Ping Wu
Impact in
- Mechanical Engineering top 2%
- Aluminum Alloys Composites Properties
- Intermetallics and Advanced Alloy Properties
- Advanced materials and composites
- Advanced Welding Techniques Analysis
- General Materials Science top 1%
Papers in ⓘ
-
- Copper Interconnects and Reliability 8
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- Intermetallics and Advanced Alloy Properties 22
- Aluminum Alloys Composites Properties 13
- Co-authors
- Wei Zhou (16 shared papers)Wei Zhou (13 shared papers)Yinghua Liang (7 shared papers)H.L. Bai (12 shared papers)Zhi‐Qing Li (11 shared papers)Yong Ma (6 shared papers)Xuezheng Li (6 shared papers)Lizhuang Yang (4 shared papers)
- Journals
- Materials Science and Engineering A (9 papers)Journal of Electronic Materials (9 papers)Applied Surface Science (7 papers)Journal of Alloys and Compounds (6 papers)Journal of Materials Science Materials in Electronics (5 papers)
- Partner nations
- ChinaUnited StatesSingapore
In The Last Decade
Ping Wu
76 papers receiving 1.5k citations
Peers
Comparison fields: 5 of 46
- Mechanical Engineering 865
- General Materials Science 67
- Electrical and Electronic Engineering 987
- Materials Chemistry 612
- Electronic, Optical and Magnetic Materials 233
Countries citing papers authored by Ping Wu
This map shows the geographic impact of Ping Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ping Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ping Wu more than expected).
Fields of papers citing papers by Ping Wu
This network shows the impact of papers produced by Ping Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ping Wu. The network helps show where Ping Wu may publish in the future.
Co-authors
The 25 scholars most cited alongside Ping Wu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 79 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 172 | |
| 2 | 2016 | 84 | |
| 3 | 2017 | 76 | |
| 4 | 2016 | 64 | |
| 5 | 2019 | 60 | |
| 6 | 2015 | 60 | |
| 7 | 2016 | 57 | |
| 8 | 2013 | 53 | |
| 9 | 2015 | 50 | |
| 10 | 2014 | 49 | |
| 11 | 2017 | 47 | |
| 12 | 2016 | 46 | |
| 13 | 2016 | 43 | |
| 14 | 2013 | 42 | |
| 15 | 2003 | 35 | |
| 16 | 2014 | 33 | |
| 17 | 2016 | 32 | |
| 18 | 2015 | 30 | |
| 19 | 2018 | 26 | |
| 20 | 2018 | 25 |
About Ping Wu
Ping Wu is a scholar working on Electronic, Optical and Magnetic Materials, Mechanical Engineering, Electrical and Electronic Engineering, General Materials Science and Materials Chemistry, having authored 79 papers that have together received 1.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (35 papers), Intermetallics and Advanced Alloy Properties (22 papers), 3D IC and TSV technologies (17 papers), 2D Materials and Applications (15 papers), Aluminum Alloys Composites Properties (13 papers), Metal and Thin Film Mechanics (11 papers), Copper Interconnects and Reliability (8 papers) and Magnetic properties of thin films (8 papers). The work is most often cited by research in Mechanical Engineering (865 citations), General Materials Science (67 citations), Electrical and Electronic Engineering (987 citations), Materials Chemistry (612 citations) and Electronic, Optical and Magnetic Materials (233 citations). Ping Wu has collaborated with scholars based in China, United States and Singapore. Frequent co-authors include Wei Zhou, Wei Zhou, Yinghua Liang, H.L. Bai, Zhi‐Qing Li, Yong Ma, Xuezheng Li, Lizhuang Yang, E.Y. Jiang and Hongmei Du. Their work appears in journals such as Materials Science and Engineering A, Journal of Electronic Materials, Applied Surface Science, Journal of Alloys and Compounds and Journal of Materials Science Materials in Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.