S.H. Shi

590 total citations
23 papers, 404 citations indexed

About

S.H. Shi is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, S.H. Shi has authored 23 papers receiving a total of 404 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 4 papers in Automotive Engineering. Recurrent topics in S.H. Shi's work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (8 papers) and Epoxy Resin Curing Processes (7 papers). S.H. Shi is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (8 papers) and Epoxy Resin Curing Processes (7 papers). S.H. Shi collaborates with scholars based in United States and China. S.H. Shi's co-authors include C.P. Wong, George Jefferson, Yang Rao, Tsuyoshi Yamashita, Longjun Wang, Jianmin Qu, Dabiao Lu, Jianqing Zhu, Yuan Yuan and Qianjun Mao and has published in prestigious journals such as Renewable Energy, Energy and Buildings and Applied Thermal Engineering.

In The Last Decade

S.H. Shi

19 papers receiving 376 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
S.H. Shi United States 10 279 133 105 86 71 23 404
Guojun Hu China 12 241 0.9× 93 0.7× 67 0.6× 85 1.0× 126 1.8× 35 369
Christopher Williams Canada 8 200 0.7× 105 0.8× 59 0.6× 57 0.7× 70 1.0× 16 363
Yu Tao China 10 121 0.4× 50 0.4× 161 1.5× 105 1.2× 47 0.7× 21 357
Byung-Seung Yim South Korea 8 132 0.5× 57 0.4× 63 0.6× 125 1.5× 82 1.2× 37 292
Debasis Nayak India 12 300 1.1× 250 1.9× 116 1.1× 58 0.7× 83 1.2× 29 441
Rong Qi China 10 134 0.5× 78 0.6× 44 0.4× 99 1.2× 49 0.7× 44 361
Yang Qin China 10 117 0.4× 98 0.7× 37 0.4× 188 2.2× 35 0.5× 22 322
Donghyun Lee South Korea 13 421 1.5× 79 0.6× 87 0.8× 69 0.8× 17 0.2× 27 508
Toshiaki Konomi Japan 12 343 1.2× 109 0.8× 82 0.8× 131 1.5× 18 0.3× 58 494
Michael K. Budinski United States 10 289 1.0× 56 0.4× 91 0.9× 82 1.0× 50 0.7× 15 354

Countries citing papers authored by S.H. Shi

Since Specialization
Citations

This map shows the geographic impact of S.H. Shi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S.H. Shi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S.H. Shi more than expected).

Fields of papers citing papers by S.H. Shi

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S.H. Shi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S.H. Shi. The network helps show where S.H. Shi may publish in the future.

Co-authorship network of co-authors of S.H. Shi

This figure shows the co-authorship network connecting the top 25 collaborators of S.H. Shi. A scholar is included among the top collaborators of S.H. Shi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S.H. Shi. S.H. Shi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Shi, S.H., et al.. (2025). A study of the tribo-dynamic behavior of worn water-lubricated bearings during the start-up process. Physica Scripta. 100(5). 55205–55205.
2.
Li, Tao, et al.. (2025). Photothermal performance of glass greenhouse envelope structures based on dynamic nanofluid spectral splitting. Applied Thermal Engineering. 279. 127865–127865.
3.
Li, Tao, et al.. (2025). Comparative experimental study on the cooling effect of passive nanofluid roofs in glass greenhouses. Energy and Buildings. 347. 116341–116341.
4.
5.
6.
Zhu, Jianqing, et al.. (2024). Battery Health State Prediction Based on Singular Spectrum Analysis and Transformer Network. Electronics. 13(13). 2434–2434. 3 indexed citations
7.
Shi, S.H., Dabiao Lu, & C.P. Wong. (2003). Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability. 325–332. 6 indexed citations
8.
Rao, Yang, S.H. Shi, & C.P. Wong. (2003). A simple evaluation methodology of Young's modulus-temperature relationship for the underfill encapsulants. 784–789. 1 indexed citations
9.
Shi, S.H., Tsuyoshi Yamashita, & C.P. Wong. (2003). Development and characterization of imidazole derivative cured bisphenol A epoxy materials for flip-chip underfill applications. 317–324. 7 indexed citations
10.
Shi, S.H., Tsuyoshi Yamashita, & C.P. Wong. (2003). Development of the wafer level compressive-flow underfill process and its required materials. 961–966. 16 indexed citations
11.
12.
Wong, C.P., S.H. Shi, & George Jefferson. (2002). High performance no flow underfills for low-cost flip-chip applications. 850–858. 54 indexed citations
13.
Shi, S.H., et al.. (2002). Development of no-flow underfill materials for lead-free solder bumped flip-chip applications. SMARTech Repository (Georgia Institute of Technology). 278–284. 1 indexed citations
14.
Wong, C.P., et al.. (2002). Characterization of a no-flow underfill encapsulant during the solder reflow process. 1253–1259. 24 indexed citations
15.
16.
Shi, S.H., et al.. (2001). Development of no-flow underfill materials for lead-free solder bumped flip-chip applications. IEEE Transactions on Components and Packaging Technologies. 24(1). 59–66. 12 indexed citations
17.
Rao, Yang, S.H. Shi, & C.P. Wong. (2000). An improved methodology for determining temperature dependent moduli of underfill encapsulants. IEEE Transactions on Components and Packaging Technologies. 23(3). 434–439. 107 indexed citations
18.
Shi, S.H. & C.P. Wong. (1999). Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications. IEEE Transactions on Components and Packaging Technologies. 22(2). 141–151. 17 indexed citations
19.
Shi, S.H. & C.P. Wong. (1999). Effects of the complexed moisture in metal acetylacetonate on the properties of the no-flow underfill materials. Journal of Applied Polymer Science. 73(1). 103–111. 1 indexed citations
20.
Wong, C.P., S.H. Shi, & George Jefferson. (1998). High performance no-flow underfills for low-cost flip-chip applications: material characterization. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 21(3). 450–458. 89 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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