John Osenbach

1.8k total citations
70 papers, 876 citations indexed

About

John Osenbach is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, John Osenbach has authored 70 papers receiving a total of 876 indexed citations (citations by other indexed papers that have themselves been cited), including 64 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 13 papers in Materials Chemistry. Recurrent topics in John Osenbach's work include Electronic Packaging and Soldering Technologies (26 papers), Semiconductor materials and devices (20 papers) and 3D IC and TSV technologies (16 papers). John Osenbach is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), Semiconductor materials and devices (20 papers) and 3D IC and TSV technologies (16 papers). John Osenbach collaborates with scholars based in United States, South Korea and Singapore. John Osenbach's co-authors include W. R. Knolle, J. M. DeLucca, F. A. Baiocchi, V. S. STUBIČAN, R. B. Comizzoli, Navin Chand, Jongwoo Park, C. D. Theis, G.A. Henshall and H. W. Krautter and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Journal of the American Ceramic Society.

In The Last Decade

John Osenbach

64 papers receiving 771 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
John Osenbach United States 18 742 224 171 100 87 70 876
Dorian Minkov Spain 17 510 0.7× 445 2.0× 120 0.7× 95 0.9× 113 1.3× 54 808
James D. Scofield United States 18 901 1.2× 234 1.0× 158 0.9× 131 1.3× 151 1.7× 76 1.1k
R. de Reus Netherlands 13 313 0.4× 213 1.0× 312 1.8× 220 2.2× 74 0.9× 33 740
Alok Ranjan Singapore 16 611 0.8× 363 1.6× 257 1.5× 64 0.6× 43 0.5× 75 992
S.-M. Kuo United States 12 459 0.6× 209 0.9× 360 2.1× 108 1.1× 135 1.6× 16 756
C.C. Lee United States 16 738 1.0× 112 0.5× 194 1.1× 186 1.9× 70 0.8× 44 877
M.A. Kulakov Germany 15 272 0.4× 286 1.3× 210 1.2× 248 2.5× 77 0.9× 39 648
P. Flaitz United States 12 333 0.4× 273 1.2× 78 0.5× 111 1.1× 163 1.9× 29 605
Jin Onuki Japan 14 647 0.9× 104 0.5× 240 1.4× 89 0.9× 284 3.3× 119 789
Kars Troost Netherlands 14 483 0.7× 164 0.7× 76 0.4× 56 0.6× 47 0.5× 32 644

Countries citing papers authored by John Osenbach

Since Specialization
Citations

This map shows the geographic impact of John Osenbach's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Osenbach with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Osenbach more than expected).

Fields of papers citing papers by John Osenbach

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by John Osenbach. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Osenbach. The network helps show where John Osenbach may publish in the future.

Co-authorship network of co-authors of John Osenbach

This figure shows the co-authorship network connecting the top 25 collaborators of John Osenbach. A scholar is included among the top collaborators of John Osenbach based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with John Osenbach. John Osenbach is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chen, Peter, et al.. (2012). 2L OMEDFC development for low cost & high performance application. 645–648. 1 indexed citations
2.
3.
Coyle, Richard, et al.. (2011). Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(10). 1583–1593. 35 indexed citations
4.
Osenbach, John, et al.. (2010). Cu wire bonding for fine pitch 65nm silicon integrated circuits. b64. 1154–1158. 3 indexed citations
5.
Osenbach, John, et al.. (2010). Tin Whisker Test Development—Temperature and Humidity Effects Part II: Acceleration Model Development. IEEE Transactions on Electronics Packaging Manufacturing. 33(1). 16–24. 13 indexed citations
6.
Osenbach, John, et al.. (2010). Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection. IEEE Transactions on Electronics Packaging Manufacturing. 33(1). 1–15. 17 indexed citations
7.
8.
Osenbach, John, et al.. (2005). Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory. IEEE Transactions on Electronics Packaging Manufacturing. 28(1). 36–62. 46 indexed citations
9.
Park, Jongwoo & John Osenbach. (2005). Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging. Microelectronics Reliability. 46(2-4). 503–511. 10 indexed citations
10.
Feygenson, A., et al.. (2003). CBIC-V, a new very high speed complementary silicon bipolar IC process. 173–177. 2 indexed citations
11.
Theis, C. D., et al.. (2002). The corrosion behavior of BK-7 glasses for use in non-hermetic electro-optic devices. 16. 989–996. 2 indexed citations
12.
Osenbach, John, et al.. (2002). Low cost/high volume laser modules using silicon optical bench technology. 13. 581–587. 22 indexed citations
13.
Osenbach, John, et al.. (2000). The corrosion behavior of BK-7 glasses for use in non-hermetic electro-optic devices. IEEE Transactions on Components and Packaging Technologies. 23(4). 638–645. 2 indexed citations
14.
Osenbach, John, et al.. (1997). Temperature-humidity-bias behavior and acceleration factors for nonhermetic uncooled InP-based lasers. Journal of Lightwave Technology. 15(5). 861–873. 18 indexed citations
15.
Osenbach, John. (1996). Corrosion-induced degradation of microelectronic devices. Semiconductor Science and Technology. 11(2). 155–162. 42 indexed citations
16.
Osenbach, John, et al.. (1996). Temperature-humidity-bias-behavior and acceleration model for InP planar PIN photodiodes. Journal of Lightwave Technology. 14(8). 1865–1881. 36 indexed citations
17.
Chand, Naresh, R. R. Kola, John Osenbach, & W. T. Tsang. (1994). Tunability of Intrinsic Stress in Siox Dielectric Films Formed by Molecular Beam Deposition. MRS Proceedings. 356. 1 indexed citations
18.
Osenbach, John & W. R. Knolle. (1992). Behavior of a ‐ SiN :  H  and a ‐ SiON :  H  Films in Condensed Water. Journal of The Electrochemical Society. 139(11). 3346–3351. 25 indexed citations
19.
Osenbach, John, et al.. (1989). Conduction in a ‐ SiN :  H  and a ‐ SiON :  H  Alloys. Journal of The Electrochemical Society. 136(11). 3409–3414. 6 indexed citations
20.
Osenbach, John & W. R. Knolle. (1986). A model describing the electrical behavior of a-SiN:H alloys. Journal of Applied Physics. 60(4). 1408–1416. 30 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Dorian Minkov Breakdown of academic impact, for papers by James D. Scofield Breakdown of academic impact, for papers by R. de Reus Breakdown of academic impact, for papers by Alok Ranjan Breakdown of academic impact, for papers by S.-M. Kuo Breakdown of academic impact, for papers by C.C. Lee Breakdown of academic impact, for papers by M.A. Kulakov Breakdown of academic impact, for papers by P. Flaitz Breakdown of academic impact, for papers by Jin Onuki Breakdown of academic impact, for papers by Kars Troost
Rankless by CCL
2026