Kimmo Kaija
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
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- Nanomaterials and Printing Technologies
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
Papers in
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- Nanomaterials and Printing Technologies 10
- Electronic Packaging and Soldering Technologies 5
- 3D IC and TSV technologies 3
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- Additive Manufacturing and 3D Printing Technologies 10
- Co-authors
- Pauliina Mansikkamäki (10 shared papers)Matti Mäntysalo (10 shared papers)Juha Niittynen (5 shared papers)Eerik Halonen (4 shared papers)E. Ristolainen (1 shared paper)Kenichi Hashizume (2 shared papers)Toni Björninen (1 shared paper)Hiroshi Saito (1 shared paper)
- Journals
- Microelectronic Engineering (3 papers)Journal of Imaging Science and Technology (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)Microelectronics Reliability (1 paper)Journal of Microelectronics and Electronic Packaging (1 paper)
- Partner nations
- FinlandUnited StatesGermany
In The Last Decade
Kimmo Kaija
14 papers receiving 299 citations
Peers
Comparison fields: 5 of 50
- Automotive Engineering 93
- Electrical and Electronic Engineering 289
- Biomedical Engineering 167
- Media Technology 31
- Bioengineering 9
Countries citing papers authored by Kimmo Kaija
This map shows the geographic impact of Kimmo Kaija's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kimmo Kaija with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kimmo Kaija more than expected).
Fields of papers citing papers by Kimmo Kaija
This network shows the impact of papers produced by Kimmo Kaija. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kimmo Kaija. The network helps show where Kimmo Kaija may publish in the future.
Co-authors
The 18 scholars most cited alongside Kimmo Kaija, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 59 | |
| 2 | 2007 | 51 | |
| 3 | 2010 | 40 | |
| 4 | 2004 | 39 | |
| 5 | 2008 | 38 | |
| 6 | 2009 | 34 | |
| 7 | 2010 | 25 | |
| 8 | 2009 | 16 | |
| 9 | 2009 | 14 | |
| 10 | 2010 | 10 | |
| 11 | 2007 | 9 | |
| 12 | Evaluation of printed electronics manufacturing line with sensor platform application | 2009 | 8 |
| 13 | 2009 | 4 | |
| 14 | 2007 | 1 |
About Kimmo Kaija
Kimmo Kaija is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Biomedical Engineering, Mechanical Engineering and Computer Vision and Pattern Recognition, having authored 14 papers that have together received 348 indexed citations. Recurring topics across this work include Additive Manufacturing and 3D Printing Technologies (10 papers), Nanomaterials and Printing Technologies (10 papers), Nanofabrication and Lithography Techniques (6 papers), Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (3 papers), RFID technology advancements (1 paper), Heat Transfer and Optimization (1 paper) and Music Technology and Sound Studies (1 paper). The work is most often cited by research in Automotive Engineering (93 citations), Electrical and Electronic Engineering (289 citations), Biomedical Engineering (167 citations), Media Technology (31 citations) and Bioengineering (9 citations). Kimmo Kaija has collaborated with scholars based in Finland, United States and Germany. Frequent co-authors include Pauliina Mansikkamäki, Matti Mäntysalo, Juha Niittynen, Eerik Halonen, E. Ristolainen, Kenichi Hashizume, Toni Björninen, Hiroshi Saito, Timo Joutsenoja and Juha Virtanen. Their work appears in journals such as Microelectronic Engineering, Journal of Imaging Science and Technology, IEEE Transactions on Components and Packaging Technologies, Microelectronics Reliability and Journal of Microelectronics and Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.