C. A. Neugebauer
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- Copper Interconnects and Reliability 8
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- Semiconductor materials and interfaces 4
- Condensed Matter Physics top 5%
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- 3D IC and TSV technologies 16
- Electronic Packaging and Soldering Technologies 13
- Semiconductor materials and devices 12
- Advancements in Semiconductor Devices and Circuit Design 7
- VLSI and FPGA Design Techniques 5
- Advanced Memory and Neural Computing 5
- Ceramics and Composites top 10%
C. A. Neugebauer
48 papers receiving 1.8k citations
Hit Papers
Peers
Comparison fields: 5 of 72
- Electronic, Optical and Magnetic Materials 536
- Atomic and Molecular Physics, and Optics 678
- Condensed Matter Physics 233
- Electrical and Electronic Engineering 1.1k
- Ceramics and Composites 94
Countries citing papers authored by C. A. Neugebauer
This map shows the geographic impact of C. A. Neugebauer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. A. Neugebauer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. A. Neugebauer more than expected).
Fields of papers citing papers by C. A. Neugebauer
This network shows the impact of papers produced by C. A. Neugebauer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. A. Neugebauer. The network helps show where C. A. Neugebauer may publish in the future.
Co-authorship network
The 20 scholars most cited alongside C. A. Neugebauer, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 1 | |
| 2 | 2002 | 4 | |
| 3 | 2002 | 3 | |
| 4 | 1987 | 39 | |
| 5 | The Packaging of power semiconductor devices | 1986 | 15 |
| 6 | 1986 | 19 | |
| 7 | 1979 | 0 | |
| 8 | 1977 | 1 | |
| 9 | 1976 | 39 | |
| 10 | 1975 | 37 | |
| 11 | 1972 | 6 | |
| 12 | 1972 | 17 | |
| 13 | 1971 | 42 | |
| 14 | 1970 | 54 | |
| 15 | 1967 | 17 | |
| 16 | 1964 | 30 | |
| 17 | Structure and Properties of Thin Filmsbreakdown → | 1962 | 405 |
| 18 | 1960 | 10 | |
| 19 | 1959 | 22 | |
| 20 | 1957 | 4 |
About C. A. Neugebauer
C. A. Neugebauer is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Condensed Matter Physics, having authored 49 papers that have together received 2.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (13 papers), Semiconductor materials and devices (12 papers), Copper Interconnects and Reliability (8 papers), Advancements in Semiconductor Devices and Circuit Design (7 papers), VLSI and FPGA Design Techniques (5 papers), Advanced Memory and Neural Computing (5 papers) and Semiconductor materials and interfaces (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (536 citations), Atomic and Molecular Physics, and Optics (678 citations) and Condensed Matter Physics (233 citations). C. A. Neugebauer has collaborated with scholars based in United States, Switzerland and India. Frequent co-authors include M. B. Webb, D. A. Vermilyea, J. B. Newkirk, S. H. Bauer, James Burgess, R. O. Carlson, John L. Margrave, George Flanagan, Joseph L. Mundy and R. A. Sigsbee.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.