J.M. Dorkel

478 total citations
43 papers, 324 citations indexed

About

J.M. Dorkel is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, J.M. Dorkel has authored 43 papers receiving a total of 324 indexed citations (citations by other indexed papers that have themselves been cited), including 41 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 5 papers in Materials Chemistry. Recurrent topics in J.M. Dorkel's work include Silicon Carbide Semiconductor Technologies (30 papers), Semiconductor materials and devices (14 papers) and Electrostatic Discharge in Electronics (12 papers). J.M. Dorkel is often cited by papers focused on Silicon Carbide Semiconductor Technologies (30 papers), Semiconductor materials and devices (14 papers) and Electrostatic Discharge in Electronics (12 papers). J.M. Dorkel collaborates with scholars based in France, Switzerland and United States. J.M. Dorkel's co-authors include Andrzej Napieralski, G. Coquery, R. Lallemand, F. E. Ratolojanahary, Van‐Quang Nguyen, Nicolas Nolhier, David Trémouilles, C. Delage, G. Sarrabayrouse and Nicolas Mauran and has published in prestigious journals such as International Journal of Heat and Mass Transfer, IEEE Journal of Solid-State Circuits and IEEE Transactions on Electron Devices.

In The Last Decade

J.M. Dorkel

38 papers receiving 307 citations

Peers

J.M. Dorkel
S. Russo Italy
F. Frisina Italy
Scott Leslie United States
Ivana Kovacevic-Badstuebner Switzerland
Chih‐Ming Tsai Taiwan
G. Bouche France
Antonio Pio Catalano Italy
D. Sparks United States
T. Sakai Japan
Andreas Wettstein Switzerland
S. Russo Italy
J.M. Dorkel
Citations per year, relative to J.M. Dorkel J.M. Dorkel (= 1×) peers S. Russo

Countries citing papers authored by J.M. Dorkel

Since Specialization
Citations

This map shows the geographic impact of J.M. Dorkel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.M. Dorkel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.M. Dorkel more than expected).

Fields of papers citing papers by J.M. Dorkel

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.M. Dorkel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.M. Dorkel. The network helps show where J.M. Dorkel may publish in the future.

Co-authorship network of co-authors of J.M. Dorkel

This figure shows the co-authorship network connecting the top 25 collaborators of J.M. Dorkel. A scholar is included among the top collaborators of J.M. Dorkel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J.M. Dorkel. J.M. Dorkel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Dorkel, J.M., et al.. (2013). Distributed electrothermal modeling methodology for MOS gated power devices simulations. International Conference Mixed Design of Integrated Circuits and Systems. 4. 301–305. 4 indexed citations
2.
Dorkel, J.M., et al.. (2012). Study of mechanical stress impact on the I–V characteristics of a power VDMOS device using 2D FEM simulations. Microelectronics Reliability. 52(3). 489–496. 1 indexed citations
3.
Dorkel, J.M., et al.. (2012). Power MOSFET quality and robustness enhancement with a new QBD characterization performed at probe–die–wafer level. Materials Science and Engineering B. 177(15). 1362–1366. 1 indexed citations
4.
5.
Dorkel, J.M., et al.. (2011). Innovative methodology to extract dynamic compact thermal models: Application to power devices. Microelectronics Journal. 43(9). 642–648. 2 indexed citations
6.
7.
Dorkel, J.M., et al.. (2011). Interest of surface treatment at gate oxide level for power MOSFETs quality and reliability. 35 93. 1–6. 1 indexed citations
8.
Dorkel, J.M., et al.. (2010). Boundary condition independent multiple cooling surfaces transient compact thermal model. 1–4. 1 indexed citations
9.
Dorkel, J.M., et al.. (2009). Source electrode evolution of a low voltage power MOSFET under avalanche cycling. Microelectronics Reliability. 49(9-11). 1341–1345. 13 indexed citations
10.
11.
Dorkel, J.M., et al.. (2002). Advanced power copper technology for SMARTMOS/sup TM/ application designs. 141–144. 3 indexed citations
12.
Dorkel, J.M., et al.. (2002). Rapid thermal modeling for smart-power and integrated multichip power circuit design. 173–176. 2 indexed citations
13.
Dorkel, J.M., et al.. (2002). Thermal modeling for electrothermal simulation of power devices or circuits. 155–160. 8 indexed citations
14.
Rossel, P., et al.. (2002). Advanced concepts in smart power integrated circuits. 1. 117–124. 2 indexed citations
15.
Delage, C., Nicolas Nolhier, J.M. Dorkel, et al.. (2001). Analysis and compact modeling of a vertical grounded-base n-p-n bipolar transistor used as ESD protection in a smart power technology. IEEE Journal of Solid-State Circuits. 36(9). 1373–1381. 25 indexed citations
16.
Delage, C., et al.. (1999). The mirrored lateral SCR (MILSCR) as an ESD protection structure: design and optimization using 2-D device simulation. IEEE Journal of Solid-State Circuits. 34(9). 1283–1289. 3 indexed citations
17.
Coquery, G., et al.. (1998). Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications. Microelectronics Reliability. 38(6-8). 1353–1359. 33 indexed citations
18.
Dorkel, J.M., et al.. (1996). Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 19(4). 501–507. 34 indexed citations
19.
Dorkel, J.M., et al.. (1993). A two-port network formalism for 3D heat conduction analysis in multilayered media. International Journal of Heat and Mass Transfer. 36(9). 2317–2326. 20 indexed citations
20.
Dorkel, J.M., et al.. (1987). A new approach to thermal analysis of power devices. IEEE Transactions on Electron Devices. 34(5). 1147–1156. 55 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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