Fay Hua

666 total citations
22 papers, 522 citations indexed

About

Fay Hua is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atmospheric Science. According to data from OpenAlex, Fay Hua has authored 22 papers receiving a total of 522 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 7 papers in Atmospheric Science. Recurrent topics in Fay Hua's work include Electronic Packaging and Soldering Technologies (15 papers), nanoparticles nucleation surface interactions (7 papers) and 3D IC and TSV technologies (7 papers). Fay Hua is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), nanoparticles nucleation surface interactions (7 papers) and 3D IC and TSV technologies (7 papers). Fay Hua collaborates with scholars based in United States, United Kingdom and China. Fay Hua's co-authors include Kyoung‐sik Moon, Hongjin Jiang, C.P. Wong, Hai Dong, Seung Wook Yoon, Jong-ook Suh, Jae-Woong Nah, V. Kripesh, J. W. Morris and K. N. Tu and has published in prestigious journals such as Journal of Applied Physics, Chemistry of Materials and Chemical Physics Letters.

In The Last Decade

Fay Hua

22 papers receiving 504 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Fay Hua United States	9	353	165	151	120	105	22	522
Meixia Xiao China	11	97 0.3×	267 1.6×	122 0.8×	80 0.7×	71 0.7×	45	442
Adéla Zemanová Czechia	12	194 0.5×	224 1.4×	301 2.0×	82 0.7×	44 0.4×	39	503
Ondřej Zobač Czechia	11	88 0.2×	268 1.6×	202 1.3×	135 1.1×	49 0.5×	34	476
A. Yakymovych Ukraine	18	378 1.1×	301 1.8×	550 3.6×	81 0.7×	33 0.3×	61	779
Jung-Goo Lee South Korea	13	174 0.5×	150 0.9×	179 1.2×	40 0.3×	273 2.6×	69	519
Feng Hao China	16	162 0.5×	399 2.4×	125 0.8×	35 0.3×	136 1.3×	25	680
Evan Ma China	5	54 0.2×	272 1.6×	76 0.5×	118 1.0×	23 0.2×	8	363
Hui-Chia Yu United States	12	250 0.7×	310 1.9×	159 1.1×	54 0.5×	44 0.4×	13	572
Milena Premović Serbia	11	108 0.3×	171 1.0×	223 1.5×	40 0.3×	30 0.3×	63	367
M. Saitou Japan	12	292 0.8×	209 1.3×	41 0.3×	25 0.2×	37 0.4×	59	467

Countries citing papers authored by Fay Hua

Since Specialization

Citations

This map shows the geographic impact of Fay Hua's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fay Hua with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fay Hua more than expected).

Fields of papers citing papers by Fay Hua

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fay Hua. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fay Hua. The network helps show where Fay Hua may publish in the future.

Co-authorship network of co-authors of Fay Hua

This figure shows the co-authorship network connecting the top 25 collaborators of Fay Hua. A scholar is included among the top collaborators of Fay Hua based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fay Hua. Fay Hua is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Morris, J. W., et al.. (2013). Mechanisms of Creep Deformation in Pure Sn Solder Joints. Journal of Electronic Materials. 42(3). 516–526. 15 indexed citations

Morris, J. W., et al.. (2012). Transformation-Induced Plasticity in Sn-In Solder Joints. Journal of Electronic Materials. 42(1). 168–178. 7 indexed citations

Morris, J. W., et al.. (2011). Martensitic Transformation in Sn-Rich SnIn Solder Joints. Journal of Electronic Materials. 41(2). 336–351. 10 indexed citations

Kang, Sung K., Iver E. Anderson, Laura J. Turbini, et al.. (2009). Foreword. Journal of Electronic Materials. 38(12). 2427–2428. 1 indexed citations

Henshall, G.A., Ranjit Pandher, Richard Coyle, et al.. (2009). Addressing opportunities and risks of pb-free solder alloy alternatives. 1–11. 7 indexed citations

Henshall, G.A., et al.. (2008). Addressing industry knowledge gaps regarding new Pb-free solder alloy alternatives. 1–12. 6 indexed citations

Guo, Fu, et al.. (2008). Foreword. Journal of Electronic Materials. 38(2). 209–209. 1 indexed citations

Grugel, Richard N., et al.. (2008). Materials research conducted aboard the International Space Station: Facilities overview, operational procedures, and experimental outcomes. Acta Astronautica. 62(8-9). 491–498. 8 indexed citations

Jiang, Hongjin, Kyoung‐sik Moon, Yangyang Sun, et al.. (2007). Tin/Indium nanobundle formation from aggregation or growth of nanoparticles. Journal of Nanoparticle Research. 10(1). 41–46. 7 indexed citations

10.

Jiang, Hongjin, Kyoung‐sik Moon, Fay Hua, & C.P. Wong. (2007). Tin/silver alloy nanoparticles for low temperature lead-free interconnect applications. 65. 321–324. 3 indexed citations

11.

Jiang, Hongjin, Kyoung‐sik Moon, Fay Hua, & C.P. Wong. (2007). Thermal Properties of Tin/Silver Alloy Nanoparticles for Low Temperature Lead-free Interconnect Technology. 54–58. 4 indexed citations

12.

Jiang, Hongjin, Kyoung‐sik Moon, Fay Hua, & C.P. Wong. (2007). Synthesis and Thermal and Wetting Properties of Tin/Silver Alloy Nanoparticles for Low Melting Point Lead-Free Solders. Chemistry of Materials. 19(18). 4482–4485. 102 indexed citations

13.

Dong, Hai, Kyoung‐sik Moon, Hongjin Jiang, C.P. Wong, & Fay Hua. (2006). Simulation study of nanoparticle melting behavior for lead free nano solder application. 107–107. 1 indexed citations

14.

Raman, Arun, et al.. (2006). The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging. JOM. 58(6). 67–74. 66 indexed citations

15.

Nah, Jae-Woong, Jong-ook Suh, K. N. Tu, et al.. (2006). Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect. Journal of Applied Physics. 100(12). 83 indexed citations

16.

Oh, K.H., et al.. (2005). The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb. Journal of Electronic Materials. 34(10). 1287–1300. 8 indexed citations

17.

Hua, Fay, et al.. (2002). Anomalous Creep in Sn-Rich Solder Joints. MATERIALS TRANSACTIONS. 43(8). 1847–1853. 27 indexed citations

18.

Hua, Fay, et al.. (2002). Adhesion strength of solder joints to Alloy 42 component leads. 17. 1110–1116. 2 indexed citations

19.

Hua, Fay & R. N. Grugel. (1996). Direct observation of the columnar to equiaxed zone transition in an undercooled melt. Scripta Materialia. 34(4). 573–577. 3 indexed citations

20.

Hua, Fay & R. N. Grugel. (1995). Microstructural development in undercooled lead- tin eutectic alloys. Metallurgical and Materials Transactions A. 26(10). 2699–2706. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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