Cheng‐Yi Liu
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Materials Chemistry top 10%
- Epidemiology top 10%
- Molecular Medicine top 1%
- Co-authors
- Shih‐Jung WangYu‐Chun ChuangPo‐Ren HsuehYung-Ching LiuKwok-Woon YuFu‐Der WangKwen‐Tay LuhHow Tseng
- Topics
- Electronic Packaging and Soldering Technologies (61 papers)3D IC and TSV technologies (34 papers)GaN-based semiconductor devices and materials (32 papers)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Cheng‐Yi Liu
143 papers receiving 2.5k citations
Peers
Comparison fields: 5 of 148
- Electrical and Electronic Engineering 1.1k
- Mechanical Engineering 540
- Materials Chemistry 424
- Epidemiology 420
- Molecular Medicine 310
Countries citing papers authored by Cheng‐Yi Liu
This map shows the geographic impact of Cheng‐Yi Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cheng‐Yi Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cheng‐Yi Liu more than expected).
Fields of papers citing papers by Cheng‐Yi Liu
This network shows the impact of papers produced by Cheng‐Yi Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cheng‐Yi Liu. The network helps show where Cheng‐Yi Liu may publish in the future.
Co-authorship network of co-authors of Cheng‐Yi Liu
This figure shows the co-authorship network connecting the top 25 collaborators of Cheng‐Yi Liu. A scholar is included among the top collaborators of Cheng‐Yi Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Cheng‐Yi Liu. Cheng‐Yi Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 0 | |
| 5 | 1 | |
| 6 | 1 | |
| 7 | 5 | |
| 8 | 23 | |
| 9 | 27 | |
| 10 | 11 | |
| 11 | 7 | |
| 12 | 16 | |
| 13 | 10 | |
| 14 | 168 | |
| 15 | 92 | |
| 16 | 44 | |
| 17 | 84 | |
| 18 | 30 | |
| 19 | 17 | |
| 20 | 18 |
About Cheng‐Yi Liu
Cheng‐Yi Liu is a scholar working on Applied Microbiology and Biotechnology, Condensed Matter Physics and General Materials Science, having authored 150 papers that have together received 2.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (61 papers), 3D IC and TSV technologies (34 papers) and GaN-based semiconductor devices and materials (32 papers). The work is most often cited by research in Molecular Medicine (310 citations), Applied Microbiology and Biotechnology (100 citations) and Endocrinology (200 citations). Cheng‐Yi Liu has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Shih‐Jung Wang, Yu‐Chun Chuang, Po‐Ren Hsueh, Yung-Ching Liu, Kwok-Woon Yu, Fu‐Der Wang, Kwen‐Tay Luh, How Tseng, Yi-Tsung Lin and Wen‐Sen Lee. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and NeuroImage.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.