations
8.
Bui, Tung Thanh, et al.. (2016). Fabrication and stress analysis of annular-trench-isolated TSV. Microelectronics Reliability. 63. 142–147. 11 indexed citations
9.
Nii, Koji, et al.. (2014). 13.6 A 28nm 400MHz 4-parallel 1.6Gsearch/s 80Mb ternary CAM. 240–241. 50 indexed citations
10.
Watanabe, Naoya, et al.. (2014). Damage Evaluation of Wet-Chemical Si-Wafer Thinning/Backside Via Exposure Process. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(4). 741–747. 10 indexed citations
11.
Watanabe, Naoya, et al.. (2014). Small-diameter TSV reveal process using direct Si/Cu grinding and metal contamination removal. 1–5. 7 indexed citations
12.
Watanabe, Naoya, et al.. (2014). Backside Exposure of Small-Sized TSVs Using Si/Cu Grinding, CMP, Cap Layer Deposition, and Alkaline Etching. IMAPSource Proceedings. 2014(1). 19–23. 4 indexed citations
13.
Watanabe, Naoya, et al.. (2012). 3D Interconnect Technology by the Ultrawide-Interchip-Bus System for 3D Stacked LSI Systems. IEICE Technical Report; IEICE Tech. Rep.. 112(170). 43–48. 6 indexed citations
14.
Ikeda, Akihiro, et al.. (2010). Effect of Argon/Hydrogen Plasma Cleaning on Electroless Ni Deposition on Small-Area Al Pads. Japanese Journal of Applied Physics. 49(8S1). 08JA05–08JA05. 8 indexed citations
15.
Watanabe, Naoya, et al.. (2003). An Embedded DRAM Hybrid Macro with Auto Signal Management and Enhanced-on-Chip Tester. IEICE Transactions on Electronics. 86(4). 624–634. 3 indexed citations
16.
Dosaka, K., et al.. (2002). A 90 MHz 16 Mbit system integrated memory with direct interface to CPU. 19–20. 3 indexed citations
17.
Watanabe, Naoya, et al.. (1994). 180 MHz multiple-registered 16 Mbit SDRAM with flexible timing scheme. IEICE Transactions on Electronics. 1328–1332. 3 indexed citations
18.
Watanabe, Naoya, et al.. (1994). A 180 MHz Multiple-Registered 16 Mbit SDRAM with Flexible Timing Scheme (Special Section on High Speed and High Density Multi Functional LSI Memories). IEICE Transactions on Electronics. 77(8). 1328–1333. 2 indexed citations
19.
Yukimatsu, Ken-ichi, et al.. (1986). Multicast Communication Facilities in a High Speed Packet Switching Network.. ICCC. 276–281. 2 indexed citations
20.
Imai, Kazuo, et al.. (1985). IMPROVED D50 CIRCUIT SWITCHING EQUIPMENT.. 33(6). 931–938. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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