Pei Chen

4.3k total citations · 1 hit paper
183 papers, 3.4k citations indexed

About

Pei Chen is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Mechanical Engineering. According to data from OpenAlex, Pei Chen has authored 183 papers receiving a total of 3.4k indexed citations (citations by other indexed papers that have themselves been cited), including 80 papers in Electrical and Electronic Engineering, 71 papers in Materials Chemistry and 49 papers in Mechanical Engineering. Recurrent topics in Pei Chen's work include Advanced Surface Polishing Techniques (29 papers), Electronic Packaging and Soldering Technologies (25 papers) and 3D IC and TSV technologies (19 papers). Pei Chen is often cited by papers focused on Advanced Surface Polishing Techniques (29 papers), Electronic Packaging and Soldering Technologies (25 papers) and 3D IC and TSV technologies (19 papers). Pei Chen collaborates with scholars based in China, United States and Australia. Pei Chen's co-authors include Shing‐Chung Wong, Avinash Baji, Mojtaba Abtahi, Yiu‐Wing Mai, Fei Qin, Tong An, Yanwei Dai, Xingfei Song, Rushan Bie and Xiaoyu Ji and has published in prestigious journals such as Chemical Society Reviews, Angewandte Chemie International Edition and Applied Physics Letters.

In The Last Decade

Pei Chen

171 papers receiving 3.3k citations

Hit Papers

Electrospinning of polymer nanofibers: Effects on oriente... 2010 2026 2015 2020 2010 200 400 600
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Electrospinning of polymer nanofibers: Effects on oriented morphology, structures and tensile properties
    2010 686 citations Pei Chen et al. profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Pei Chen China 28 1.2k 1.0k 1.0k 734 611 183 3.4k
Kunal Mondal India 34 1.1k 0.9× 1.1k 1.1× 1.4k 1.4× 406 0.6× 682 1.1× 118 3.7k
Haibin Chen China 31 966 0.8× 584 0.6× 858 0.9× 470 0.6× 778 1.3× 182 3.2k
Lei Wu China 34 1.3k 1.1× 1.6k 1.5× 731 0.7× 433 0.6× 605 1.0× 69 4.6k
Yanbo Liu China 34 1.7k 1.5× 1.2k 1.2× 1.7k 1.7× 398 0.5× 1.0k 1.7× 276 5.0k
Fei Peng China 33 1.6k 1.3× 1.0k 1.0× 973 1.0× 475 0.6× 535 0.9× 148 3.8k
Jialu Li China 32 791 0.7× 1.3k 1.3× 1.3k 1.3× 208 0.3× 650 1.1× 145 3.5k
Wei Cui China 37 1.3k 1.1× 2.1k 2.0× 798 0.8× 795 1.1× 856 1.4× 113 4.6k

Countries citing papers authored by Pei Chen

Since Specialization
Citations

This map shows the geographic impact of Pei Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Pei Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Pei Chen more than expected).

Fields of papers citing papers by Pei Chen

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Pei Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Pei Chen. The network helps show where Pei Chen may publish in the future.

Co-authorship network of co-authors of Pei Chen

This figure shows the co-authorship network connecting the top 25 collaborators of Pei Chen. A scholar is included among the top collaborators of Pei Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Pei Chen. Pei Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Shi, Tuo, Lili Gao, Yang Tian, et al.. (2025). Fully memristive spiking neural network for energy-efficient graph learning. Science Advances. 11(19). eadv2312–eadv2312. 1 indexed citations
2.
Gao, Lihong, et al.. (2024). Effects of raw materials on microstructure and mechanical properties of second phase particles reinforced W Re composites. International Journal of Refractory Metals and Hard Materials. 124. 106860–106860. 4 indexed citations
3.
Zhang, Lina, et al.. (2024). Spherical Indentation Method for Measuring Biaxial Residual Stresses Without Using Stress-Free Sample. Experimental Mechanics. 65(1). 89–106. 9 indexed citations
4.
Chen, Pei, et al.. (2024). The effect of grits interference on materials removal mechanism during scratching process of silicon carbide. Wear. 558-559. 205527–205527. 6 indexed citations
5.
Chen, Pei, Nian Li, Menglu Li, et al.. (2024). Controllable and fast growth of high-quality atomically thin and atomically flat Bi2O2Se films. Applied Physics Letters. 125(17).
6.
Chen, Pei, Yakun Tang, Yang Gao, Yang Zhang, & Lang Liu. (2023). Design and structure optimization of coal-based hierarchical porous carbon by molten salt method for high-performance supercapacitors. Journal of Power Sources. 580. 233334–233334. 39 indexed citations
7.
Chen, Pei, Hui Zhu, Yong Yi, et al.. (2023). Pyrazole-directed functionalization of activated collagen fiber for highly specific capture of iodine vapor. Applied Surface Science. 646. 158917–158917. 5 indexed citations
8.
Zhu, Hui, Pei Chen, Fang Liu, et al.. (2023). In-situ growth nanoscale zero-valent bismuth 3D honeycomb-like material for highly efficient selective capture of iodine vapor in complex environments. Separation and Purification Technology. 330. 125421–125421. 15 indexed citations
9.
Pan, Rui, Yinghao Feng, Zhaoyang Yan, et al.. (2023). Microstructure and mechanical property of Ti/Cu ultra-thin foil lapped joints with different weld depths by nanosecond laser welding. Journal of Manufacturing Processes. 108. 88–97. 12 indexed citations
10.
Chen, Pei, Hui Zhang, Yaping Miao, et al.. (2023). Influence of the Conductivity of Polymer Matrix on the Photocatalytic Activity of PAN–PANI–ZIF8 Electrospun Fiber Membranes. Fibers and Polymers. 24(4). 1253–1264. 7 indexed citations
11.
Wu, Yu, Bingbing Sun, Bingqing Chen, et al.. (2023). Cracking mechanism of GH5188 alloy during laser powder bed fusion additive manufacturing. Materials Characterization. 207. 113548–113548. 11 indexed citations
12.
Yang, Shuying, et al.. (2023). Recent advances in magnetically responsive photonic crystals assembled by anisotropic building blocks: Synthesis, challenges and outstanding applications. Journal of Magnetism and Magnetic Materials. 585. 171097–171097. 7 indexed citations
13.
14.
Qin, Fei, et al.. (2022). Effect of Capped Cu Layer on Protrusion Behaviors of Through Silicon via Copper (TSV-Cu) Under Double Annealing Conditions: Comparative Study. IEEE Transactions on Device and Materials Reliability. 23(1). 89–98. 7 indexed citations
15.
Zhang, Jingwen, Xiaoli Yan, Pei Chen, et al.. (2022). Triangular Heteroporous Covalent Organic Framework via a K‐Shaped “Two‐in‐One” Monomer: Targeted Synthesis and Selective Removal of Organic Pollutants. Macromolecular Rapid Communications. 44(11). e2200894–e2200894. 6 indexed citations
16.
Chen, Weiben, Pei Chen, Dan Chen, et al.. (2022). Triangular Topological 2D Covalent Organic Frameworks Constructed via Symmetric or Asymmetric “Two‐in‐One” Type Monomers. Advanced Science. 9(19). e2105517–e2105517. 30 indexed citations
17.
An, Tong, Fei Qin, Liang Wang, et al.. (2021). The Effect of the Surface Roughness Characteristics of the Contact Interface on the Thermal Contact Resistance of the PP-IGBT Module. IEEE Transactions on Power Electronics. 37(6). 7286–7298. 18 indexed citations
18.
Qin, Fei, et al.. (2020). Crack Effect on the Equivalent Thermal Conductivity of Porously Sintered Silver. Journal of Electronic Materials. 49(10). 5994–6008. 15 indexed citations
19.
An, Tong, Fei Qin, Si Chen, & Pei Chen. (2018). The effect of the diffusion creep behavior on the TSV-Cu protrusion morphology during annealing. Journal of Materials Science Materials in Electronics. 29(19). 16305–16316. 16 indexed citations
20.
Chen, Si, Tong An, Fei Qin, & Pei Chen. (2017). Microstructure Evolution and Protrusion of Electroplated Cu-Filled Through-Silicon Vias Subjected to Thermal Cyclic Loading. Journal of Electronic Materials. 46(10). 5916–5932. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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