Ping Wu

1.9k total citations
79 papers, 1.6k citations indexed

About

Ping Wu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Ping Wu has authored 79 papers receiving a total of 1.6k indexed citations (citations by other indexed papers that have themselves been cited), including 49 papers in Electrical and Electronic Engineering, 38 papers in Mechanical Engineering and 26 papers in Materials Chemistry. Recurrent topics in Ping Wu's work include Electronic Packaging and Soldering Technologies (35 papers), Intermetallics and Advanced Alloy Properties (22 papers) and 3D IC and TSV technologies (17 papers). Ping Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (35 papers), Intermetallics and Advanced Alloy Properties (22 papers) and 3D IC and TSV technologies (17 papers). Ping Wu collaborates with scholars based in China, United States and Singapore. Ping Wu's co-authors include Wei Zhou, Wei Zhou, Yinghua Liang, H.L. Bai, Zhi‐Qing Li, Xuezheng Li, Yong Ma, Lizhuang Yang, E.Y. Jiang and Hongmei Du and has published in prestigious journals such as Journal of Applied Physics, The Journal of Physical Chemistry C and Chemical Physics Letters.

In The Last Decade

Ping Wu

76 papers receiving 1.5k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ping Wu China 22 987 865 612 233 167 79 1.6k
Yong-Seog Kim South Korea 23 694 0.7× 1.0k 1.2× 1.4k 2.4× 74 0.3× 291 1.7× 63 1.9k
Chin C. Lee United States 21 975 1.0× 450 0.5× 245 0.4× 113 0.5× 117 0.7× 94 1.3k
Junxi Yu China 23 358 0.4× 766 0.9× 617 1.0× 187 0.8× 255 1.5× 50 1.4k
Fan-Yi Ouyang Taiwan 21 731 0.7× 687 0.8× 352 0.6× 207 0.9× 174 1.0× 59 1.3k
Heike Gabrisch United States 21 730 0.7× 692 0.8× 580 0.9× 146 0.6× 87 0.5× 47 1.4k
J. Echigoya Japan 19 344 0.3× 545 0.6× 660 1.1× 324 1.4× 247 1.5× 83 1.2k
Albert T. Wu Taiwan 22 998 1.0× 408 0.5× 538 0.9× 282 1.2× 83 0.5× 88 1.3k
Damian M. Cupid Germany 18 495 0.5× 542 0.6× 371 0.6× 72 0.3× 53 0.3× 54 983
Guoqiang Xie China 22 176 0.2× 795 0.9× 578 0.9× 349 1.5× 90 0.5× 75 1.3k
Touwen Fan China 20 201 0.2× 856 1.0× 737 1.2× 167 0.7× 169 1.0× 83 1.4k

Countries citing papers authored by Ping Wu

Since Specialization
Citations

This map shows the geographic impact of Ping Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ping Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ping Wu more than expected).

Fields of papers citing papers by Ping Wu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ping Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ping Wu. The network helps show where Ping Wu may publish in the future.

Co-authorship network of co-authors of Ping Wu

This figure shows the co-authorship network connecting the top 25 collaborators of Ping Wu. A scholar is included among the top collaborators of Ping Wu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ping Wu. Ping Wu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wu, Jun-Bao, et al.. (2025). Role of chlorine adsorption in regulating surface work functions of Cu–Sn alloy system: A first-principles study. Materials Chemistry and Physics. 337. 130566–130566. 2 indexed citations
2.
Xie, Chao, et al.. (2025). Experimental study and molecular dynamics simulation of bonding properties at the organic coating-cement substrate interface. Construction and Building Materials. 501. 144344–144344.
3.
Wu, Ping, Jie Feng, Miao Wang, et al.. (2024). Water filter: a rapid water environmental DNA collector in the field. Frontiers in Environmental Science. 12. 8 indexed citations
4.
Guo, Weiqi, Peng Liu, & Ping Wu. (2023). Effect of Cu on the diffusion behavior of Bi in Sn matrix during electromigration. Materials Characterization. 204. 113185–113185. 5 indexed citations
5.
6.
Liu, Peng, Weiqi Guo, & Ping Wu. (2022). Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint. Journal of Materials Science. 57(32). 15598–15611. 9 indexed citations
7.
Lin, Xiang, Weiwei Zhang, Zhuo Mao, et al.. (2020). Effect of Au Doping on Elastic, Thermodynamic, and Electronic Properties of η-Cu6Sn5 Intermetallic. Journal of Electronic Materials. 49(5). 3031–3038. 3 indexed citations
8.
Qi, Mengyu, et al.. (2020). Strain-improved electronic and magnetic properties of V-, Cr-, Mn- and Fe-doped α- and β-tellurene. Applied Surface Science. 541. 148454–148454. 9 indexed citations
9.
Liu, Peng, et al.. (2020). The reliability assessment of Au–Al bonds using parallel gap resistance microwelding. Journal of Materials Science Materials in Electronics. 31(8). 6313–6320. 7 indexed citations
10.
Zhu, Wenbo, et al.. (2019). Improved microstructure and mechanical properties for SnBi solder alloy by addition of Cr powders. Journal of Alloys and Compounds. 789. 805–813. 60 indexed citations
11.
Сун, Лили, Wei Zhou, Yanyu Liu, et al.. (2016). Theoretical perspective on the electronic, magnetic and optical properties of Zn-doped monolayer SnS2. Applied Surface Science. 389. 484–490. 43 indexed citations
12.
Wu, Ping, et al.. (2016). Improved microstructure and mechanical properties for Sn58Bi0.7Zn solder joint by addition of graphene nanosheets. Journal of Alloys and Compounds. 671. 127–136. 57 indexed citations
13.
Wu, Ping, et al.. (2015). Effects of Zn addition on mechanical properties of eutectic Sn–58Bi solder during liquid-state aging. Transactions of Nonferrous Metals Society of China. 25(4). 1225–1233. 50 indexed citations
14.
15.
Zhou, Wei, et al.. (2012). Abnormal accumulation and rotation of Sn in Cu-cored Sn solder joints under current stressing. Materials Chemistry and Physics. 136(2-3). 985–989. 3 indexed citations
16.
Li, Shu, Ping Wu, Wei Zhou, & Teiichi Ando. (2007). Kinetics of heterogeneous nucleation of gas-atomized Sn–5mass%Pb droplets. Materials Science and Engineering A. 473(1-2). 206–212. 19 indexed citations
17.
Wu, Ping, et al.. (2006). The growth of soft magnetic FeNiN thin films under different experimental procedures. Journal of Magnetism and Magnetic Materials. 312(1). 147–152. 2 indexed citations
18.
Li, Zhi‐Qing, Wei Song, Haitao Liu, et al.. (2005). Charge ordering, magnetic, electrical transport and thermal transport properties of Nd0.75Na0.25MnO3 manganite. Physica B Condensed Matter. 371(1). 177–181. 9 indexed citations
19.
Li, Zhi‐Qing, Xinjun Liu, Haitao Liu, et al.. (2004). Competition between the charge ordered and ferromagnetic states in (La,Nd)0.75Na0.25MnO3 manganites. Physics Letters A. 325(5-6). 430–434. 8 indexed citations
20.
Mi, Wenbo, Ling Guo, E. Y. Jiang, et al.. (2003). Structure and magnetic properties of facing-target sputtered Co–C granular films. Journal of Physics D Applied Physics. 36(19). 2393–2399. 35 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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