K. Wyatt
Impact in
-
- Photonic and Optical Devices
- Semiconductor Lasers and Optical Devices
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Optical Network Technologies
- Molecular Junctions and Nanostructures
- Electrostatic Discharge in Electronics
- Mechanics of Materials top 10%
Papers in
-
- Semiconductor Lasers and Optical Devices 10
- Electronic Packaging and Soldering Technologies 10
- Photonic and Optical Devices 8
- 3D IC and TSV technologies 6
- Molecular Junctions and Nanostructures 2
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- Advanced Optical Imaging Technologies 3
- Journals
- Journal of Lightwave Technology (3 papers)Journal of Electronic Packaging (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)IEEE Transactions on Components Hybrids and Manufacturing Technology (1 paper)SID Symposium Digest of Technical Papers (1 paper)
- Partner nations
- United States
In The Last Decade
K. Wyatt
23 papers receiving 478 citations
Peers
Comparison fields: 5 of 42
- Electrical and Electronic Engineering 466
- Mechanics of Materials 100
- Atomic and Molecular Physics, and Optics 113
- Industrial and Manufacturing Engineering 20
- Surfaces, Coatings and Films 9
Countries citing papers authored by K. Wyatt
This map shows the geographic impact of K. Wyatt's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. Wyatt with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. Wyatt more than expected).
Fields of papers citing papers by K. Wyatt
This network shows the impact of papers produced by K. Wyatt. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. Wyatt. The network helps show where K. Wyatt may publish in the future.
Co-authorship network
The 25 scholars most cited alongside K. Wyatt, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 0 | |
| 2 | 2002 | 2 | |
| 3 | 2002 | 1 | |
| 4 | 2002 | 11 | |
| 5 | 2002 | 15 | |
| 6 | 2002 | 4 | |
| 7 | 2002 | 2 | |
| 8 | 1999 | 42 | |
| 9 | 1999 | 89 | |
| 10 | 1999 | 110 | |
| 11 | 1998 | 1 | |
| 12 | 1998 | 1 | |
| 13 | 1998 | 10 | |
| 14 | 1998 | 1 | |
| 15 | CAD-BASED ANALYSIS TOOLS FOR ELECTRONIC PACKAGING DESIGN (A New Modeling Methodology for a Virtual Development Environment ) | 1997 | 9 |
| 16 | 1997 | 26 | |
| 17 | 1996 | 21 | |
| 18 | 1996 | 1 | |
| 19 | 1995 | 1 | |
| 20 | 1993 | 39 |
About K. Wyatt
K. Wyatt is a scholar working on Electrical and Electronic Engineering, Media Technology, Instrumentation, Mechanics of Materials and Industrial and Manufacturing Engineering, having authored 26 papers that have together received 515 indexed citations. Recurring topics across this work include Semiconductor Lasers and Optical Devices (10 papers), Electronic Packaging and Soldering Technologies (10 papers), Photonic and Optical Devices (8 papers), 3D IC and TSV technologies (6 papers), Advanced Optical Imaging Technologies (3 papers), Photorefractive and Nonlinear Optics (3 papers), Molecular Junctions and Nanostructures (2 papers) and Liquid Crystal Research Advancements (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (466 citations), Mechanics of Materials (100 citations), Atomic and Molecular Physics, and Optics (113 citations), Industrial and Manufacturing Engineering (20 citations) and Surfaces, Coatings and Films (9 citations). K. Wyatt has collaborated with scholars based in United States. Frequent co-authors include Chao-Pin Yeh, A. Harton, Pablo Mena, J.J. Morikuni, Sung‐Mo Kang, Jing Wu, Kai Hu, Robert E. Fulton, John W. Stafford and Charles Ume. Their work appears in journals such as Journal of Lightwave Technology, Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology Part A, IEEE Transactions on Components Hybrids and Manufacturing Technology and SID Symposium Digest of Technical Papers.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.