D. Huff
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
Papers in
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- Electronic Packaging and Soldering Technologies 11
- 3D IC and TSV technologies 7
- Silicon Carbide Semiconductor Technologies 5
- Electromagnetic Compatibility and Noise Suppression 4
- Silicon and Solar Cell Technologies 3
- Surgery 8
- Orthopaedic implants and arthroplasty 8
- Total Knee Arthroplasty Outcomes 6
- Orthopedic Infections and Treatments 5
- Co-authors
- Rolando Burgos (1 shared paper)F. Wang (1 shared paper)Dushan Boroyevich (1 shared paper)Zhiguo Wang (2 shared papers)F. Patrick McCluskey (2 shared papers)Manas Ranjan Dash (2 shared papers)Puqi Ning (3 shared papers)Rixin Lai (3 shared papers)
- Journals
- Clinical Biomechanics (2 papers)Journal of Orthopaedic Research® (2 papers)Computer Methods in Biomechanics & Biomedical Engineering (1 paper)Journal of Biomechanics (1 paper)Biomechanics and Modeling in Mechanobiology (1 paper)
- Partner nations
- United StatesAustraliaNew Zealand
In The Last Decade
D. Huff
23 papers receiving 451 citations
Peers
Comparison fields: 5 of 51
- Electrical and Electronic Engineering 329
- Ceramics and Composites 25
- Mechanical Engineering 120
- Surgery 111
- General Materials Science 4
Countries citing papers authored by D. Huff
This map shows the geographic impact of D. Huff's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Huff with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Huff more than expected).
Fields of papers citing papers by D. Huff
This network shows the impact of papers produced by D. Huff. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Huff. The network helps show where D. Huff may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Huff, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 116 | |
| 2 | 2009 | 94 | |
| 3 | 2006 | 77 | |
| 4 | 2017 | 35 | |
| 5 | 2018 | 27 | |
| 6 | 2002 | 20 | |
| 7 | 2018 | 18 | |
| 8 | 2004 | 17 | |
| 9 | 2018 | 15 | |
| 10 | 2009 | 11 | |
| 11 | 2018 | 10 | |
| 12 | 2020 | 7 | |
| 13 | 2021 | 7 | |
| 14 | 2006 | 7 | |
| 15 | 2002 | 4 | |
| 16 | 2020 | 3 | |
| 17 | 2008 | 3 | |
| 18 | 2002 | 2 | |
| 19 | 2004 | 2 | |
| 20 | 2001 | 1 |
About D. Huff
D. Huff is a scholar working on Electrical and Electronic Engineering, Surgery, Mechanics of Materials, Mechanical Engineering and Civil and Structural Engineering, having authored 23 papers that have together received 479 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), Orthopaedic implants and arthroplasty (8 papers), 3D IC and TSV technologies (7 papers), Total Knee Arthroplasty Outcomes (6 papers), Orthopedic Infections and Treatments (5 papers), Silicon Carbide Semiconductor Technologies (5 papers), Electromagnetic Compatibility and Noise Suppression (4 papers) and Silicon and Solar Cell Technologies (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (329 citations), Ceramics and Composites (25 citations), Mechanical Engineering (120 citations), Surgery (111 citations) and General Materials Science (4 citations). D. Huff has collaborated with scholars based in United States, Australia and New Zealand. Frequent co-authors include Rolando Burgos, F. Wang, Dushan Boroyevich, Zhiguo Wang, F. Patrick McCluskey, Manas Ranjan Dash, Puqi Ning, Rixin Lai, Khai D. T. Ngo and Rami Al‐Dirini. Their work appears in journals such as Clinical Biomechanics, Journal of Orthopaedic Research®, Computer Methods in Biomechanics & Biomedical Engineering, Journal of Biomechanics and Biomechanics and Modeling in Mechanobiology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.