Fay Hua
Impact in
- Atmospheric Science top 10%
- nanoparticles nucleation surface interactions
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Nanomaterials and Printing Technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 15
- 3D IC and TSV technologies 7
- Nanomaterials and Printing Technologies 4
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- Aluminum Alloys Composites Properties 4
- Advanced Welding Techniques Analysis 3
- Co-authors
- Kyoung‐sik Moon (6 shared papers)Hongjin Jiang (6 shared papers)C.P. Wong (5 shared papers)Hai Dong (2 shared papers)Vempati Srinivasa Rao (1 shared paper)Seung Wook Yoon (1 shared paper)K. N. Tu (1 shared paper)V. Kripesh (1 shared paper)
- Journals
- Journal of Electronic Materials (6 papers)Scripta Materialia (1 paper)Metallurgical and Materials Transactions A (1 paper)Journal of Nanoparticle Research (1 paper)Chemical Physics Letters (1 paper)
- Partner nations
- United StatesUnited KingdomChina
In The Last Decade
Fay Hua
22 papers receiving 511 citations
Peers
Comparison fields: 5 of 49
- Atmospheric Science 120
- Electrical and Electronic Engineering 354
- Electronic, Optical and Magnetic Materials 105
- General Materials Science 17
- Mechanical Engineering 153
Countries citing papers authored by Fay Hua
This map shows the geographic impact of Fay Hua's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fay Hua with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fay Hua more than expected).
Fields of papers citing papers by Fay Hua
This network shows the impact of papers produced by Fay Hua. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fay Hua. The network helps show where Fay Hua may publish in the future.
Co-authors
The 25 scholars most cited alongside Fay Hua, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 22 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 156 | |
| 2 | 2007 | 103 | |
| 3 | 2006 | 83 | |
| 4 | 2006 | 68 | |
| 5 | 2002 | 27 | |
| 6 | 2013 | 15 | |
| 7 | 2011 | 10 | |
| 8 | 2008 | 8 | |
| 9 | 2005 | 8 | |
| 10 | 2007 | 7 | |
| 11 | 2012 | 7 | |
| 12 | Addressing opportunities and risks of pb-free solder alloy alternatives | 2009 | 7 |
| 13 | 2008 | 6 | |
| 14 | 1995 | 4 | |
| 15 | 2007 | 4 | |
| 16 | 2007 | 3 | |
| 17 | 1996 | 3 | |
| 18 | 2002 | 2 | |
| 19 | 2009 | 1 | |
| 20 | 2006 | 1 |
About Fay Hua
Fay Hua is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Atmospheric Science, Materials Chemistry and Aerospace Engineering, having authored 22 papers that have together received 525 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (7 papers), nanoparticles nucleation surface interactions (7 papers), Nanomaterials and Printing Technologies (4 papers), Aluminum Alloys Composites Properties (4 papers), Advanced Welding Techniques Analysis (3 papers), Aluminum Alloy Microstructure Properties (3 papers) and Solidification and crystal growth phenomena (2 papers). The work is most often cited by research in Atmospheric Science (120 citations), Electrical and Electronic Engineering (354 citations), Electronic, Optical and Magnetic Materials (105 citations), General Materials Science (17 citations) and Mechanical Engineering (153 citations). Fay Hua has collaborated with scholars based in United States, United Kingdom and China. Frequent co-authors include Kyoung‐sik Moon, Hongjin Jiang, C.P. Wong, Hai Dong, Vempati Srinivasa Rao, Seung Wook Yoon, K. N. Tu, V. Kripesh, Jong-ook Suh and Jae-Woong Nah. Their work appears in journals such as Journal of Electronic Materials, Scripta Materialia, Metallurgical and Materials Transactions A, Journal of Nanoparticle Research and Chemical Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.