S.H. Shi
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
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- Synthesis and properties of polymers
Papers in
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- Electronic Packaging and Soldering Technologies 12
- 3D IC and TSV technologies 8
- Aerosol Filtration and Electrostatic Precipitation 2
- Advancements in Battery Materials 2
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- Epoxy Resin Curing Processes 7
- Injection Molding Process and Properties 2
- Co-authors
- C.P. Wong (16 shared papers)George Jefferson (2 shared papers)Yang Rao (2 shared papers)Tsuyoshi Yamashita (3 shared papers)Longjun Wang (1 shared paper)Jianmin Qu (1 shared paper)Dabiao Lu (1 shared paper)Jianqing Zhu (2 shared papers)
- Journals
- IEEE Transactions on Components and Packaging Technologies (3 papers)Journal of Applied Polymer Science (1 paper)Energy and Buildings (1 paper)Energies (1 paper)Electronics (1 paper)
- Partner nations
- United StatesChina
In The Last Decade
S.H. Shi
19 papers receiving 376 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 279
- Polymers and Plastics 55
- Automotive Engineering 44
- Mechanical Engineering 133
- Mechanics of Materials 71
Countries citing papers authored by S.H. Shi
This map shows the geographic impact of S.H. Shi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S.H. Shi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S.H. Shi more than expected).
Fields of papers citing papers by S.H. Shi
This network shows the impact of papers produced by S.H. Shi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S.H. Shi. The network helps show where S.H. Shi may publish in the future.
Co-authors
The 13 scholars most cited alongside S.H. Shi, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 107 | |
| 2 | 1998 | 89 | |
| 3 | 2002 | 54 | |
| 4 | 2003 | 29 | |
| 5 | 2002 | 24 | |
| 6 | 2002 | 20 | |
| 7 | 1999 | 17 | |
| 8 | 2003 | 16 | |
| 9 | 2001 | 12 | |
| 10 | 2002 | 12 | |
| 11 | 2003 | 7 | |
| 12 | 2003 | 6 | |
| 13 | 2025 | 3 | |
| 14 | 2024 | 3 | |
| 15 | 2002 | 1 | |
| 16 | 2003 | 1 | |
| 17 | 1999 | 1 | |
| 18 | 2003 | 1 | |
| 19 | 2004 | 1 | |
| 20 | 2025 | 0 |
About S.H. Shi
S.H. Shi is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Mechanics of Materials and Building and Construction, having authored 23 papers that have together received 404 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (8 papers), Epoxy Resin Curing Processes (7 papers), Building Energy and Comfort Optimization (3 papers), Greenhouse Technology and Climate Control (3 papers), Injection Molding Process and Properties (2 papers), Aerosol Filtration and Electrostatic Precipitation (2 papers) and Advancements in Battery Materials (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (279 citations), Polymers and Plastics (55 citations), Automotive Engineering (44 citations), Mechanical Engineering (133 citations) and Mechanics of Materials (71 citations). S.H. Shi has collaborated with scholars based in United States and China. Frequent co-authors include C.P. Wong, George Jefferson, Yang Rao, Tsuyoshi Yamashita, Longjun Wang, Jianmin Qu, Dabiao Lu, Jianqing Zhu, Hong Mo and Yuan Yuan. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, Journal of Applied Polymer Science, Energy and Buildings, Energies and Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.