Tong An

1.4k total citations
115 papers, 1.0k citations indexed

About

Tong An is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Tong An has authored 115 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 86 papers in Electrical and Electronic Engineering, 44 papers in Mechanical Engineering and 29 papers in Mechanics of Materials. Recurrent topics in Tong An's work include Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (31 papers) and Silicon Carbide Semiconductor Technologies (23 papers). Tong An is often cited by papers focused on Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (31 papers) and Silicon Carbide Semiconductor Technologies (23 papers). Tong An collaborates with scholars based in China, United Kingdom and United States. Tong An's co-authors include Fei Qin, Pei Chen, Yanwei Dai, Yanpeng Gong, Si Chen, Chao Fang, Lixiang Zhang, Jingyi Zhao, Zhiwei Zhang and Jinhua Liang and has published in prestigious journals such as IEEE Transactions on Power Electronics, Materials Science and Engineering A and Journal of Environmental Management.

In The Last Decade

Tong An

101 papers receiving 1.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tong An China 19 616 463 305 210 155 115 1.0k
Michael Gaynes United States 21 621 1.0× 767 1.7× 169 0.6× 115 0.5× 121 0.8× 60 1.4k
Weihua Zhou China 20 631 1.0× 684 1.5× 355 1.2× 193 0.9× 193 1.2× 105 1.3k
Yanwei Dai China 18 334 0.5× 396 0.9× 137 0.4× 395 1.9× 98 0.6× 102 854
Yuhou Wu China 17 193 0.3× 491 1.1× 114 0.4× 223 1.1× 194 1.3× 98 878
Peng Song China 14 530 0.9× 149 0.3× 90 0.3× 206 1.0× 117 0.8× 91 919
Ajit Achuthan United States 18 243 0.4× 342 0.7× 98 0.3× 244 1.2× 263 1.7× 51 889
Yiwei Dong China 15 185 0.3× 356 0.8× 103 0.3× 94 0.4× 184 1.2× 58 763
Lifeng Zhang China 15 300 0.5× 343 0.7× 127 0.4× 163 0.8× 133 0.9× 76 727
Ralph Jansen United States 18 581 0.9× 355 0.8× 92 0.3× 111 0.5× 59 0.4× 98 1.4k

Countries citing papers authored by Tong An

Since Specialization
Citations

This map shows the geographic impact of Tong An's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tong An with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tong An more than expected).

Fields of papers citing papers by Tong An

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tong An. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tong An. The network helps show where Tong An may publish in the future.

Co-authorship network of co-authors of Tong An

This figure shows the co-authorship network connecting the top 25 collaborators of Tong An. A scholar is included among the top collaborators of Tong An based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tong An. Tong An is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Zhao, Chaoyue, et al.. (2024). Influence of compressor speed on the performance of low pressure vapor-injected refrigeration systems. Thermal Science. 28(3 Part A). 2043–2049. 1 indexed citations
3.
Li, Haijun, et al.. (2023). Influence of electronic expansion valve on heating performance of vehicle heat pump system. Thermal Science. 27(3 Part A). 1819–1826. 2 indexed citations
4.
Qin, Fei, et al.. (2023). An Improved Thermal Network Model of Press-Pack IGBT Modules Considering Contact Surface Damage. IEEE Transactions on Device and Materials Reliability. 23(4). 444–452. 6 indexed citations
5.
6.
Dai, Yanwei, Shuai Zhao, Fei Qin, et al.. (2023). Shear fracture resistance enhancement through micropatterning on copper substrate for sintered nano silver joints. International Journal of Adhesion and Adhesives. 125. 103422–103422. 4 indexed citations
7.
An, Tong, et al.. (2023). Comparative Study of the Parameter Acquisition Methods for the Cauer Thermal Network Model of an IGBT Module. Electronics. 12(7). 1650–1650. 11 indexed citations
8.
Qin, Fei, et al.. (2022). Effect of Capped Cu Layer on Protrusion Behaviors of Through Silicon via Copper (TSV-Cu) Under Double Annealing Conditions: Comparative Study. IEEE Transactions on Device and Materials Reliability. 23(1). 89–98. 7 indexed citations
9.
Zhang, Min, Fei Qin, Si Chen, et al.. (2022). Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes. Journal of Electronic Materials. 51(5). 2433–2449. 15 indexed citations
10.
An, Tong, Yanzhong Tian, Fei Qin, et al.. (2022). Comparison of junction temperature variations of IGBT modules under DC and PWM power cycling test conditions. Journal of Power Electronics. 22(9). 1561–1575.
11.
An, Tong, Fei Qin, Liang Wang, et al.. (2021). The Effect of the Surface Roughness Characteristics of the Contact Interface on the Thermal Contact Resistance of the PP-IGBT Module. IEEE Transactions on Power Electronics. 37(6). 7286–7298. 18 indexed citations
12.
Qin, Fei, et al.. (2020). Crack Effect on the Equivalent Thermal Conductivity of Porously Sintered Silver. Journal of Electronic Materials. 49(10). 5994–6008. 15 indexed citations
13.
Qin, Fei, et al.. (2020). A Lifetime Prediction Method for IGBT Modules Considering the Self-Accelerating Effect of Bond Wire Damage. IEEE Journal of Emerging and Selected Topics in Power Electronics. 9(2). 2271–2284. 37 indexed citations
14.
Qin, Fei, et al.. (2020). Effect of Crack Evolution on the Resistance and Current Density of the Al Metallization in the IGBT Module During Power Cycling. IEEE Transactions on Device and Materials Reliability. 20(4). 706–715. 2 indexed citations
15.
Qin, Fei, et al.. (2020). Optimization of TSV interconnects and BEOL layers under annealing process through fracture evaluation. Fatigue & Fracture of Engineering Materials & Structures. 43(7). 1433–1445. 8 indexed citations
16.
Zhao, Jingyi, Tong An, Chao Fang, et al.. (2019). A Study on the Effect of Microstructure Evolution of the Aluminum Metallization Layer on Its Electrical Performance During Power Cycling. IEEE Transactions on Power Electronics. 34(11). 11036–11045. 28 indexed citations
17.
Chen, Pei, et al.. (2019). Temperature and grain size dependences of mechanical properties of nanocrystalline copper by molecular dynamics simulation. Modelling and Simulation in Materials Science and Engineering. 27(6). 65012–65012. 25 indexed citations
18.
Chen, Si, Zhizhe Wang, Yunfei En, et al.. (2018). The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. Microelectronics Reliability. 91. 52–66. 17 indexed citations
19.
An, Tong, Fei Qin, Si Chen, & Pei Chen. (2018). The effect of the diffusion creep behavior on the TSV-Cu protrusion morphology during annealing. Journal of Materials Science Materials in Electronics. 29(19). 16305–16316. 16 indexed citations
20.
Chen, Si, Tong An, Fei Qin, & Pei Chen. (2017). Microstructure Evolution and Protrusion of Electroplated Cu-Filled Through-Silicon Vias Subjected to Thermal Cyclic Loading. Journal of Electronic Materials. 46(10). 5916–5932. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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