D. Huff

582 total citations
23 papers, 479 citations indexed

About

D. Huff is a scholar working on Electrical and Electronic Engineering, Surgery and Mechanics of Materials. According to data from OpenAlex, D. Huff has authored 23 papers receiving a total of 479 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 8 papers in Surgery and 4 papers in Mechanics of Materials. Recurrent topics in D. Huff's work include Electronic Packaging and Soldering Technologies (11 papers), Orthopaedic implants and arthroplasty (8 papers) and 3D IC and TSV technologies (7 papers). D. Huff is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Orthopaedic implants and arthroplasty (8 papers) and 3D IC and TSV technologies (7 papers). D. Huff collaborates with scholars based in United States, Australia and New Zealand. D. Huff's co-authors include Rolando Burgos, Dushan Boroyevich, F. Wang, Manas Ranjan Dash, Zhiguo Wang, F. Patrick McCluskey, Khai D. T. Ngo, Puqi Ning, Rixin Lai and Rami Al‐Dirini and has published in prestigious journals such as IEEE Transactions on Power Electronics, Journal of Biomechanics and Journal of Orthopaedic Research®.

In The Last Decade

D. Huff

23 papers receiving 451 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
D. Huff United States 11 329 120 111 30 27 23 479
A. Guedes Portugal 12 45 0.1× 257 2.1× 31 0.3× 48 1.6× 152 5.6× 29 339
Odila Florêncio Brazil 11 48 0.1× 198 1.6× 54 0.5× 67 2.2× 291 10.8× 60 346
Qiaofu Zhang United States 11 36 0.1× 355 3.0× 28 0.3× 29 1.0× 186 6.9× 16 416
Ralf Schneider Germany 7 22 0.1× 169 1.4× 66 0.6× 43 1.4× 87 3.2× 12 334
Xiangkui Zhou China 11 58 0.2× 257 2.1× 17 0.2× 25 0.8× 184 6.8× 25 336
Shih-Jeh Wu Taiwan 10 68 0.2× 39 0.3× 10 0.1× 198 6.6× 108 4.0× 30 334
G. Aldrich-Smith United Kingdom 10 35 0.1× 195 1.6× 27 0.2× 37 1.2× 176 6.5× 15 345
K. G. Stjernberg Sweden 8 83 0.3× 298 2.5× 45 0.4× 19 0.6× 149 5.5× 8 419
Yoshinori Funada Japan 12 58 0.2× 269 2.2× 6 0.1× 25 0.8× 84 3.1× 48 379
Guangfeng Zhao United States 9 74 0.2× 485 4.0× 11 0.1× 47 1.6× 98 3.6× 21 595

Countries citing papers authored by D. Huff

Since Specialization
Citations

This map shows the geographic impact of D. Huff's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Huff with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Huff more than expected).

Fields of papers citing papers by D. Huff

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. Huff. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Huff. The network helps show where D. Huff may publish in the future.

Co-authorship network of co-authors of D. Huff

This figure shows the co-authorship network connecting the top 25 collaborators of D. Huff. A scholar is included among the top collaborators of D. Huff based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D. Huff. D. Huff is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Myers, Casey A., D. Huff, J. Bohannon Mason, & Paul J. Rullkoetter. (2021). Effect of intraoperative treatment options on hip joint stability following total hip arthroplasty. Journal of Orthopaedic Research®. 40(3). 604–613. 7 indexed citations
2.
Huff, D., Casey A. Myers, & Paul J. Rullkoetter. (2020). Impact of alignment and kinematic variation on resistive moment and dislocation propensity for THA with lipped and neutral liners. Biomechanics and Modeling in Mechanobiology. 19(4). 1297–1307. 3 indexed citations
3.
Myers, Casey A., Clare K. Fitzpatrick, D. Huff, Peter J. Laz, & Paul J. Rullkoetter. (2020). Development and calibration of a probabilistic finite element hip capsule representation. Computer Methods in Biomechanics & Biomedical Engineering. 23(11). 755–764. 7 indexed citations
4.
Al‐Dirini, Rami, Saulo Martelli, D. Huff, et al.. (2018). Evaluating the primary stability of standard vs lateralised cementless femoral stems – A finite element study using a diverse patient cohort. Clinical Biomechanics. 59. 101–109. 10 indexed citations
5.
Myers, Casey A., Peter J. Laz, Kevin B. Shelburne, et al.. (2018). The impact of hip implant alignment on muscle and joint loading during dynamic activities. Clinical Biomechanics. 53. 93–100. 27 indexed citations
6.
Al‐Dirini, Rami, Saulo Martelli, D. Huff, et al.. (2018). Virtual trial to evaluate the robustness of cementless femoral stems to patient and surgical variation. Journal of Biomechanics. 82. 346–356. 18 indexed citations
7.
Al‐Dirini, Rami, et al.. (2018). Biomechanical Robustness of a Contemporary Cementless Stem to Surgical Variation in Stem Size and Position. Journal of Biomechanical Engineering. 140(9). 15 indexed citations
8.
Al‐Dirini, Rami, D. Huff, Zhang Ju, et al.. (2017). Influence of collars on the primary stability of cementless femoral stems: A finite element study using a diverse patient cohort. Journal of Orthopaedic Research®. 36(4). 1185–1195. 35 indexed citations
9.
10.
Ning, Puqi, Rixin Lai, D. Huff, Fred Wang, & Khai D. T. Ngo. (2009). SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment. 631–636. 11 indexed citations
11.
Ning, Puqi, Rixin Lai, D. Huff, Fred Wang, & Khai D. T. Ngo. (2008). 250 °C SiC Power Module Package Design. SAE technical papers on CD-ROM/SAE technical paper series. 1. 3 indexed citations
12.
Huff, D., et al.. (2007). Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules. 2234–2240. 116 indexed citations
13.
McCluskey, F. Patrick, Manas Ranjan Dash, Zhiguo Wang, & D. Huff. (2006). Reliability of high temperature solder alternatives. Microelectronics Reliability. 46(9-11). 1910–1914. 77 indexed citations
14.
Huff, D., D.C. Katsis, Kelly L. Stinson-Bagby, et al.. (2004). Reliability and microstructure of lead-free solder die attach interface in silicon power devices. 567–568. 2 indexed citations
15.
16.
Wen, Shuang, D. Huff, & Guo‐Quan Lu. (2002). Dimple-array interconnect technique for packaging power semiconductor devices and modules. 69–74. 20 indexed citations
17.
Wen, Shuang, D. Huff, & Guo‐Quan Lu. (2002). Enhancement of thermal fatigue reliability of power semiconductor interconnects using dimple-array solder joints. 4. 1926–1931. 2 indexed citations
18.
Wen, Shuang, D. Huff, & Guo‐Quan Lu. (2002). Design and thermo-mechanical analysis of a Dimple-Array Interconnect technique for power semiconductor devices. 47. 378–383. 4 indexed citations
19.
Pedrotti, Kenneth D., David C. Meeker, Donghai Wu, et al.. (2002). 40 Gb/s WDM cross-connect with an electronic switching core: preliminary results from the WEST Consortium. 2. 336–337. 1 indexed citations
20.
Huff, D., et al.. (2001). A Dimple-Array Interconnect Technique for Power Semiconductor Devices. MRS Proceedings. 682. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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